JPH04314347A - Ic inspection device - Google Patents

Abstract

PURPOSE:To improve operation efficiency by reducing a device occupation area. CONSTITUTION:A test head 2 connected from a teseter body 1 through a single cable is made longitudinal, and measuring units 3, 4 making contact with an IC 6 are mounted on opposite surfaces of the test head 2. Handlers 5a, 5b for supplying the IC 6 are disposed at locations corresponding to the measuring units 3, 4.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention relates to semiconductor devices (hereinafter referred to as IC).
The present invention relates to an IC testing device (hereinafter referred to as a tester) that measures the characteristics of an IC (hereinafter referred to as a tester).

0002

2. Description of the Related Art FIG. 3 is a perspective view schematically showing an example of a conventional tester. Conventionally, this type of tester includes, for example, one tester body 1 that sends, receives, and processes measurement signals, and is connected to this tester body 1 via a signal cable and is equipped with an IC, as shown in FIG. 3, for example. It had two test heads 2.

[0003] When measuring the characteristics of an IC using this tester, first, the IC, which is not the object to be measured, is mounted on the two test heads 2, and the probe head is brought into contact with the IC alternately, and the measurement is repeated. was. Furthermore, a handling device (not shown) was used to mount the IC on the test heads 2a and 2b and bring them into contact.

[0004] Furthermore, this handling device is equipped with an IC.
There is something called a handler in a packaged chip state, and something called a prober for an IC in a chip state. These were combined with the test head 2 to form one inspection mechanism.

[0005]

[Problems to be Solved by the Invention] Although the conventional tester described above has two test heads, the two test heads do not contribute to measurement at the same time, and while one is in the process of measuring, the other is in a standby state. The situation is as follows. Therefore,
Considering the operating rate, if the tester itself is 100%, the test head is only 50%, which is not reasonable. Furthermore, simply using one test head adds loss time to the handling device, which lowers the operating rate of the tester itself. Furthermore, the test head occupies a large floor space, which hinders efficiency.

SUMMARY OF THE INVENTION An object of the present invention is to provide a tester that occupies a smaller area and has a higher operating rate in order to solve this problem.

[0007]

[Means for Solving the Problems] The tester of the present invention has a measurement unit that electrically contacts semiconductor devices and semiconductor elements formed on a wafer on both sides of a test head that is connected from a main body via a signal cable. The present invention is characterized in that a supply means is provided for supplying and positioning the semiconductor device and the wafer to corresponding positions of the measurement unit.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings.

FIGS. 1(a) and 1(b) are a top view and a front view of a tester showing an embodiment of the present invention. As shown in FIG. 1, this tester has a vertical test head 2, has measurement units 3 and 4 attached to both sides thereof, and has handlers 5a and 5b that position and supply ICs 6 to positions facing these measurement heads 3 and 4. This is because it has been placed.

In addition, the measurement units 3 and 4 do not perform measurements at the same time, but have a relay between the wires after the pin electronics card, which is a measurement circuit board built into the test head 2, and can switch between them. , IC6 on both sides are alternately measured.

[0011] To measure IC6 with this tester,
First, the ICs 6 are supplied by the handlers 5a and 5b in the direction of the arrow, and placed at the corresponding positions of the measurement units 3 and 4.
Position C6. Next, by switching the relays, one of the measurement units 3 and 4 is connected to the pin electronics card, and one of the ICs 6 is measured. Next, another IC6 is measured by switching the relay, and when the measurement is finished, the IC6 is moved by the handlers 5a and 5b, and the other IC6 is measured.
is supplied in the direction of the arrow. In this way, two ICs 6 are sequentially supplied and measured.

FIG. 2 is a side view of a tester showing another embodiment of the present invention. As shown in FIG. 2, this tester has a test head 2c placed in a horizontal position, and a measurement unit 3a that contacts the IC 6 and a measurement unit 4a that contacts the electrode pads in the chips of the wafer 8 above and below the head 2c. A handler 5c for supplying and positioning the IC 6 to the measurement unit 3a is placed on the upper side, and a prober 9 for supplying and positioning the wafer to a position corresponding to the measurement unit 4a is placed on the lower side.

The operation of this tester is similar to that of the tester in the previous embodiment, but by locating the handler 5c at the top and the prober 9 at the bottom, it occupies less space and allows ICs 6 and wafers 8 of different shapes to be used. There is an advantage that both can be measured with the same tester.

[0014]

As explained above, the present invention provides a measurement unit that makes electrical contact with an IC or a wafer chip on both sides of one test head, and supplies an IC or wafer to a position corresponding to the measurement unit. However, by arranging a handler or a prober for positioning, measurements can be performed alternately and continuously, which has the effect of providing a tester that occupies a smaller area and has a higher operating rate.

[Brief explanation of drawings]

FIG. 1 (a) in a tester showing an embodiment of the present invention.
is a top view, and (b) is a front view.

FIG. 2 is a side view of a tester showing another embodiment of the present invention.

FIG. 3 is a perspective view of a conventional tester.

[Explanation of symbols]

1 Tester body 2, 2a, 2b, 2c Test head 3, 3a, 4, 4a Measurement unit 5a, 5
b, 5c Handler 6 IC 7 Rail 8 Wafer 9 Prober

Claims (1)

[Claims] Claim 1: A test head connected from the main body via a signal cable is provided with measurement units on both sides of the test head that are in electrical contact with semiconductor devices and semiconductor elements formed on a wafer, and the corresponding positions of the measurement units are provided. An IC inspection apparatus characterized in that a supply means for supplying and positioning the semiconductor device and the wafer is disposed.