JPH04318997A - 印刷回路用銅箔及びその製造方法 - Google Patents
印刷回路用銅箔及びその製造方法Info
- Publication number
- JPH04318997A JPH04318997A JP3317503A JP31750391A JPH04318997A JP H04318997 A JPH04318997 A JP H04318997A JP 3317503 A JP3317503 A JP 3317503A JP 31750391 A JP31750391 A JP 31750391A JP H04318997 A JPH04318997 A JP H04318997A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- copper
- nickel
- cobalt
- zinc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 62
- 239000011889 copper foil Substances 0.000 title claims abstract description 49
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 30
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052718 tin Inorganic materials 0.000 claims abstract description 16
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 15
- 239000010941 cobalt Substances 0.000 claims abstract description 13
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 13
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 13
- 229910002058 ternary alloy Inorganic materials 0.000 claims abstract description 13
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052785 arsenic Inorganic materials 0.000 claims abstract description 12
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000011135 tin Substances 0.000 claims abstract description 12
- 238000007747 plating Methods 0.000 claims abstract description 11
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 10
- 239000011701 zinc Substances 0.000 claims abstract description 10
- HELHAJAZNSDZJO-OLXYHTOASA-L sodium L-tartrate Chemical compound [Na+].[Na+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O HELHAJAZNSDZJO-OLXYHTOASA-L 0.000 claims abstract description 6
- 235000011121 sodium hydroxide Nutrition 0.000 claims abstract description 6
- 239000001433 sodium tartrate Substances 0.000 claims abstract description 6
- 229960002167 sodium tartrate Drugs 0.000 claims abstract description 6
- 235000011004 sodium tartrates Nutrition 0.000 claims abstract description 6
- 239000011787 zinc oxide Substances 0.000 claims abstract description 6
- 229910000365 copper sulfate Inorganic materials 0.000 claims abstract description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 27
- TVQLLNFANZSCGY-UHFFFAOYSA-N disodium;dioxido(oxo)tin Chemical group [Na+].[Na+].[O-][Sn]([O-])=O TVQLLNFANZSCGY-UHFFFAOYSA-N 0.000 claims description 6
- 229940079864 sodium stannate Drugs 0.000 claims description 6
- 239000008367 deionised water Substances 0.000 claims description 4
- 229910021641 deionized water Inorganic materials 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- AQLMHYSWFMLWBS-UHFFFAOYSA-N arsenite(1-) Chemical compound O[As](O)[O-] AQLMHYSWFMLWBS-UHFFFAOYSA-N 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims description 2
- 229910000361 cobalt sulfate Inorganic materials 0.000 claims description 2
- 229940044175 cobalt sulfate Drugs 0.000 claims description 2
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 claims description 2
- 150000004688 heptahydrates Chemical class 0.000 claims description 2
- 150000004687 hexahydrates Chemical class 0.000 claims description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 2
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 2
- 150000004686 pentahydrates Chemical class 0.000 claims 1
- 238000005406 washing Methods 0.000 claims 1
- 238000004070 electrodeposition Methods 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 abstract description 3
- 238000007788 roughening Methods 0.000 abstract description 3
- 239000011888 foil Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 15
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 229910045601 alloy Inorganic materials 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229910001431 copper ion Inorganic materials 0.000 description 4
- 239000008151 electrolyte solution Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- JHWIEAWILPSRMU-UHFFFAOYSA-N 2-methyl-3-pyrimidin-4-ylpropanoic acid Chemical compound OC(=O)C(C)CC1=CC=NC=N1 JHWIEAWILPSRMU-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910001297 Zn alloy Inorganic materials 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910000756 V alloy Inorganic materials 0.000 description 1
- HFPUDQMSWREXAL-UHFFFAOYSA-N [Cu].[Zn].[As] Chemical compound [Cu].[Zn].[As] HFPUDQMSWREXAL-UHFFFAOYSA-N 0.000 description 1
- PDYXSJSAMVACOH-UHFFFAOYSA-N [Cu].[Zn].[Sn] Chemical compound [Cu].[Zn].[Sn] PDYXSJSAMVACOH-UHFFFAOYSA-N 0.000 description 1
- FFDNCLQDXZUPCF-UHFFFAOYSA-N [V].[Zn] Chemical compound [V].[Zn] FFDNCLQDXZUPCF-UHFFFAOYSA-N 0.000 description 1
