JPH04337697A - Manufacture of flexible rigid circuit board - Google Patents
Manufacture of flexible rigid circuit boardInfo
- Publication number
- JPH04337697A JPH04337697A JP11024491A JP11024491A JPH04337697A JP H04337697 A JPH04337697 A JP H04337697A JP 11024491 A JP11024491 A JP 11024491A JP 11024491 A JP11024491 A JP 11024491A JP H04337697 A JPH04337697 A JP H04337697A
- Authority
- JP
- Japan
- Prior art keywords
- flexible
- rigid
- flexible substrate
- substrate
- polyimide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000000853 adhesive Substances 0.000 claims abstract description 29
- 230000001070 adhesive effect Effects 0.000 claims abstract description 29
- 229920001721 polyimide Polymers 0.000 claims abstract description 22
- 239000012790 adhesive layer Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims description 66
- 239000012787 coverlay film Substances 0.000 claims description 18
- 239000011888 foil Substances 0.000 abstract description 8
- 239000010410 layer Substances 0.000 abstract description 6
- 230000008602 contraction Effects 0.000 abstract description 2
- 238000007747 plating Methods 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、フレキシブル基板とリ
ジッド基板とが接続されたフレキシブルリジッド配線板
の製造方法に関し、より詳しくは、寸法安定性に優れた
フレキシブルリジッド配線板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a flexible rigid wiring board in which a flexible substrate and a rigid substrate are connected, and more particularly to a method for manufacturing a flexible rigid wiring board with excellent dimensional stability.
【０００２】0002
【従来の技術】近年、エレクトロニクス製品の軽量化、
小型化、高機能化に伴い、プリント基板の需要が多くな
り、中でもフレキシブル基板は、その可撓性により任意
の方向に配線を施すことができる利点がある。しかし、
プリント基板は極めて薄いため、電子部品の取り付けが
複雑であり、また、実装できる電子部品が制限される。
このため、プリント基板の中でも電子部品取り付けの機
能に比較的優れたリジッド基板と配線の自由度が大きい
フレキシブル基板とを組み合わせた構造のフレキシブル
リジッド配線板が用いられている。[Background Art] In recent years, the weight of electronic products has been reduced,
As printed circuit boards become smaller and more sophisticated, there is an increasing demand for printed circuit boards, and flexible circuit boards have the advantage of being able to be wired in any direction due to their flexibility. but,
Printed circuit boards are extremely thin, making mounting electronic components complicated and limiting the types of electronic components that can be mounted. For this reason, among printed circuit boards, flexible rigid wiring boards are used, which have a structure that combines a rigid board, which has a relatively excellent function for mounting electronic components, and a flexible board, which has a large degree of freedom in wiring.
【０００３】図１はフレキシブルリジッド配線板の一例
を示したものであり、このフレキシブルリジッド配線板
は、２枚のリジッド基板１，１の間にフレキシブル基板
５を挟んで構成されている。図２はこのフレキシブルリ
ジッド配線板の分解斜視図を示したものである。フレキ
シブルリジッド配線板は、通常次のように構成されてい
る。フレキシブル基板５に回路パターン６をを形成した
後、この回路パターン６を保護するためにカバーレイフ
ィルム４を熱圧着する。次に片面全面に導電箔２が形成
された２枚のリジッド基板１，１を導電箔２を外側にし
て接着シート３を介してフレキシブル基板５を挟み込ん
で全体を熱圧着する。その後、図１に示すようにリジッ
ド基板１、接着シート３、カバーレイフィルム４、フレ
キシブル基板５を貫通するスルーホール孔７およびスル
ーホールめっき層８を形成し、さらにリジッド基板１の
導電箔２をパターンエッチングして回路パターン９を形
成する。これによりリジッド基板１の回路パターン９と
フレキシブル基板５の回路パターン６とは、スルーホー
ルめっき層８により電気的に接続される。その後、所定
のサイズにカットすると、図１に示すようなフレキシブ
ル配線板を得ることができる。FIG. 1 shows an example of a flexible rigid wiring board, and this flexible rigid wiring board is constructed by sandwiching a flexible substrate 5 between two rigid substrates 1, 1. FIG. 2 shows an exploded perspective view of this flexible rigid wiring board. A flexible rigid wiring board is usually configured as follows. After forming the circuit pattern 6 on the flexible substrate 5, a coverlay film 4 is thermocompression bonded to protect the circuit pattern 6. Next, two rigid substrates 1, 1 each having a conductive foil 2 formed on the entire surface of one side are sandwiched with a flexible substrate 5 with the conductive foil 2 on the outside via an adhesive sheet 3, and the whole is bonded by thermocompression. Thereafter, as shown in FIG. 1, through-hole holes 7 and through-hole plating layers 8 are formed to penetrate the rigid substrate 1, adhesive sheet 3, coverlay film 4, and flexible substrate 5, and the conductive foil 2 of the rigid substrate 1 is then formed. A circuit pattern 9 is formed by pattern etching. Thereby, the circuit pattern 9 of the rigid board 1 and the circuit pattern 6 of the flexible board 5 are electrically connected by the through-hole plating layer 8. Thereafter, by cutting into a predetermined size, a flexible wiring board as shown in FIG. 1 can be obtained.
