JPH0317629U - - Google Patents
Info
- Publication number
- JPH0317629U JPH0317629U JP7748989U JP7748989U JPH0317629U JP H0317629 U JPH0317629 U JP H0317629U JP 7748989 U JP7748989 U JP 7748989U JP 7748989 U JP7748989 U JP 7748989U JP H0317629 U JPH0317629 U JP H0317629U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor chip
- resin
- tabs
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を組立て工程順に示
し、ａは樹脂封止前の状態を示す縦断面図、ｂは
樹脂封止後の状態を示す縦断面図、第２図は従来
の樹脂封止型半導体装置の一例を示す縦断面図で
ある。 １…半導体チツプ、２…タブ、３…ボンデイン
グワイヤ、４…封止樹脂部、５…リードフレーム
、６…電極。
し、ａは樹脂封止前の状態を示す縦断面図、ｂは
樹脂封止後の状態を示す縦断面図、第２図は従来
の樹脂封止型半導体装置の一例を示す縦断面図で
ある。 １…半導体チツプ、２…タブ、３…ボンデイン
グワイヤ、４…封止樹脂部、５…リードフレーム
、６…電極。
Claims (1)
- 電極群を有する半導体チツプと、タブを有しな
いリードフレームと、該リードフレームとこれに
対応する前記各電極とを電気的に接続するボンデ
イングワイヤと、上記各部品をモールドする封止
樹脂部とを備え、前記半導体チツプは前記リード
フレームと遊離した位置に設けられていることを
特徴とする樹脂封止型半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7748989U JPH0317629U (ja) | 1989-06-30 | 1989-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7748989U JPH0317629U (ja) | 1989-06-30 | 1989-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0317629U true JPH0317629U (ja) | 1991-02-21 |
Family
ID=31619923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7748989U Pending JPH0317629U (ja) | 1989-06-30 | 1989-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0317629U (ja) |
-
1989
- 1989-06-30 JP JP7748989U patent/JPH0317629U/ja active Pending