JPH043109B2 - - Google Patents

Info

Publication number
JPH043109B2
JPH043109B2 JP60134571A JP13457185A JPH043109B2 JP H043109 B2 JPH043109 B2 JP H043109B2 JP 60134571 A JP60134571 A JP 60134571A JP 13457185 A JP13457185 A JP 13457185A JP H043109 B2 JPH043109 B2 JP H043109B2
Authority
JP
Japan
Prior art keywords
wafer
wafer ring
ring
storage
storage portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60134571A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61292336A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13457185A priority Critical patent/JPS61292336A/ja
Publication of JPS61292336A publication Critical patent/JPS61292336A/ja
Publication of JPH043109B2 publication Critical patent/JPH043109B2/ja
Granted legal-status Critical Current

Links

JP13457185A 1985-06-20 1985-06-20 ウエハ−保持装置 Granted JPS61292336A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13457185A JPS61292336A (ja) 1985-06-20 1985-06-20 ウエハ−保持装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13457185A JPS61292336A (ja) 1985-06-20 1985-06-20 ウエハ−保持装置

Publications (2)

Publication Number Publication Date
JPS61292336A JPS61292336A (ja) 1986-12-23
JPH043109B2 true JPH043109B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-01-22

Family

ID=15131453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13457185A Granted JPS61292336A (ja) 1985-06-20 1985-06-20 ウエハ−保持装置

Country Status (1)

Country Link
JP (1) JPS61292336A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108872260A (zh) * 2017-05-11 2018-11-23 无锡华润安盛科技有限公司 晶圆检测治具及晶圆检测装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5169453A (en) * 1989-03-20 1992-12-08 Toyoko Kagaku Co., Ltd. Wafer supporting jig and a decompressed gas phase growth method using such a jig

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3976288A (en) * 1975-11-24 1976-08-24 Ibm Corporation Semiconductor wafer dicing fixture
JPS569976Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1976-12-13 1981-03-05
JPS5956742U (ja) * 1982-10-06 1984-04-13 ソニー株式会社 半導体素子取扱いリング

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108872260A (zh) * 2017-05-11 2018-11-23 无锡华润安盛科技有限公司 晶圆检测治具及晶圆检测装置
CN108872260B (zh) * 2017-05-11 2021-12-24 无锡华润安盛科技有限公司 晶圆检测治具及晶圆检测装置

Also Published As

Publication number Publication date
JPS61292336A (ja) 1986-12-23

Similar Documents

Publication Publication Date Title
US4778252A (en) Self-centering holder for objects of various sizes
CA2159560C (en) Tray for a component and an apparatus for accurately placing a component within the tray
JP2000323440A (ja) チャックテーブル
JPH043109B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
US5824388A (en) Clamping apparatus for imprinting disk-shaped information medium
JPH0536814A (ja) ウエハ移載装置
JP2001032871A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0795551B2 (ja) チップ供給装置
JP3368139B2 (ja) 電子ビーム描画装置用試料ステージ
US4646418A (en) Carrier for photomask substrate
US20040149804A1 (en) System and method for achieving planar alignment of a substrate during solder ball mounting for use in semiconductor fabrication
JP2901469B2 (ja) 基板搬送装置
JP2514956B2 (ja) ダイ供給方法およびトレイキヤリアダイ供給体
JPH0693472B2 (ja) ワイヤボンデイング装置
EP0458246B1 (en) Semiconductor manufacturing apparatus
JP2660559B2 (ja) 半導体ウエーハ用トレイ
JPH0129004Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP4117102B2 (ja) 電子部品の外部電極形成方法及び装置
JP2509202Y2 (ja) ウエハ貼付用フレ―ム
JPH0352725Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0632686Y2 (ja) 半導体チップ用ウェハの取付け装置
US4449282A (en) Assembling components such as lids to chip enclosures
JP4277545B2 (ja) 円盤状ワーク芯出し装置
JPH0423317Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0212067Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)