JPH0430745U - - Google Patents
Info
- Publication number
- JPH0430745U JPH0430745U JP7187490U JP7187490U JPH0430745U JP H0430745 U JPH0430745 U JP H0430745U JP 7187490 U JP7187490 U JP 7187490U JP 7187490 U JP7187490 U JP 7187490U JP H0430745 U JPH0430745 U JP H0430745U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- sealant
- encapsulated
- sandwiched
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000565 sealant Substances 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は従来の一実施例断面図、第２図は本考
案一実施例を示す断面図、第３図は本考案他の実
施例であり、ａは側面図、ｂ平面図である。１は
半導体チツプ、２は金属電極、３はリード線、４
は軟ろう、５は封止材、６はかん合端子を示す。
案一実施例を示す断面図、第３図は本考案他の実
施例であり、ａは側面図、ｂ平面図である。１は
半導体チツプ、２は金属電極、３はリード線、４
は軟ろう、５は封止材、６はかん合端子を示す。
Claims (1)
- 半導体チツプをリード線が貫通した金属電極で
挟み、かつ金属電極チツプを封止材で封入した半
導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7187490U JPH0430745U (ja) | 1990-07-05 | 1990-07-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7187490U JPH0430745U (ja) | 1990-07-05 | 1990-07-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0430745U true JPH0430745U (ja) | 1992-03-12 |
Family
ID=31609301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7187490U Pending JPH0430745U (ja) | 1990-07-05 | 1990-07-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0430745U (ja) |
-
1990
- 1990-07-05 JP JP7187490U patent/JPH0430745U/ja active Pending
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