JP2002076557A - Circuit wiring board and multilayer circuit wiring board using the same as well as its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit wiring board capable of satisfying electrical connecting reliability. SOLUTION: The circuit wiring board comprises a metal layer 2 having a plurality of first through holes 2a formed at a predetermined interval in a thickness direction, insulating resin layers 3 made of insulating resins laminated on both side surfaces of the layer 2 to cover both side surfaces of the layer 2 by heating and pressurizing and to close inner peripheral surfaces of the first through holes 2a, and electrical circuit wirings 4 formed on both side surfaces of the layers 3. Second through holes 1a smaller than the first holes 2a are substantially concentrically provided at a part of the layer 3 for closing the holes 2a, and the wirings 4 formed on both side surfaces of the layer 3 are conducted by utilizing the holes 1a. An elastic modulus of the insulating layer is 7 MPa or less at a temperature for laminating, heating and pressurizing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a circuit wiring board, a multilayer circuit wiring board using the same, and a method of manufacturing the same.

[0002]

2. Description of the Related Art With the recent miniaturization and high performance of electronic devices, semiconductor devices constituting electronic devices and methods for mounting the same have been required to be small, thin, high performance, and high reliability. I have. In response to these demands, semiconductor elements have become larger while being highly integrated. In addition, a method has been put to practical use in which unpackaged bare semiconductor elements (bare chips) are directly mounted at high density on a printed circuit board.

In the bare chip mounting of such a large element, a silicon chip having a coefficient of thermal expansion of 3 to 4 ppm / ° C. is usually bonded directly to a printed circuit board having a coefficient of thermal expansion of 10 to 20 ppm / ° C. via an adhesive. Connected. In addition, electrical conduction is achieved not only by conventional metal wires but also by shorter conductive paths by metal bump electrodes formed on the silicon chip. However, at this time, there is a problem that stress is generated in the connection portion due to a difference in thermal expansion between the silicon chip and the printed circuit board, and connection reliability is reduced. Further, the stress generated due to the difference in thermal expansion causes cracks in the adhesive, causing problems such as a decrease in moisture resistance and breakage of terminal electrical connection portions. In addition, these differences in thermal expansion also cause warpage of the structure after lamination of the silicon chip and the printed circuit board.

[0004] In order to solve such a problem, a method of optimizing the material, structure and arrangement of the metal bump electrodes on the silicon chip or various physical properties of the adhesive and aiming at diffusion of stress has been implemented. However, even with these methods, the connection reliability is not sufficient, and in the future silicon chips will become larger and higher density connections will be required due to differences in the coefficient of thermal expansion between printed circuit boards and silicon chips. The problem of stress is more severe.

[0005] In order to drastically solve the above problem, Japanese Patent Application Laid-Open No. 11-163522 discloses a double-sided circuit board 50 in which a metal foil 51 having a low linear expansion coefficient is provided as a core material. An invention has been proposed in which the thermal expansion of the double-sided circuit board 50 is made close to that of a silicon chip (not shown) (see FIG. 29).

In the present invention, in the manufacturing process of the double-sided circuit board 50, first, a metal foil 51 having a through hole 51a formed at a position corresponding to the through-hole plating portion 52 is prepared (see FIG. 30). Next, a conductor layer 54a is laminated by heating and pressing on both surfaces of the metal foil 51 while filling the through holes 51a via an insulating resin 53 such as a polyimide-based adhesive. Next, a through hole 55 having a diameter slightly smaller than the diameter of the through hole 51a is formed at the position of the through hole 51a (see FIG. 29), and the inner peripheral surface of the through hole 55 is plated with copper to form a through hole plated portion 52. , This through-hole plated part 5
2, the conductive layers 54a on both surfaces are conducted in the thickness direction. After that, the circuit 54 was formed on the conductor layers 54a on both surfaces. In FIG. 30, reference numeral 56 denotes an insulating resin layer formed on the back surface of the conductor layer 54a.

[0007] Alternatively, as shown in FIG.
The through holes 51 are formed on both sides of the metal foil 51 on which the metal foil 1a is formed.
a while filling the insulating resin 5 such as a polyimide adhesive.
3 is press-laminated, and a through hole 55 having a diameter slightly smaller than that of the through hole 51a is formed at the position of the through hole 51a, and a metal material 57 is filled into the through hole 55. ) Can be bonded to make conductive layers on both sides conductive in the thickness direction. In FIG. 31, reference numeral 54 denotes a circuit formed on a conductor layer. In the latter method, when a multilayer circuit board is manufactured by stacking a plurality of double-sided circuit boards 50, the degree of freedom in designing the position of the conductive path for conducting the stacked double-sided circuit boards 50 in the thickness direction is limited to the former method. Higher and suitable as a high-density wiring board structure.

