JPH0431178B2 - - Google Patents

Info

Publication number
JPH0431178B2
JPH0431178B2 JP60089556A JP8955685A JPH0431178B2 JP H0431178 B2 JPH0431178 B2 JP H0431178B2 JP 60089556 A JP60089556 A JP 60089556A JP 8955685 A JP8955685 A JP 8955685A JP H0431178 B2 JPH0431178 B2 JP H0431178B2
Authority
JP
Japan
Prior art keywords
metal
layer
electrode
film
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60089556A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61274348A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP60089556A priority Critical patent/JPS61274348A/ja
Publication of JPS61274348A publication Critical patent/JPS61274348A/ja
Publication of JPH0431178B2 publication Critical patent/JPH0431178B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]

Landscapes

  • Wire Bonding (AREA)
JP60089556A 1985-04-25 1985-04-25 光電変換装置用配線基板の製造方法 Granted JPS61274348A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60089556A JPS61274348A (ja) 1985-04-25 1985-04-25 光電変換装置用配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60089556A JPS61274348A (ja) 1985-04-25 1985-04-25 光電変換装置用配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPS61274348A JPS61274348A (ja) 1986-12-04
JPH0431178B2 true JPH0431178B2 (enExample) 1992-05-25

Family

ID=13974093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60089556A Granted JPS61274348A (ja) 1985-04-25 1985-04-25 光電変換装置用配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPS61274348A (enExample)

Also Published As

Publication number Publication date
JPS61274348A (ja) 1986-12-04

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