【０００４】0004
【発明が解決しようとする課題】上記製造方法において
、フレキシブル基板５の回路パターン６を保護するため
にカバーレイフィルム４を熱圧着する際の温度は、カバ
ーレイフィルム４をフレキシブル基板５に充分接着させ
るために１９０〜２３０℃で行われていた。しかし、こ
のような温度でカバーレイフィルム４とフレキシブル基
板５とを熱圧着すると、フレキシブル基板５の寸法収縮
が起こっていた。そのためリジッド基板１に形成された
回路パターン９とフレキシブル基板５に形成された回路
パターン６とが位置ずれを起こし、その結果、スルーホ
ール孔７を設ける際に断線等を生じ、配線板の歩留りが
低下するという問題があった。この問題は、ファインパ
ターン化および大型サイズの配線基板の製造においては
特に顕著であった。[Problems to be Solved by the Invention] In the above manufacturing method, the temperature at which the coverlay film 4 is thermocompression bonded to protect the circuit pattern 6 of the flexible substrate 5 is set such that the coverlay film 4 is sufficiently bonded to the flexible substrate 5. It was carried out at 190 to 230°C to achieve this. However, when the coverlay film 4 and the flexible substrate 5 are thermocompression bonded at such a temperature, the flexible substrate 5 undergoes dimensional shrinkage. As a result, the circuit pattern 9 formed on the rigid substrate 1 and the circuit pattern 6 formed on the flexible substrate 5 may be misaligned, and as a result, wire breakage may occur when forming the through-hole hole 7, and the yield of the wiring board may be reduced. There was a problem with the decline. This problem was particularly noticeable in fine patterning and manufacturing of large-sized wiring boards.
【０００５】本発明は、上記の点を解決しようとするも
ので、その目的は、寸法安定性に優れたフレキシブルリ
ジット配線板の製造方法を提供することにある。The present invention aims to solve the above-mentioned problems, and its object is to provide a method for manufacturing a flexible rigid wiring board with excellent dimensional stability.
【０００６】[0006]
【課題を解決するための手段】本発明は、カバーレイフ
ィルムで覆われたフレキシブル基板とリジッド基板とが
接着シートを介して熱圧着され、スルーホールによって
フレキシブル基板とリジット基板の回路が電気的に接続
された構造のフレキシブルリジット配線板の製造方法に
おいて、フレキシブル基板に回路パターンを形成した後
、片面に接着剤層が設けられたポリイミドフィルムから
なるカバーレイフィルムを該フレキシブル基板の回路パ
ターン上に積層して８０〜１６０℃で熱圧着し、さらに
リジッド基板を接着シートを介して該ポリイミドフィル
ムに積層し、１６０〜２３０℃で熱圧着することを特徴
とするフレキシブルリジット配線板の製造方法に関する
。次に本発明を詳しく説明する。[Means for Solving the Problems] In the present invention, a flexible substrate covered with a coverlay film and a rigid substrate are bonded together by thermocompression via an adhesive sheet, and the circuits of the flexible substrate and the rigid substrate are electrically connected by through holes. In a method for manufacturing a flexible rigid wiring board with a connected structure, after forming a circuit pattern on a flexible substrate, a coverlay film made of a polyimide film provided with an adhesive layer on one side is laminated on the circuit pattern of the flexible substrate. The present invention relates to a method for manufacturing a flexible rigid wiring board, characterized in that the polyimide film is laminated with a rigid substrate via an adhesive sheet and thermocompression bonded at 160 to 230C. Next, the present invention will be explained in detail.