[0008]

However, in the above-described manufacturing process, when the insulating resin 53 is press-laminated on both sides of the metal foil 51 having the through-holes 51a formed therein, the insulating resin 53 is pressed through the through-hole 51a. It is necessary to obtain a flat surface while securely filling the holes 51a. If the filling of the through-holes 51a is not sufficient, a short-circuit with the metal foil 51 occurs when the through-holes 55 are later plated with copper or filled with the metal material 57. There is. In the latter method, the insulating resin 5 is used.
No. 3 needs to exhibit sufficient adhesive strength when bonding the conductor layer 54a after the press laminating step. On the other hand, in the latter method, a metal material 5
7 to form an electrical conduction path in the thickness direction.
Heat resistance at a curing temperature of 7 is required. Moreover, since electronic components are mounted on such a double-sided circuit board 50 by solder mounting, the insulating resin 53 is required to have heat resistance at the melting temperature (reflow) of the solder, It is necessary to secure the dimensional stability of the metal material 54a and the metal material 57 in the plane direction and the thickness direction, and to satisfy the electrical connection reliability as a circuit board.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a circuit wiring board capable of satisfying electrical connection reliability, a multilayer circuit wiring board using the same, and a method of manufacturing the same. I do.

[0010]

In order to achieve the above-mentioned object, the present invention provides a metal layer having a plurality of first through holes formed in a thickness direction at a predetermined interval; An insulating resin layer made of the insulating resin, which covers both surfaces of the metal layer by laminating insulating resins on both surfaces and applying heat and pressure, and closing the inner peripheral surface of the first through hole;
A second through hole smaller than the through hole is provided substantially concentrically in a portion of the insulating resin layer that closes the first through hole, the second through hole comprising electric circuit wiring formed on both surfaces of the insulating resin layer. A circuit wiring board which electrically connects electric circuit wirings formed on both surfaces of the insulating resin layer using the second through-holes, wherein the elastic modulus of the insulating resin is at a temperature at which the laminate is heated and pressed. A first aspect of the present invention is a circuit wiring board having a pressure of 7 MPa or less. The circuit wiring board is opposed at a predetermined position, is laminated via an insulating adhesive layer in that state, and is electrically conductive at a predetermined position of the insulating adhesive layer. A second aspect is a multi-layer circuit wiring board in which a path is formed and the electric circuit wiring of the opposing circuit wiring board is conducted in the thickness direction by the conductive path. wiring A step of preparing an insulating adhesive layer disposed between the plates, a step of forming a through hole at a predetermined position of the insulating adhesive layer, and a step of filling a metal material into the through hole of the insulating adhesive layer A third gist of the present invention is a method for manufacturing a multilayer circuit wiring board, comprising: a step of collectively stacking the plurality of circuit wiring boards via an insulating adhesive layer in which a metal material is filled in the through hole.

The present inventors have conducted a series of studies to obtain a circuit wiring board which can satisfy the electrical connection reliability. As a result, the present inventors have found that laminating an insulating resin on both surfaces of a metal layer and applying heat and pressure respectively. As an insulating resin layer made of the above-mentioned insulating resin, which covers both surfaces of the metal layer and closes the inner peripheral surface of the first through hole of the metal layer, the elastic modulus of itself is 7 MPa or less at a temperature at which the laminate is heated and pressed. The inventors have found that the use of an insulating resin layer can satisfy the electrical connection reliability as a circuit wiring board, and have reached the present invention. That is, in the circuit wiring board of the present invention, since the insulating resin layer described above is used, when the insulating resin constituting the same is press-laminated on both sides of the metal layer, the insulating resin forms the first through hole with both sides of the metal layer. The inner peripheral surface of the hole can be reliably insulated. In addition, even when the conductor layers are bonded after the press laminating step, the insulating resin is re-melted, and sufficient adhesive strength can be exhibited. Further, the curing temperature of a metal material used to form a thickness-direction electrical conduction path in the insulating resin layer, the temperature at which a conductor layer for electric circuit wiring is laminated on the insulating resin layer, The dimensional change due to the thermal expansion and contraction of the insulating resin layer at the temperature at which the insulating layer is laminated and at the solder reflow temperature at the time of mounting the electronic component can be suppressed by the metal layer. Therefore, it is possible to provide a circuit wiring board with higher electrical connection reliability by suppressing warping of the circuit wiring board and deformation of the electric conduction path in the thickness direction and stabilizing the circuit connection position.

Further, the multilayer circuit wiring board of the present invention uses the above-mentioned circuit wiring board, and has the above-mentioned excellent effects. Further, according to the method for manufacturing a multilayer circuit wiring board of the present invention,
A multilayer circuit wiring board exhibiting the above-described excellent effects can be manufactured.

Next, the present invention will be described in detail.

The circuit wiring board according to the present invention comprises a metal layer serving as a core, an electric circuit wiring, and an insulating resin layer.

As the metal layer, Fe, Ni, Cr,
Cu, Al, Ti, Co or alloy foils containing these can be used. In order to suppress the difference in the coefficient of thermal expansion between the silicon chip and the circuit board, a particularly low coefficient of thermal expansion (20 to 250) is used.
(In the range of 20 ° C / ° C or less). These metal foils can be used alone or in a laminated form.

