JPH0431187B2 - - Google Patents

Info

Publication number
JPH0431187B2
JPH0431187B2 JP60171068A JP17106885A JPH0431187B2 JP H0431187 B2 JPH0431187 B2 JP H0431187B2 JP 60171068 A JP60171068 A JP 60171068A JP 17106885 A JP17106885 A JP 17106885A JP H0431187 B2 JPH0431187 B2 JP H0431187B2
Authority
JP
Japan
Prior art keywords
thermal expansion
integrated circuit
glass
weight
lead piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60171068A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6232631A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP60171068A priority Critical patent/JPS6232631A/ja
Priority to US06/890,533 priority patent/US4729010A/en
Priority to EP86305894A priority patent/EP0211618B1/en
Priority to DE8686305894T priority patent/DE3672709D1/de
Publication of JPS6232631A publication Critical patent/JPS6232631A/ja
Publication of JPH0431187B2 publication Critical patent/JPH0431187B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Heat Treatment Of Steel (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP60171068A 1985-08-05 1985-08-05 集積回路パッケージ用リード片の製法 Granted JPS6232631A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60171068A JPS6232631A (ja) 1985-08-05 1985-08-05 集積回路パッケージ用リード片の製法
US06/890,533 US4729010A (en) 1985-08-05 1986-07-30 Integrated circuit package with low-thermal expansion lead pieces
EP86305894A EP0211618B1 (en) 1985-08-05 1986-07-31 Integrated circuit package
DE8686305894T DE3672709D1 (de) 1985-08-05 1986-07-31 Integrierte schaltungspackung.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60171068A JPS6232631A (ja) 1985-08-05 1985-08-05 集積回路パッケージ用リード片の製法

Publications (2)

Publication Number Publication Date
JPS6232631A JPS6232631A (ja) 1987-02-12
JPH0431187B2 true JPH0431187B2 (en, 2012) 1992-05-25

Family

ID=15916442

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60171068A Granted JPS6232631A (ja) 1985-08-05 1985-08-05 集積回路パッケージ用リード片の製法

Country Status (1)

Country Link
JP (1) JPS6232631A (en, 2012)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2736453B2 (ja) * 1989-11-27 1998-04-02 京セラ株式会社 半導体素子収納用パッケージ
JP2736460B2 (ja) * 1989-11-30 1998-04-02 京セラ株式会社 半導体素子収納用パッケージ
JP2764340B2 (ja) * 1990-06-26 1998-06-11 京セラ株式会社 半導体素子収納用パッケージ

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5841779B2 (ja) * 1978-03-23 1983-09-14 玉川機械金属株式会社 半導体用リ−ド材
JPS5596664A (en) * 1979-01-16 1980-07-23 Furukawa Electric Co Ltd:The Copper alloy for lead frame of semiconductor element
JPS5943973B2 (ja) * 1979-06-23 1984-10-25 ヤマハ株式会社 Ａｇメッキ用リ−ドフレ−ム素材の製法
JPS5933857A (ja) * 1982-08-19 1984-02-23 Hitachi Metals Ltd Ｉｃリ−ドフレ−ム材料とその製造方法
JPS5996245A (ja) * 1982-11-22 1984-06-02 Daido Steel Co Ltd リ−ドフレ−ム材料およびその製造方法
JPS59198741A (ja) * 1983-04-25 1984-11-10 Nippon Gakki Seizo Kk 半導体集積回路用リ−ドフレ−ム材
JPS61235535A (ja) * 1985-04-10 1986-10-20 Hitachi Metals Ltd リ−ドフレ−ム用合金

Also Published As

Publication number Publication date
JPS6232631A (ja) 1987-02-12

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