【０００７】まず、フレキシブル基板上に通常の方法に
より回路パターンを形成する。その後、この回路パター
ンを保護するためにカバーレイフィルムを熱圧着させる
。First, a circuit pattern is formed on a flexible substrate by a conventional method. Thereafter, a coverlay film is thermocompression bonded to protect this circuit pattern.
【０００８】本発明においては、カバーレイフィルムと
して片面に接着剤層が設けられたポリイミドフィルムを
使用する。これは、フレキシブル基板の熱圧着による寸
法収縮を抑えることができる温度で接着強度良好に熱圧
着することができる材質であることが必要とするからで
ある。In the present invention, a polyimide film provided with an adhesive layer on one side is used as the coverlay film. This is because the material needs to be capable of thermocompression bonding with good adhesive strength at a temperature that can suppress dimensional shrinkage due to thermocompression bonding of the flexible substrate.
【０００９】本発明において、フレキシブル基板に上記
の片面に接着剤層が設けられたポリイミドフィルムを熱
圧着する際の温度は８０〜１６０℃である。熱圧着温度
が８０℃未満の場合、フレキシブル基板と片面接着剤ポ
リイミドフィルムとを良好に接着させるには不充分であ
り、一方、熱圧着温度が１６０℃を超える場合には、フ
レキシブル基板に生じる寸法収縮が大きい。従って、こ
の温度範囲で熱圧着することによりフレキシブル基板の
寸法収縮を極力抑えながら、片面に接着剤層が設けられ
たポリイミドフィルムを接着させることができる。[0009] In the present invention, the temperature at which the above-mentioned polyimide film having an adhesive layer provided on one side is thermocompression bonded to the flexible substrate is 80 to 160°C. If the thermocompression bonding temperature is less than 80°C, it is insufficient for good adhesion between the flexible substrate and the single-sided adhesive polyimide film, while if the thermocompression bonding temperature exceeds 160℃, the size of the flexible substrate will be reduced. Large contraction. Therefore, by thermocompression bonding in this temperature range, a polyimide film having an adhesive layer provided on one side can be bonded while minimizing dimensional shrinkage of the flexible substrate.
【００１０】次に片面に導電箔が形成された２枚のリジ
ッド基板を導電箔を、外側にして接着シートを介して上
記フレキシブル基板を挟み込むようにして熱圧着する。
フレキシブル基板と片面接着剤ポリイミドフィルムとの
熱圧着工程では、フレキシブル基板に熱圧着する際の温
度を１６０〜２３０℃にすることにより、フレキシブル
基板と片面接着剤ポリイミドフィルムとの接着強度を上
げる。熱圧着温度が１６０℃未満の場合、フレキシブル
基板と片面接着剤ポリイミドフィルムの接着強度を上げ
るには不充分であり、一方、熱圧着温度が２３０℃を超
える場合には、フレキシブル基板に生じる寸法収縮が大
きい。Next, two rigid substrates each having a conductive foil formed on one side are thermocompression bonded with the conductive foil facing outside and sandwiching the flexible substrate with an adhesive sheet interposed therebetween. In the thermocompression bonding process of the flexible substrate and the one-sided adhesive polyimide film, the adhesive strength between the flexible substrate and the one-sided adhesive polyimide film is increased by setting the temperature during thermocompression bonding to the flexible substrate to 160 to 230°C. If the thermocompression bonding temperature is less than 160℃, it is insufficient to increase the adhesive strength between the flexible substrate and the single-sided adhesive polyimide film, while if the thermocompression bonding temperature exceeds 230℃, dimensional shrinkage occurs in the flexible substrate. is large.
【００１１】上記の温度範囲はフレキシブル基板と片面
接着剤ポリイミドフィルムの熱融着温度よりも高温であ
るが、フレキシブル基板は片面に接着剤層が設けられた
ポリイミドフィルムとの熱圧着時に一旦加熱されて寸法
収縮し難くなっているので、フレキシブル基板の大きい
寸法収縮は生じない。[0011] The above temperature range is higher than the thermal fusion temperature of the flexible substrate and the polyimide film with an adhesive layer on one side. Therefore, the flexible substrate does not undergo large dimensional shrinkage.