In the case of an Fe—Ni alloy foil, Fe
The coefficient of thermal expansion differs depending on the component ratio of Ni and Ni. In the present invention, the Ni content (% by weight) is 31 to 50% by weight,
Preferably, a range of 31 to 45% by weight is suitably used. If it is larger or smaller than this range, the coefficient of thermal expansion on the circuit board side is large, and the difference in coefficient of thermal expansion between the silicon chip and the circuit board cannot be suppressed. The low thermal expansion metal foil has a thickness of 10 to 500 μm, preferably 20 to 500 μm.
The range of -200 µm is good. If the thickness is smaller than this, the difference in thermal expansion coefficient between the silicon chip and the circuit board cannot be suppressed. If the thickness is larger than this, for example, 30
Fine pores of 0 μm or less cannot be easily formed, making it difficult to form a high-density circuit, and making the circuit board heavier in terms of weight, thereby limiting applications.

Means for forming a through hole in the metal layer include, for example, a drill, a punch, a laser, and a chemical etching.

The insulating resin constituting the insulating resin layer is melted by heating and pressing at a temperature not lower than its glass transition temperature but not higher than the thermal decomposition temperature, and is laminated on a metal layer in which a first through-hole is formed in advance. In addition, it is necessary to fill the first through hole. As such an insulating resin, an adhesive sheet of a polyimide type, a polyamide type, a polyetherimide type, an epoxy type, a silicone type or a mixture type thereof is preferably used from the viewpoint of heat resistance, electric characteristics and the like. Or
It is also preferable to use a polyester-based thermoplastic liquid crystal polymer film having low moisture absorption.

Further, since the first through holes of the metal layer set in the above thickness range are filled, the elastic modulus at the lamination temperature is 7
An insulating resin designed to be equal to or less than MPa, preferably equal to or less than 3 MPa is used. The elastic modulus is measured using a viscoelastic spectrometer (SDM / 5600 manufactured by Seiko Instruments Inc.). The measurement conditions were as follows: heating: 5 ° C./min, frequency: 1
0 Hz, sample width: 10 mm, thickness: 50 μm, distance between chucks: 20 mm. The lamination temperature is not particularly limited, but since solder is used for mounting electronic components on a circuit board, an insulating resin having the above elastic modulus at 180 ° C or higher, preferably 200 ° C or higher is used. Is preferred.

The thickness of the insulating resin is 0.01 to
It is good to be about 1.0 mm. If it is smaller than this range, workability is poor and the first through hole formed in the metal layer cannot be sufficiently filled. On the other hand, if it is larger than this range, it becomes difficult to form a metal layer for electrical conduction on the inner periphery of the second through hole formed after lamination. In addition, the lamination of the insulating resin, hot plate press,
An autoclave that heats and pressurizes at atmospheric pressure can be used. The pressure condition is 1.5 MPa or more, preferably 2-1.
The range is 0 MPa. If it is less than 1.5 MPa, the adhesion to the metal layer may be insufficient, or the first through hole formed in the metal layer may not be sufficiently filled.

As a method of forming a second through-hole having a smaller diameter in the first through-hole filled with the insulating resin, an appropriate method may be used depending on the diameter of the hole. , Laser and the like.

In order to form an electric conduction path in the second through hole formed in the insulating resin, a metal layer is formed on the inner peripheral surface of the second through hole by electrolytic plating, electroless plating, sputtering or vapor deposition. Or a method in which a conductive paste containing a metal powder is filled in the second through-hole with a squeegee using a printing method, or a combination thereof.

The metal powder constituting the conductive paste includes Sn, Pb, Cu, Ag, Au, Ni, Pd, Z
A single, alloy, or mixture of n, Bi, Sb, Co, etc. is used depending on the required heat resistance. In addition, the diameter of the second through hole formed in the insulating resin is 50 μm or less, preferably 10 μm or less.
In particular, the solder material containing Sn is melted in the heating and pressurizing step at the time of lamination, and forms an alloy layer with other metal powder forming the conductive paste and the metal material forming the electric circuit wiring, thereby achieving high reliability. An electrical connection is obtained. In order to make these metal powders into a paste, a predetermined amount of a resin binder or an organic solvent is mixed as necessary.

As a metal material constituting the electric circuit wiring, a metal foil of Cu, Ag, Au, Ni, Co or the like or an alloy foil thereof is used, and a second through hole of the insulating resin layer is formed. Before or after forming, it is heated and pressed to be laminated on both surfaces of the insulating resin layer.

The electric circuit wiring is formed by using a photosensitive resist, a photolithography method, or by a subtractive, additive, or semi-additive method by chemical etching, plating, or the like. Further, if necessary, the surface of the electric circuit wiring is polished, plated or rust-proofed.

A plurality of circuit wiring boards obtained as described above are prepared, and a plurality of circuit wiring boards are aligned and laminated by using the above-mentioned adhesive sheet to manufacture a multilayer circuit wiring board. can do.

In this case, an adhesive sheet in which a through-hole is formed in advance is laminated on one surface of the circuit wiring board in accordance with the circuit pattern, or the adhesive sheet is laminated, and then the through-hole is formed at a predetermined position by a laser or the like. Or to form. Thereafter, the through-holes are printed and filled with the conductive paste as described above to form conductive paths, and another circuit wiring board is aligned and laminated, whereby a multilayer circuit wiring board can be manufactured. . The exposed portion of the conductive path can be formed by being raised to a bump-like projection. In this case, the bumps pressed at the time of connection are crushed, and the connection can be made with high reliability following the irregularities of the silicon chip or the circuit board terminal. The above method can also be used when three or more circuit wiring boards are stacked.

