JPH0430185B2 - - Google Patents

Info

Publication number
JPH0430185B2
JPH0430185B2 JP58028513A JP2851383A JPH0430185B2 JP H0430185 B2 JPH0430185 B2 JP H0430185B2 JP 58028513 A JP58028513 A JP 58028513A JP 2851383 A JP2851383 A JP 2851383A JP H0430185 B2 JPH0430185 B2 JP H0430185B2
Authority
JP
Japan
Prior art keywords
substrate
temperature
cap
chips
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58028513A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59155157A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2851383A priority Critical patent/JPS59155157A/ja
Publication of JPS59155157A publication Critical patent/JPS59155157A/ja
Publication of JPH0430185B2 publication Critical patent/JPH0430185B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2851383A 1983-02-24 1983-02-24 Ｉｃモジユ−ル Granted JPS59155157A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2851383A JPS59155157A (ja) 1983-02-24 1983-02-24 Ｉｃモジユ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2851383A JPS59155157A (ja) 1983-02-24 1983-02-24 Ｉｃモジユ−ル

Publications (2)

Publication Number Publication Date
JPS59155157A JPS59155157A (ja) 1984-09-04
JPH0430185B2 true JPH0430185B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-05-21

Family

ID=12250760

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2851383A Granted JPS59155157A (ja) 1983-02-24 1983-02-24 Ｉｃモジユ−ル

Country Status (1)

Country Link
JP (1) JPS59155157A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01248551A (ja) * 1988-03-30 1989-10-04 Toshiba Corp 半導体パッケージ
US5221860A (en) * 1991-02-19 1993-06-22 At&T Bell Laboratories High speed laser package
JP4745104B2 (ja) * 2006-03-31 2011-08-10 株式会社東芝 半導体素子パッケージ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS576834Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1976-06-23 1982-02-09

Also Published As

Publication number Publication date
JPS59155157A (ja) 1984-09-04

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