【００１２】次に常方にて、リジッド基板、接着シート
、片面接着剤ポリイミドフィルム、フレキシブル基板を
貫通させてスルーホール孔を形成後、スルーホールめっ
き層を形成し、リジッド基板の導電箔をパターンエッチ
ングすることによりフレキシブルリジッド配線板を製造
することができる。[0012] Next, in the usual way, after forming through-hole holes through the rigid substrate, adhesive sheet, single-sided adhesive polyimide film, and flexible substrate, a through-hole plating layer is formed, and the conductive foil of the rigid substrate is patterned. A flexible rigid wiring board can be manufactured by etching.
【００１３】本発明において、使用するポリイミドフィ
ルムの片面に設けられた接着剤層は、熱硬化型耐熱性接
着剤であり、接着強度が高く、かつ半田などの使用に耐
える耐熱性を有する接着剤を用いて形成することができ
る。このような接着剤としては、例えば、エポキシ樹脂
、ＮＢＲ−フェノール系樹脂、フェノール−ブチラール
樹脂、エポキシ−ＮＢＲ系樹脂、エポキシ−フェノール
系樹脂、エポキシ−ナイロン系樹脂、エポキシ−ポリエ
ステル系樹脂、エポキシ−アクリル系樹脂、アクリル系
樹脂、ポリアミド−エポキシ−フェノール系樹脂、ポリ
イミド系樹脂、シリコーン系樹脂等が挙げられる。[0013] In the present invention, the adhesive layer provided on one side of the polyimide film used is a thermosetting heat-resistant adhesive, which has high adhesive strength and heat resistance that can withstand use with soldering. It can be formed using Examples of such adhesives include epoxy resin, NBR-phenol resin, phenol-butyral resin, epoxy-NBR resin, epoxy-phenol resin, epoxy-nylon resin, epoxy-polyester resin, and epoxy-polyester resin. Examples include acrylic resin, acrylic resin, polyamide-epoxy-phenol resin, polyimide resin, silicone resin, and the like.
【００１４】また本発明で使用される接着シートとして
は、従来公知のものを使用することができる。Furthermore, as the adhesive sheet used in the present invention, conventionally known adhesive sheets can be used.
【００１５】[0015]
【作用】フレキシブル基板にカバーレイフィルムとして
片面に接着剤層が設けられたポリイミドフィルムを用い
て８０〜１６０℃で熱圧着することにより、フレキシブ
ル基板の寸法収縮を抑えて片面接着剤フィルムを接着す
ることができる。さらにリジッド基板を１６０〜２３０
℃で前記フレキシブル基板に熱圧着することにより、フ
レキシブル基板と前記の片面に接着剤層が設けられたポ
リイミドフィルムとの接着強度を上げる。このとき、フ
レキシブル基板は片面に接着剤層が設けられたポリイミ
ドフィルムとの熱圧着時に比べ高温で加熱されることに
なるが、一旦加熱されたフレキシブル基板は寸法収縮さ
れ難くなっているので、大きい寸法収縮生じることはな
い。[Operation] By thermocompressing a polyimide film with an adhesive layer on one side as a coverlay film to a flexible substrate at 80 to 160°C, the dimensional shrinkage of the flexible substrate is suppressed and the single-sided adhesive film is bonded. be able to. Furthermore, the rigid board is 160~230
By thermocompression bonding to the flexible substrate at .degree. C., the adhesive strength between the flexible substrate and the polyimide film provided with an adhesive layer on one side is increased. At this time, the flexible substrate is heated at a higher temperature than when it is thermocompression bonded to a polyimide film with an adhesive layer on one side, but once heated, the flexible substrate is difficult to shrink in size, so No dimensional shrinkage occurs.
【００１６】[0016]
【実施例】次に本発明を実施例および比較例を挙げて説
明する。[Examples] Next, the present invention will be explained with reference to Examples and Comparative Examples.