[0028]

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 shows an embodiment of a multilayer circuit wiring board according to the present invention. In the figure, reference numeral 1 denotes an insulating resin layer 3 made of a polyimide resin having a Fe / Ni-based alloy foil (metal layer) 2 as a core material (the elastic modulus of the insulating resin layer 3 is determined by the heating and pressing temperature at the time of lamination described later). This is a circuit wiring board in which a circuit (electric circuit wiring) 4 made of copper foil is formed on both front and back surfaces of the circuit board (not more than 7 MPa). In this embodiment, two circuit wiring boards 1 are used, whereby a four-layer circuit wiring board is manufactured as a multilayer circuit wiring board. Reference numeral 5 denotes a through-hole plated portion (electrically conductive path) formed by performing a copper plating process on a through-hole (second through-hole) 1a formed in each of the circuit wiring boards 1, and the circuit 4 on both front and back sides is formed. Electrically connected. Reference numeral 6 denotes a polyimide-based adhesive layer for bonding the circuit wiring boards 1 to each other. 7 is a circuit 4 of two circuit wiring boards 1 which are stacked (adjacent vertically)
Are electrically connected to each other.

The circuit wiring board 1 can be manufactured, for example, as follows. That is, first, Fe
/ Ni-based alloy foil 2 at predetermined position (through-hole plated portion 5
(A position where the is provided), a through-hole (first through-hole) 2 a is opened (see FIG. 2). Then, a conductor layer made of copper foil using a polyimide-based adhesive sheet 11 on both sides of the Fe / Ni-based alloy foil 2 4a are bonded together at a predetermined heating / pressing temperature (see FIG. 2. In FIG. 2, reference numeral 12 denotes a polyimide-based insulating resin layer formed on one surface of the conductor layer 4a. The substrate 8 as shown in FIG. 3 is produced. Next, as shown in FIG. 4, a through hole 1a smaller than the through hole 2a is formed in a portion of the base material 8 corresponding to the through hole 2a.
Open. Next, through-hole plating of copper is performed on the through-hole 1a to provide a through-hole plating portion 5, and the conductor layers 4a on both front and back surfaces are electrically connected (see FIG. 5). Since the coefficient of thermal expansion of the base material 9 thus obtained is governed by the Fe / Ni-based alloy which is the material of the core material, Fe / N
The coefficient of thermal expansion can be adjusted by changing the ratio of i and the thickness of the foil. Next, the circuit 4 is formed on the conductor layers 4a on both the front and back surfaces of the substrate 9 shown in FIG.
(See FIG. 6).

Further, the multilayer circuit wiring board is, for example,
It can be manufactured as follows. That is, first, the two circuit wiring boards 1 manufactured as described above are used.
(See FIG. 1) and one adhesive sheet 13 (see FIG. 7) made of a polyimide-based adhesive are prepared. Then, the adhesive sheet 13 is provided on the upper surface of one of the two circuit wiring boards 1 through the through holes 13a formed in the adhesive sheet 13.
At a predetermined position of the circuit 4 on the circuit wiring board 1 (the conductive path 7 in FIG. 1).
(The position where is provided) and temporarily adhered (see FIG. 8). Next, as shown in FIG.
A solder paste is put into the through hole 13a by screen printing, and is heated and melted to form a solder bump 14 on the circuit 4 of the circuit wiring board 1. Next, one circuit wiring board 1 provided with the solder bumps 14 and one circuit
After the two circuit wiring boards 1 are aligned with each other and overlapped, they are heated and pressed to be integrated. In this state, the adhesive sheet 13 becomes the adhesive layer 6 and each solder bump 14 becomes the conductive path 7. As a result, a four-layer circuit wiring board in which the two circuit wiring boards 1 are laminated and integrated can be obtained.

As described above, in this embodiment, Fe
As the insulating resin layer 3 bonded to both the front and back surfaces of the / Ni-based alloy foil 2, an insulating resin layer having an elastic modulus of 7 MPa or less at the heating and pressing temperature at the time of the bonding is used.
The through hole 2a of the Fe / Ni-based alloy foil 2 can be reliably insulated, and the electrical connection reliability is excellent. In addition, the two circuit wiring boards 1 can be integrated by one heating and pressing operation, and at the same time, the electrical connection between the four layers can be performed. Moreover, 2
Since the Fe / Ni-based alloy foil 2 is disposed at a ratio of one layer to the circuit 4 of the layer, even when the circuit 4 is formed of a copper foil, the thermal expansion coefficient of the entire four-layer circuit wiring board is increased. Can be reduced, and extremely high connection reliability can be obtained.

Hereinafter, the effects of the present invention will be described with reference to examples.

[0034]

Example 1 First, 3,3 ', 4,4'-tetracarboxydiphthalether dianhydride, 2,2-bis-4-
(4-Aminoxy) phenylpropane and a silicone-terminated diamine are polymerized in N-methylpyrrolidone in a molar ratio of 1: 0.85: 0.15 to obtain a polyamic acid solution (solid content: 20% by weight). Was. This was coated, dried and further treated at 300 ° C. to produce a thermoplastic polyimide film. The glass transition temperature of the produced film was 210 ° C., and the elastic modulus at 240 ° C. was 5 MPa.

