JPH0429571Y2 - - Google Patents
Info
- Publication number
- JPH0429571Y2 JPH0429571Y2 JP14238686U JP14238686U JPH0429571Y2 JP H0429571 Y2 JPH0429571 Y2 JP H0429571Y2 JP 14238686 U JP14238686 U JP 14238686U JP 14238686 U JP14238686 U JP 14238686U JP H0429571 Y2 JPH0429571 Y2 JP H0429571Y2
- Authority
- JP
- Japan
- Prior art keywords
- jig
- heat sink
- brazing
- outer ring
- metal outer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003780 insertion Methods 0.000 claims description 19
- 230000037431 insertion Effects 0.000 claims description 19
- 238000010438 heat treatment Methods 0.000 claims description 17
- 239000000919 ceramic Substances 0.000 claims description 7
- 238000005219 brazing Methods 0.000 description 30
- 239000002184 metal Substances 0.000 description 24
- 229910052751 metal Inorganic materials 0.000 description 24
- 239000000463 material Substances 0.000 description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910002077 partially stabilized zirconia Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14238686U JPH0429571Y2 (en, 2012) | 1986-09-17 | 1986-09-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14238686U JPH0429571Y2 (en, 2012) | 1986-09-17 | 1986-09-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6349247U JPS6349247U (en, 2012) | 1988-04-04 |
| JPH0429571Y2 true JPH0429571Y2 (en, 2012) | 1992-07-17 |
Family
ID=31051075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14238686U Expired JPH0429571Y2 (en, 2012) | 1986-09-17 | 1986-09-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0429571Y2 (en, 2012) |
-
1986
- 1986-09-17 JP JP14238686U patent/JPH0429571Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6349247U (en, 2012) | 1988-04-04 |
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