【００１７】参考例１〜８
表１に示すように、フレキシブル基板とカバーレイフィ
ルムとの熱圧着を８０〜２３０℃で行い、熱圧着前後の
フレキシブル基板の寸法収縮率と熱圧着後のフレキシブ
ル基板とカバーレイフィルムとの接着強度を測定した。
カバーレイフィルムは、ポリイミドフィルムの片面にエ
ポキシ樹脂層が設けられているものを用いた。その結果
を表１に示す。Reference Examples 1 to 8 As shown in Table 1, thermocompression bonding between a flexible substrate and a coverlay film was carried out at 80 to 230°C, and the dimensional shrinkage rate of the flexible substrate before and after thermocompression bonding and the flexible substrate after thermocompression bonding were determined. The adhesion strength between the film and the coverlay film was measured. The coverlay film used was a polyimide film with an epoxy resin layer provided on one side. The results are shown in Table 1.
【００１８】[0018]
【表１】[Table 1]
【００１９】実施例１〜９
表２に示すように、フレキシブル基板とカバーレイフィ
ルムとの熱圧着を８０〜１６０℃で行った以外は参考例
１と同様に行い、その後、接着シートを介してリジッド
基板を１９０〜２３０℃で熱圧着を行いフレキシブルリ
ジッド基板を得た。得られたフレキシブルリジッド基板
におけるフレキシブル基板の寸法収縮率、接着強度を参
考例１と同様にして測定した。その結果を表２に示す。Examples 1 to 9 As shown in Table 2, the process was carried out in the same manner as in Reference Example 1, except that the flexible substrate and the coverlay film were bonded by thermocompression at 80 to 160°C. The rigid substrate was thermocompressed at 190 to 230° C. to obtain a flexible rigid substrate. The dimensional shrinkage rate and adhesive strength of the obtained flexible rigid substrate were measured in the same manner as in Reference Example 1. The results are shown in Table 2.
【００２０】[0020]
【表２】[Table 2]
【００２１】比較例１〜９
表３に示すように、フレキシブル基板とカバーレイフィ
ルムとの熱圧着を１９０〜２３０℃で行った以外は参考
例１と同様に行い、その後、接着シートを介してリジッ
ド基板を１９０〜２３０℃で熱圧着を行いフレキシブル
リジッド基板を得た。得られたフレキシブルリジッド基
板におけるフレキシブル基板の寸法収縮率、接着強度を
参考例１と同様にして測定した。その結果を表３に示す
。Comparative Examples 1 to 9 As shown in Table 3, the process was carried out in the same manner as in Reference Example 1, except that the flexible substrate and the coverlay film were bonded by thermocompression at 190 to 230°C. The rigid substrate was thermocompressed at 190 to 230° C. to obtain a flexible rigid substrate. The dimensional shrinkage rate and adhesive strength of the obtained flexible rigid substrate were measured in the same manner as in Reference Example 1. The results are shown in Table 3.
【００２２】[0022]
【表３】[Table 3]
【００２３】表１〜３より、実施例１〜９で得られたフ
レキシブルリジッド基板は寸法収縮率が非常に少なく、
かつ接着強度が良好であることがわかる。From Tables 1 to 3, the flexible rigid substrates obtained in Examples 1 to 9 had very small dimensional shrinkage rates;
It can also be seen that the adhesive strength is good.
【００２４】[0024]
【発明の効果】以上の説明で明らかように、本発明のフ
レキシブルリジッド配線板の製造方法によれば、接着強
度が良好で、かつフレキシブル基板の寸法収縮を抑えた
寸法安定性の良好なフレキシブルリジッド配線板を提供
することが可能で、特に、ファインパターンや大型サイ
ズの配線板の製造に適している。[Effects of the Invention] As is clear from the above explanation, according to the method for manufacturing a flexible rigid wiring board of the present invention, a flexible rigid wiring board with good adhesive strength and dimensional stability that suppresses dimensional shrinkage of the flexible board can be produced. It is possible to provide wiring boards, and is particularly suitable for manufacturing fine pattern and large-sized wiring boards.
【図１】フレキシブルリジッド配線板の断面図である。FIG. 1 is a sectional view of a flexible rigid wiring board.
【図２】フレキシブルリジッド配線板の分解斜視図であ
る。FIG. 2 is an exploded perspective view of a flexible rigid wiring board.