Then, a 50 μm-thick Fe / Ni-based alloy foil 2 (Ni: 36% by weight, Fe: 64% by weight, thermal expansion coefficient: 1.5 ppm / ° C.) was coated with a diameter of 300 μm and a pitch of 500 μm.
A μm through hole 2a was drilled (see FIG. 2). Next, on both sides of the Fe / Ni-based material 2, a laminated material composed of a copper foil 4a having a thickness of 18 μm and a film 12 (comprising the thermoplastic polyimide film) having a thickness of 25 μm (Nippon Steel Corporation: Espax) Were bonded by heating and pressing (5 MPa, 240 ° C., 30 minutes) via a 50 μm-thick adhesive sheet 11 (made of the above thermoplastic polyimide film) so that the copper foil 4 a was exposed to the outside (see FIG. 2). ). Thus, both surfaces of the Fe / Ni-based alloy foil 2 are covered with the insulating resin (the thermoplastic polyimide constituting the film 12 and the adhesive sheet 11), and the through holes 2a of the Fe / Ni-based alloy foil 2 are covered with the insulating resin. The copper foil 4a layer was formed on both surfaces of the insulating resin layer 3 composed of the film 12 and the adhesive sheet 11 after filling (see FIG. 3).

Next, through holes 1a having a diameter of 200 μm are formed at the same positions as the through holes 2a by a puncher (see FIG. 4), and the inner peripheral surface of each through hole 1a is formed by electroless plating and electrolytic plating. To form a through-hole plated portion 5 (see FIG. 5). Next, a circuit 4 is formed on the copper foil 4a layer on both sides by an etching method, and the circuit wiring board 1 is formed.
(See FIG. 6). In Example 1, two circuit wiring boards 1 were manufactured.

Then, the polyimide adhesive sheet 13 (SPB-035A, manufactured by Nippon Steel Chemical Co., Ltd.)
A through-hole 13a of 00 μm is formed and aligned with one circuit wiring board 1 (see FIG. 7).
Heat and pressure bonding to one side of (2MPa, 175 ° C, 30 minutes)
(See FIG. 8). Next, Sn- is inserted into the through hole 13a.
A Pb eutectic solder paste (manufactured by Nippon Genma Co., Ltd.) was printed and filled, and after reflowing at 220 ° C. for 1 minute, the flux was washed to form bumps 14 (see FIG. 9). After that, another circuit wiring board 1 is aligned and superimposed on the polyimide adhesive sheet 13 and heated and pressed (5MP).
a, 180 ° C., 60 minutes) to produce a four-layer circuit wiring board (see FIG. 1).

[0038]

Example 2 First, 3,3 ', 4,4'-tetracarboxydiphthalether dianhydride, 1,3-bis (3-
Aminophenoxy) benzene was polymerized in N-methylpyrrolidone at a molar ratio of 1: 1 to obtain a polyamic acid solution (solid content 20% by weight). This is coated and dried,
Further processing was performed at 300 ° C. to produce a thermoplastic polyimide film. The glass transition temperature of the produced film is 1
The elastic modulus at 90 ° C. and 240 ° C. was 6 MPa.

Then, the Fe / Ni-based alloy foil 22 having a thickness of 100 μm (Ni: 42% by weight, Fe: 58% by weight, thermal expansion coefficient: 5.0 ppm / ° C.) was placed on a 250 μm, 350 μm diameter.
The m-pitch through holes 22a were opened with a laser (see FIG. 10). Next, on both sides of the Fe / Ni-based alloy foil 22,
A copper foil 24a having a thickness of 18 μm was adhered by heating and pressing (5 MPa, 240 ° C., 30 minutes) via an adhesive sheet 23a (composed of the thermoplastic polyimide film) having a thickness of 50 μm (see FIG. 10). As a result, both surfaces of the Fe / Ni-based alloy foil 22 are covered with the insulating resin (the thermoplastic polyimide constituting the adhesive sheet 23a), and the Fe / Ni
Filling the through hole 22a of the system alloy foil 22 with the insulating resin,
Copper foil 24a layers were formed on both surfaces of the insulating resin layer 23 composed of the adhesive sheet 23a (see FIG. 11).

Next, a through-hole 21a having a diameter of 150 μm was formed at the same position as the above-mentioned through-hole 22a by using a carbon dioxide gas laser (see FIG. 12). Was used to form a copper layer, and a through-hole plated portion 25 was formed (see FIG. 13). Next, a circuit 24 is formed on the copper foil 24a layer on both sides by etching.
Was formed to produce a circuit wiring board 21 (see FIG. 14). In Example 2, two circuit wiring boards 21 were manufactured.

Next, a polyimide-based adhesive sheet 26 (SPB-035A manufactured by Nippon Steel Chemical Co., Ltd.) shown in FIG. 15 was bonded to one side of one circuit wiring board 21 by heating and pressing (2 MPa,
After 175 ° C. for 30 minutes), a through hole 26 a having a diameter of 200 μm reaching the circuit 24 at a predetermined position was formed with a YAG laser (see FIG. 16). Next, the through hole 26a
Was printed and filled with a Sn-Sb solder paste (manufactured by Nippon Genma Co., Ltd.) mixed with 15% by weight of Ni powder.
Reflow was performed in one minute to form bumps 27 (see FIG. 17). After that, another circuit wiring board 21 is aligned and stacked, and heated and pressed (5 MPa, 180 ° C., 60 ° C.).
) To produce a four-layer circuit board (FIG. 18).
reference).