- DBQFKMXHMSMNRU-UHFFFAOYSA-N [Zn].[Co].[Cu] Chemical compound [Zn].[Co].[Cu] DBQFKMXHMSMNRU-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- MEYVLGVRTYSQHI-UHFFFAOYSA-L cobalt(2+) sulfate heptahydrate Chemical compound O.O.O.O.O.O.O.[Co+2].[O-]S([O-])(=O)=O MEYVLGVRTYSQHI-UHFFFAOYSA-L 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- -1 copper ions form hydroxides Chemical class 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
- CGPVLUCOFNAVGV-UHFFFAOYSA-N copper;pentahydrate Chemical compound O.O.O.O.O.[Cu] CGPVLUCOFNAVGV-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- UHXUZOCRWCRNSJ-QPJJXVBHSA-N methomyl Chemical compound CNC(=O)O\N=C(/C)SC UHXUZOCRWCRNSJ-QPJJXVBHSA-N 0.000 description 1
- RRIWRJBSCGCBID-UHFFFAOYSA-L nickel sulfate hexahydrate Chemical compound O.O.O.O.O.O.[Ni+2].[O-]S([O-])(=O)=O RRIWRJBSCGCBID-UHFFFAOYSA-L 0.000 description 1
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1991-P-3871 | 1991-03-11 | ||
| KR1019910003871A KR930006103B1 (ko) | 1991-03-11 | 1991-03-11 | 인쇄회로용 전해동박 및 그 제조방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04318997A true JPH04318997A (ja) | 1992-11-10 |
Family
ID=19311976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3317503A Pending JPH04318997A (ja) | 1991-03-11 | 1991-11-05 | 印刷回路用銅箔及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH04318997A (ko) |
| KR (1) | KR930006103B1 (ko) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1006763A2 (en) * | 1998-11-30 | 2000-06-07 | Mitsui Mining & Smelting Co., Ltd. | Copper foil for printed wiring board having excellent chemical resistance and heat resistance |
| US6342308B1 (en) * | 1999-09-29 | 2002-01-29 | Yates Foil Usa, Inc. | Copper foil bonding treatment with improved bond strength and resistance to undercutting |
| EP1185152A1 (en) * | 2000-01-28 | 2002-03-06 | Mitsui Mining & Smelting Co., Ltd. | Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| EP1185151A1 (en) * | 2000-01-28 | 2002-03-06 | Mitsui Mining & Smelting Co., Ltd. | Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| JP2004349693A (ja) * | 2003-04-30 | 2004-12-09 | Mec Kk | 銅表面の対樹脂接着層 |
| JP2009286071A (ja) * | 2008-05-30 | 2009-12-10 | Mitsui Mining & Smelting Co Ltd | 銅張積層板、その銅張積層板製造に用いる表面処理銅箔及びその銅張積層板を用いて得られるプリント配線板 |
| JP2012094918A (ja) * | 2003-04-30 | 2012-05-17 | Mec Kk | 銅表面の対樹脂接着層、配線基板および接着層形成方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100294394B1 (ko) * | 1997-12-13 | 2001-09-17 | 권문구 | 인쇄회로기판용전해동박및그의제조방법 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0471292A (ja) * | 1990-06-05 | 1992-03-05 | Fukuda Metal Foil & Powder Co Ltd | 印刷回路用銅箔及びその表面処理方法 |
-
1991
- 1991-03-11 KR KR1019910003871A patent/KR930006103B1/ko not_active IP Right Cessation
- 1991-11-05 JP JP3317503A patent/JPH04318997A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0471292A (ja) * | 1990-06-05 | 1992-03-05 | Fukuda Metal Foil & Powder Co Ltd | 印刷回路用銅箔及びその表面処理方法 |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1006763A2 (en) * | 1998-11-30 | 2000-06-07 | Mitsui Mining & Smelting Co., Ltd. | Copper foil for printed wiring board having excellent chemical resistance and heat resistance |
| EP1006763A3 (en) * | 1998-11-30 | 2002-06-19 | Mitsui Mining & Smelting Co., Ltd. | Copper foil for printed wiring board having excellent chemical resistance and heat resistance |
| US6342308B1 (en) * | 1999-09-29 | 2002-01-29 | Yates Foil Usa, Inc. | Copper foil bonding treatment with improved bond strength and resistance to undercutting |
| EP1185152A1 (en) * | 2000-01-28 | 2002-03-06 | Mitsui Mining & Smelting Co., Ltd. | Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| EP1185151A1 (en) * | 2000-01-28 | 2002-03-06 | Mitsui Mining & Smelting Co., Ltd. | Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| EP1185152A4 (en) * | 2000-01-28 | 2006-11-22 | Mitsui Mining & Smelting Co | SURFACE-TREATED COPPER FOIL AND ITS MANUFACTURE AND COPPER-COATED LAMINATE THEREOF |
| EP1185151A4 (en) * | 2000-01-28 | 2006-11-22 | Mitsui Mining & Smelting Co | SURFACE TREATED COPPER SHEET AND PROCESS FOR PREPARING SAME AND COPPER COATING LAMINATE USING SAME |
| JP2004349693A (ja) * | 2003-04-30 | 2004-12-09 | Mec Kk | 銅表面の対樹脂接着層 |
| JP2012094918A (ja) * | 2003-04-30 | 2012-05-17 | Mec Kk | 銅表面の対樹脂接着層、配線基板および接着層形成方法 |
| JP2009286071A (ja) * | 2008-05-30 | 2009-12-10 | Mitsui Mining & Smelting Co Ltd | 銅張積層板、その銅張積層板製造に用いる表面処理銅箔及びその銅張積層板を用いて得られるプリント配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR920019222A (ko) | 1992-10-22 |
| KR930006103B1 (ko) | 1993-07-07 |
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