JPS61274348A - 光電変換装置用配線基板の製造方法 - Google Patents

光電変換装置用配線基板の製造方法

Info

Publication number
JPS61274348A
JPS61274348A JP60089556A JP8955685A JPS61274348A JP S61274348 A JPS61274348 A JP S61274348A JP 60089556 A JP60089556 A JP 60089556A JP 8955685 A JP8955685 A JP 8955685A JP S61274348 A JPS61274348 A JP S61274348A
Authority
JP
Japan
Prior art keywords
layer
film
metal
electrode
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60089556A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0431178B2 (enExample
Inventor
Senhiko Yamada
山田　千彦
Hitoshi Fujino
仁 藤野
Makoto Arisawa
誠 有沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Priority to JP60089556A priority Critical patent/JPS61274348A/ja
Publication of JPS61274348A publication Critical patent/JPS61274348A/ja
Publication of JPH0431178B2 publication Critical patent/JPH0431178B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]

Landscapes

  • Wire Bonding (AREA)
JP60089556A 1985-04-25 1985-04-25 光電変換装置用配線基板の製造方法 Granted JPS61274348A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60089556A JPS61274348A (ja) 1985-04-25 1985-04-25 光電変換装置用配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60089556A JPS61274348A (ja) 1985-04-25 1985-04-25 光電変換装置用配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPS61274348A true JPS61274348A (ja) 1986-12-04
JPH0431178B2 JPH0431178B2 (enExample) 1992-05-25

Family

ID=13974093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60089556A Granted JPS61274348A (ja) 1985-04-25 1985-04-25 光電変換装置用配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPS61274348A (enExample)

Also Published As

Publication number Publication date
JPH0431178B2 (enExample) 1992-05-25

Similar Documents

Publication Publication Date Title
US7993509B2 (en) Manufacturing method of double-sided wiring glass substrate
US4640739A (en) Process of producing galvanic layers of solder of precise contour on inorganic substrates
US4978423A (en) Selective solder formation on printed circuit boards
US4964947A (en) Method of manufacturing double-sided wiring substrate
US4075416A (en) Electronic thin film circuit unit and method of making the same
JPS61274348A (ja) 光電変換装置用配線基板の製造方法
JPH04144190A (ja) 配線基板およびその製造方法
JPS6260662A (ja) サ−マルヘツドの製造方法
KR100764386B1 (ko) 고온공정에 적합한 절연구조체 및 그 제조방법
JPH0410235B2 (enExample)
JPS61255061A (ja) 光電変換装置用配線基板の製造方法
JPH0563340A (ja) 機能素子を有する配線板の製造法
US3554876A (en) Process for etching and electro plating a printed circuit
JPH0135515B2 (enExample)
JPH10294548A (ja) プリント配線板の製造方法およびそれを用いたプリント配線板
JPH05347212A (ja) 薄膜電子部品及びその製造方法
JP3140574B2 (ja) 電着基板および電着転写方法
JPH06342796A (ja) 突起電極の形成方法
JPH03214601A (ja) 可変抵抗器
GB2065380A (en) Electronic thin-film circuit and method of its fabrication
JPH0621651A (ja) 多層配線回路板及びその製造方法
JPS5938314B2 (ja) 厚膜ペ−ストのメツキ方法
JPH02198141A (ja) 半導体装置のバンプ電極の製造方法
JPS6210039B2 (enExample)
JPH0787205B2 (ja) ２層ｔａｂの製造方法