[0042]

Embodiment 3 First, a 100 μm-thick Fe / Ni-based alloy foil 32 (Ni: 36% by weight, Fe: 64% by weight, thermal expansion coefficient: 1.5 ppm / ° C.) has a diameter of 250 μm and a pitch of 35 μm.
A 0 μm through hole 32a was opened with a laser (see FIG. 19). Then, on both sides of the Fe / Ni-based alloy foil 32,
Liquid crystalline aromatic polyester 33 having a thickness of 50 μm (Kuraray Co., Ltd .: OC grade, glass transition temperature 300 ° C., 330
(The elastic modulus is 0.1 MPa or less at ℃)
Pa, 330 ° C., 10 minutes), and the both sides of the Fe / Ni alloy foil 32 are insulated with an insulating resin (liquid crystalline aromatic polyester 3).
3), and the through holes 32a of the Fe / Ni-based alloy foil 32 were filled with the insulating resin (see FIG. 20).

Next, at the same position as the through hole 32a, the diameter 1
A 50 μm through hole 31a was formed with a YAG laser (see FIG. 21). Using a metal plate (opening diameter 200 μm, thickness 100 μm) inside each of the through holes 31 a,
A Sn-Sb solder paste (manufactured by Nippon Genma Co., Ltd.) mixed with 15% by weight of Ni powder was printed and filled. Further, the openings at both ends of each through hole 31a are pressed (10 MPa, 30 MPa).
After 2 minutes), the paste was press-fitted, and excess metal powder was removed by buffing. Next, the electric conduction path 35 was obtained by heating to 250 ° C. under pressure (see FIG. 22).

Next, on both sides of the laminate, a thickness of 35 μm was applied.
m copper foil 34a is heated and pressurized (3 MPa, 330 ° C.,
10 minutes) laminated (see FIG. 23), and then the copper foil 3 on both sides
The circuit 34 was formed on the layer 4a by the etching method, and the circuit wiring board 31 was manufactured (see FIG. 24). In Example 3, two circuit wiring boards 31 were manufactured.

Next, a 50 μm thick liquid crystalline aromatic polyester 36 (Kuraray FA grade) shown in FIG.
To one side of one circuit wiring board 31 by heating and pressing (2M
Pa, 290 ° C., 10 minutes)
A through hole 36a having a diameter of 150 μm reaching up to 4 was formed with a YAG laser (see FIG. 26). Next, in the through hole 36a, Sn-Sb mixed with 15% by weight of Ni powder was used.
Print and fill with solder paste (Nippon Genma Co., Ltd.)
The bumps 37 were formed by reflow at 0 ° C. for 1 minute (FIG. 2).
7). After that, another circuit wiring board 31 is aligned and stacked, and heated and pressed (2 MPa, 290 ° C., 1
0 minutes) to produce a four-layer circuit board (FIG. 2).
8).

[0046]

Comparative Example 1 First, 3,3 ', 4,4'-tetracarboxydiphthalether dianhydride, 2,2-bis-4-
(4-aminoxy) phenylpropane in a molar ratio of 1: 1
Was polymerized in N-methylpyrrolidone to obtain a polyamic acid solution (solid content: 20% by weight). Coating this,
It dried and processed at 300 degreeC, and the thermoplastic polyimide film was produced. The elastic modulus at 250 ° C. of the produced film was 11 MPa.

Then, a 100 μm thick Fe / Ni-based alloy foil (Ni: 36% by weight, Fe: 64% by weight, thermal expansion coefficient: 1.5 ppm / ° C.) was coated with a diameter of 300 μm and a pitch of 500 μm.
A through hole of μm was drilled. Next, on both surfaces of the Fe / Ni-based alloy foil, a copper foil having a thickness of 18 μm was heated and pressed through an adhesive sheet (comprising the thermoplastic polyimide film) having a thickness of 50 μm (10 MPa, 250 ° C., 3 MPa).
0 minutes), but the thermoplastic polyimide constituting this adhesive sheet could not be sufficiently filled in the through holes.

[0048]

Comparative Example 2 Liquid crystalline aromatic polyester (manufactured by Kuraray:
An OC grade, a glass transition temperature of 300 ° C., an elastic modulus at 330 ° C. and an elastic modulus of 0.1 MPa or less) were used to form a 150 μm diameter through-hole with a YAG laser. Next, a metal plate (opening diameter 200 μm, thickness 10 μm) is provided inside each of these through holes.
0 μm), S powder containing 15% by weight of Ni powder was used.
An n-Sb solder paste (manufactured by Nippon Genma Co., Ltd.) was printed and filled. Further, the openings at both ends of each through hole are pressed (10
(MPa, 30 ° C., 2 minutes), and after press-fitting the paste, excess metal powder was removed by buffing. Next, an electric conduction path was obtained by heating to 250 ° C. under pressure. Next, 35 μm thick on both sides of the laminate.
m copper foil is heated and pressurized (2 MPa, 340 ° C., 10
Minutes) Lamination, and then, a circuit was formed on the copper foil layers on both sides by an etching method to obtain a circuit wiring board. Comparative Example 2
Then, two circuit wiring boards were manufactured.