１ リジッド基板 ２ 導電箔 ３ 接着シート ４ カバーレイフィルム ５ フレキシブル基板 ６ 回路パターン ７ スルーホール孔 ８ スルーホールめっき層 ９ 回路パターン 1 Rigid board 2 Conductive foil 3 Adhesive sheet 4 Coverlay film 5 Flexible board 6 Circuit pattern 7 Through hole hole 8 Through-hole plating layer 9 Circuit pattern
Claims (1)
シブル基板と、リジッド基板とが接着シートを介して熱
圧着され、スルーホールによってフレキシブル基板とリ
ジッド基板の回路が電気的に接続された構造のフレキシ
ブルリジッド配線板の製造方法において、フレキシブル
基板に回路パターンを形成した後、片面に接着剤層が設
けられたポリイミドフィルムからなるカバーレイフィル
ムを該フレキシブル基板の回路パターン上に積層して８
０〜１６０℃で熱圧着し、さらにリジッド基板を接着シ
ートを介して該ポリイミドフィルムに積層し、１６０〜
２３０℃で熱圧着することを特徴とするフレキシブルリ
ジッド配線板の製造方法。Claim 1: A flexible rigid structure in which a flexible substrate covered with a coverlay film and a rigid substrate are bonded by thermocompression via an adhesive sheet, and the circuits of the flexible substrate and the rigid substrate are electrically connected by through holes. In the method for manufacturing a wiring board, after forming a circuit pattern on a flexible substrate, a coverlay film made of a polyimide film provided with an adhesive layer on one side is laminated on the circuit pattern of the flexible substrate.
Thermocompression bonding is carried out at 0 to 160°C, and a rigid substrate is further laminated to the polyimide film via an adhesive sheet.
A method for manufacturing a flexible rigid wiring board characterized by thermocompression bonding at 230°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11024491A JPH04337697A (en) | 1991-05-15 | 1991-05-15 | Manufacture of flexible rigid circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11024491A JPH04337697A (en) | 1991-05-15 | 1991-05-15 | Manufacture of flexible rigid circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04337697A true JPH04337697A (en) | 1992-11-25 |
Family
ID=14530766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11024491A Pending JPH04337697A (en) | 1991-05-15 | 1991-05-15 | Manufacture of flexible rigid circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04337697A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0750454A (en) * | 1993-06-03 | 1995-02-21 | Internatl Business Mach Corp <Ibm> | Flexible circuit board |
-
1991
- 1991-05-15 JP JP11024491A patent/JPH04337697A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0750454A (en) * | 1993-06-03 | 1995-02-21 | Internatl Business Mach Corp <Ibm> | Flexible circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8178191B2 (en) | Multilayer wiring board and method of making the same | |
| US5719354A (en) | Monolithic LCP polymer microelectronic wiring modules | |
| JP3059568B2 (en) | Method of manufacturing multilayer printed circuit board | |
| US20090229862A1 (en) | Multilayer printed wiring board and method of manufacturing the same | |
| JPWO2007046459A1 (en) | Multilayer printed wiring board and manufacturing method thereof | |
| WO2018097112A1 (en) | Multilayer substrate, structure for mounting multilayer substrate to circuit board, method for mounting multilayer substrate, and method for producing multilayer substrate | |
| JP4363947B2 (en) | Multilayer wiring circuit board and method for manufacturing the same | |
| JPH04337697A (en) | Manufacture of flexible rigid circuit board | |
| GB2080729A (en) | A multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion and method for making same. | |
| JPH0359597B2 (en) | ||
| JP4892924B2 (en) | Multilayer printed wiring board and manufacturing method thereof | |
| JPH11112147A (en) | Multilayered printed wiring board | |
| JPH02164096A (en) | Multilayer electronic circuit board and its manufacture | |
| JPH0446479B2 (en) | ||
| JP2000208946A (en) | Multilayer wiring board and manufacture thereof | |
| JPS63199636A (en) | Laminated board | |
| JP4684483B2 (en) | Multilayer circuit board manufacturing method | |
| JP4200848B2 (en) | Printed circuit board and manufacturing method thereof | |
| JPH01151293A (en) | Method for conducting inner layer of multilayer printed wiring board | |
| JP2003060354A (en) | Printed circuit board with built-in component and manufacturing method therefor | |
| JP2007134509A (en) | Multilayer printed wiring board and method of manufacturing same | |
| JP2002076557A (en) | Circuit wiring board and multilayer circuit wiring board using the same as well as its manufacturing method | |
| JP2514667B2 (en) | Method for manufacturing multilayer substrate | |
| JPH0521960A (en) | Multilayered printed circuit board and manufacture thereof | |
| JPS60236278A (en) | Plate for circuit |