JPH0430688B2 - - Google Patents
Info
- Publication number
- JPH0430688B2 JPH0430688B2 JP61162045A JP16204586A JPH0430688B2 JP H0430688 B2 JPH0430688 B2 JP H0430688B2 JP 61162045 A JP61162045 A JP 61162045A JP 16204586 A JP16204586 A JP 16204586A JP H0430688 B2 JPH0430688 B2 JP H0430688B2
- Authority
- JP
- Japan
- Prior art keywords
- shield layer
- cable
- conductor
- cable core
- drain wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 31
- 239000012212 insulator Substances 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 8
- 238000001125 extrusion Methods 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- 239000002985 plastic film Substances 0.000 claims description 3
- 229920006255 plastic film Polymers 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
- Communication Cables (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16204586A JPS6319711A (ja) | 1986-07-11 | 1986-07-11 | シ−ルドリボンケ−ブル |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16204586A JPS6319711A (ja) | 1986-07-11 | 1986-07-11 | シ−ルドリボンケ−ブル |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6319711A JPS6319711A (ja) | 1988-01-27 |
| JPH0430688B2 true JPH0430688B2 (es) | 1992-05-22 |
Family
ID=15747041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16204586A Granted JPS6319711A (ja) | 1986-07-11 | 1986-07-11 | シ−ルドリボンケ−ブル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6319711A (es) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0531781Y2 (es) * | 1986-05-13 | 1993-08-16 | ||
| US5448126A (en) * | 1993-10-05 | 1995-09-05 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave-semiconductor composite device |
| JP3644631B2 (ja) * | 2000-12-21 | 2005-05-11 | 株式会社オートネットワーク技術研究所 | シールドケーブル |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5853114A (ja) * | 1981-09-25 | 1983-03-29 | 富士ゼロックス株式会社 | 両面シ−ルド付フラツトケ−ブル |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50121988U (es) * | 1974-03-22 | 1975-10-04 | ||
| JPS57161811U (es) * | 1981-04-03 | 1982-10-12 |
-
1986
- 1986-07-11 JP JP16204586A patent/JPS6319711A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5853114A (ja) * | 1981-09-25 | 1983-03-29 | 富士ゼロックス株式会社 | 両面シ−ルド付フラツトケ−ブル |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6319711A (ja) | 1988-01-27 |
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