Next, a liquid crystalline aromatic polyester (manufactured by Kuraray Co., Ltd .: FA grade) having a thickness of 50 μm was adhered to one side of one circuit wiring board under heat and pressure (0.2 MPa, 285 mm).
(° C., 10 minutes), and a through hole having a diameter of 150 μm reaching a circuit at a predetermined position was formed with a YAG laser. Next, in the above-mentioned through-hole, S in which 15% by weight of Ni powder was mixed
An n-Pb solder paste (manufactured by Nippon Genma Co., Ltd.) was printed and filled, and reflowed at 240 ° C. for 1 minute to form bumps. Thereafter, another circuit wiring board was aligned and stacked, and integrated by heating and pressing (1 MPa, 290 ° C., 10 minutes) to produce a four-layer circuit board.

A temperature shock test (liquid layer: -65) was conducted on the products of Examples 1 to 3 and Comparative Example 2 produced as described above.
C. (125 ° C., 10 minutes each), and the electrical conduction in the thickness direction of the substrate was examined. The results are shown in Table 1 below.

[0051]

[Table 1]

As is apparent from the above results, when the elastic modulus of the thermoplastic polyimide constituting the adhesive sheet is 11 MPa at 250 ° C. as in Comparative Example 1, the Fe /
Even if a copper foil is adhered to both surfaces of a Ni-based alloy foil by applying heat and pressure through an adhesive sheet, the thermoplastic polyimide is made of Fe / N.
The through holes of the i-based alloy foil could not be sufficiently filled. Further, when the core material was not provided inside the liquid crystalline aromatic polyester as in the product of Comparative Example 2, the product of Example 1 was used.
It can be seen that the electrical conductivity in the thickness direction of the substrate is inferior to those of the three products.

[0053]

As described above, according to the circuit wiring board of the present invention, the insulating resin is laminated on both surfaces of the metal layer, and both surfaces of the metal layer are coated by heating and pressing, and the first layer of the metal layer is formed. As the insulating resin layer made of the above insulating resin that closes the inner peripheral surface of the through hole, the insulating resin layer having an elastic modulus of 7 MPa or less at the temperature of laminating heating and pressing is used. When the resin is press-laminated on both surfaces of the metal layer, both surfaces of the metal layer and the inner peripheral surface of the first through hole can be reliably insulated by the insulating resin. In addition, even when the conductor layers are bonded after the press laminating step, the insulating resin is re-melted, and sufficient adhesive strength can be exhibited. Further, the curing temperature of a metal material used to form a thickness-direction electrical conduction path in the insulating resin layer, the temperature at which a conductor layer for electric circuit wiring is laminated on the insulating resin layer, The dimensional change due to the thermal expansion and contraction of the insulating resin layer at the temperature at which the insulating layer is laminated and at the solder reflow temperature at the time of mounting the electronic component can be suppressed by the metal layer. Therefore, it is possible to provide a circuit wiring board with higher electrical connection reliability by suppressing warping of the circuit wiring board and deformation of the electric conduction path in the thickness direction and stabilizing the circuit connection position.

Further, the multilayer circuit wiring board of the present invention uses the above-mentioned circuit wiring board, and exhibits the above-mentioned excellent effects. Further, according to the method for manufacturing a multilayer circuit wiring board of the present invention,
A multilayer circuit wiring board exhibiting the above-described excellent effects can be manufactured.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of a multilayer circuit wiring board of the present invention.

FIG. 2 is a cross-sectional view illustrating a manufacturing process of the circuit wiring board.

FIG. 3 is a cross-sectional view illustrating a manufacturing process of the circuit wiring board.

FIG. 4 is a cross-sectional view showing a manufacturing process of the circuit wiring board.

FIG. 5 is a cross-sectional view showing a manufacturing process of the circuit wiring board.

FIG. 6 is a cross-sectional view showing a manufacturing process of the circuit wiring board.

FIG. 7 is a cross-sectional view showing a step of manufacturing the multilayer circuit wiring board.

FIG. 8 is a sectional view showing a manufacturing process of the multilayer circuit wiring board.

FIG. 9 is a cross-sectional view illustrating a step of manufacturing the multilayer circuit wiring board.

FIG. 10 is a cross-sectional view illustrating a step of manufacturing the multilayer circuit wiring board according to the second embodiment.

FIG. 11 is a cross-sectional view showing a step of manufacturing the multilayer circuit wiring board of the second embodiment.

FIG. 12 is a cross-sectional view showing a step of manufacturing the multilayer circuit wiring board of the second embodiment.

FIG. 13 is a cross-sectional view showing a step of manufacturing the multilayer circuit wiring board of the second embodiment.

FIG. 14 is a cross-sectional view showing a step of manufacturing the multilayer circuit wiring board of the second embodiment.

FIG. 15 is a cross-sectional view illustrating a step of manufacturing the multilayer circuit wiring board of the second embodiment.

FIG. 16 is a cross-sectional view showing a step of manufacturing the multilayer circuit wiring board of the second embodiment.

