JPH0429166B2 - - Google Patents
Info
- Publication number
- JPH0429166B2 JPH0429166B2 JP16363185A JP16363185A JPH0429166B2 JP H0429166 B2 JPH0429166 B2 JP H0429166B2 JP 16363185 A JP16363185 A JP 16363185A JP 16363185 A JP16363185 A JP 16363185A JP H0429166 B2 JPH0429166 B2 JP H0429166B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- base layer
- electrical contact
- sulfidation
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005486 sulfidation Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 16
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 229910000510 noble metal Inorganic materials 0.000 claims description 7
- 230000001737 promoting effect Effects 0.000 claims description 7
- 238000005253 cladding Methods 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000005987 sulfurization reaction Methods 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 43
- 230000000694 effects Effects 0.000 description 9
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000009291 secondary effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- Contacts (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16363185A JPS6224509A (ja) | 1985-07-24 | 1985-07-24 | 電気接点 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16363185A JPS6224509A (ja) | 1985-07-24 | 1985-07-24 | 電気接点 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6224509A JPS6224509A (ja) | 1987-02-02 |
| JPH0429166B2 true JPH0429166B2 (enrdf_load_stackoverflow) | 1992-05-18 |
Family
ID=15777601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16363185A Granted JPS6224509A (ja) | 1985-07-24 | 1985-07-24 | 電気接点 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6224509A (enrdf_load_stackoverflow) |
-
1985
- 1985-07-24 JP JP16363185A patent/JPS6224509A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6224509A (ja) | 1987-02-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS61296800A (ja) | 設計変更用電極 | |
| JP2007019261A (ja) | 配線回路基板 | |
| JPH0429166B2 (enrdf_load_stackoverflow) | ||
| CN217426573U (zh) | 一种铜支撑件及电气组件 | |
| JP3838559B2 (ja) | 低い抵抗値を有するチップ抵抗器とその製造方法 | |
| JP3838560B2 (ja) | 低い抵抗値を有するチップ抵抗器とその製造方法 | |
| US5189275A (en) | Printed circuit assembly with contact dot | |
| JP4177308B2 (ja) | リード端子付き電子部品 | |
| JP2002313643A (ja) | インダクタ部品 | |
| JP2009043958A (ja) | チップ型金属板抵抗器およびその製造方法 | |
| JP3913121B2 (ja) | 低い抵抗値を有するチップ抵抗器の製造方法 | |
| JP2786921B2 (ja) | 可変抵抗器 | |
| JP2009088368A (ja) | 低抵抗チップ抵抗器の製造方法 | |
| JP4269816B2 (ja) | 複合電子部品の製造方法 | |
| JPH11238840A (ja) | リードフレーム | |
| JP2001210521A (ja) | チップインダクタ | |
| JP2004022920A (ja) | 低い抵抗値を有するチップ抵抗器とその製造方法 | |
| JPS604378Y2 (ja) | 端子 | |
| JPS6237837U (enrdf_load_stackoverflow) | ||
| JPH0146966B2 (enrdf_load_stackoverflow) | ||
| JPS643013B2 (enrdf_load_stackoverflow) | ||
| JP2005302585A (ja) | 回路保護素子およびその製造方法 | |
| JPS6060828U (ja) | 銀合金等の接点面を金合金等で完全に被覆した複合電気接点材 | |
| JPH06318417A (ja) | りん銅ろうを用いた接合部品 | |
| JPS626710Y2 (enrdf_load_stackoverflow) |