FIG. 17 is a cross-sectional view showing a step of manufacturing the multilayer circuit wiring board of the second embodiment.

FIG. 18 is a cross-sectional view illustrating the multilayer circuit wiring board according to the second embodiment.

FIG. 19 is a cross-sectional view illustrating a step of manufacturing the multilayer circuit wiring board of the third embodiment.

FIG. 20 is a cross-sectional view showing a step of manufacturing the multilayer circuit wiring board of the third embodiment.

FIG. 21 is a cross-sectional view showing a step of manufacturing the multilayer circuit wiring board of the third embodiment.

FIG. 22 is a cross-sectional view showing a step of manufacturing the multilayer circuit wiring board of the third embodiment.

FIG. 23 is a cross-sectional view showing a step of manufacturing the multilayer circuit wiring board of the third embodiment.

FIG. 24 is a cross-sectional view showing a step of manufacturing the multilayer circuit wiring board of the third embodiment.

FIG. 25 is a cross-sectional view showing a step of manufacturing the multilayer circuit wiring board of the third embodiment.

FIG. 26 is a cross-sectional view showing a step of manufacturing the multilayer circuit wiring board of the third embodiment.

FIG. 27 is a cross-sectional view showing a step of manufacturing the multilayer circuit wiring board of the third embodiment.

FIG. 28 is a sectional view showing the multilayer circuit wiring board of the third embodiment.

FIG. 29 is a sectional view showing a conventional example.

FIG. 30 is a cross-sectional view showing a manufacturing method of the conventional example.

FIG. 31 is a sectional view showing another conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Circuit wiring board 1a 2nd through hole 2 Metal layer 2a 1st through hole 3 Insulating resin layer 4 Electric circuit wiring

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 1/09 H05K 1/09 A 3/46 3/46 TS (72) Inventor Shinya Ota Ibaraki, Osaka 1-1-2 Shimohozumi, Ichito Nitto Denko Corporation (72) Inventor Takuji Okei 1-1-2 Shimohozumi, Ibaraki-shi, Osaka Nitto Denko Corporation F-term (reference) 4E351 AA01 BB01 BB24 BB26 BB31 CC11 DD24 GG06 5E315 AA05 AA11 BB01 BB14 CC16 CC21 DD07 DD13 DD17 DD20 GG03 GG07 5E317 AA24 BB01 BB05 BB18 CC25 CC53 CD21 CD27 CD32 GG11 GG16 5E346 AA12 AA15 CC08 CC10 CC31 CC32 CC37 CC06 CC41 DD17 FFFFFFH FFFFFFFFH

Claims (10)

[Claims] 1. A metal layer in which a plurality of first through holes formed in a thickness direction are provided at predetermined intervals, and an insulating resin is laminated on both surfaces of the metal layer and heated and pressed to form a metal layer. An insulating resin layer made of the insulating resin covering both surfaces and closing an inner peripheral surface of the first through hole;
A second through hole smaller than the through hole is provided substantially concentrically in a portion of the insulating resin layer that closes the first through hole, the second through hole comprising electric circuit wiring formed on both surfaces of the insulating resin layer. A circuit wiring board which electrically connects electric circuit wirings formed on both surfaces of the insulating resin layer using the second through-holes, wherein the elastic modulus of the insulating resin is at a temperature at which the laminate is heated and pressed. A circuit wiring board having a pressure of 7 MPa or less. 2. The circuit wiring board according to claim 1, wherein said laminating heating / pressing temperature is 180 ° C. or higher. 3. The second through hole is formed in an electric conduction path closed with a metal material, and both ends of the second through hole are closed with electric circuit wiring. 2. The circuit wiring board according to 2. 4. The thermal expansion coefficient of the metal layer is 20 to 25.
The circuit wiring board according to claim 1, wherein the temperature is 20 ppm / ° C. or less in a range of 0 ° C. 5. 5. The metal layer according to claim 1, wherein the metal layer is an Fe / Ni-based alloy foil, the Ni content is in the range of 31 to 50% by weight, and the thickness is in the range of 10 to 500 μm. The circuit wiring board according to claim 1. 6. The circuit wiring board according to claim 3, wherein the metal material includes a solder material that melts at 300 ° C. or less. 7. The circuit wiring board according to claim 1, wherein the insulating resin layer is mainly composed of a thermoplastic resin that repeatedly melts at a temperature lower than its thermal decomposition temperature. 8. The circuit wiring board according to claim 1, wherein the insulating resin layer is a thermoplastic liquid crystal polymer. 9. The circuit wiring board according to claim 1, wherein the circuit wiring board is opposed at a predetermined position, and is laminated with an insulating adhesive layer interposed therebetween in that state. A multilayer circuit wiring board, wherein a conductive path is formed at a predetermined position, and the electric circuit wiring of the opposing circuit wiring board is conducted in the thickness direction by the conductive path. 10. A step of preparing a plurality of circuit wiring boards according to claim 1 and preparing an insulating adhesive layer disposed between the circuit wiring boards.
A step of forming a through hole at a predetermined position of the insulating adhesive layer, a step of filling a metal material inside the through hole of the insulating adhesive layer, and an insulating adhesive layer filled with a metal material inside the through hole And a step of collectively laminating the plurality of circuit wiring boards through the method.