JPH04286352A - Electronic component package - Google Patents

Abstract

PURPOSE:To enhance an electronic component in electrical properties by a method wherein it is lessened in grounding resistance and thermal resistance. CONSTITUTION:External connection terminals 12 and 12', a flat metal plate 11, a first insulating layer 13 provided with an opening, a second insulating layer 14, and a metal ring layer 15 are successively formed to constitute an electronic package, where an electronic element 16 is mounted on the plane metal plate 11. For the wiring of the electronic element 16 concerned, conductive patterns 18 and 19 are formed on the first insulating layer 13 to connect the element 16 to the outside. Furthermore, the peripheral part of the openings of the insulating layers is soldered to hermetically seal the package concerned.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package used for hermetically sealing electronic devices such as ICs.

0002

2. Description of the Related Art A conventional package structure is shown in FIG.

[0003] First, second, and third layer ceramic substrates 1, 2, and 3 are laminated, and a nickel-plated metal ring 4 is brazed on top of the third layer ceramic substrate 3 at a temperature of about 800°C. has been done. Kovar is used as the metal ring material to prevent distortion and cracking due to differences in thermal expansion of ceramics.

A conductive pattern 7 is formed on the central surface of the first layer ceramic substrate 1 using a high melting point metal such as tungsten, and the package is connected to a connecting terminal portion 8 provided on the outside through the outer end surface of the package. has been done. A conductive pattern 7' made of a high melting point metal is also formed around the opening of the second layer ceramic substrate 2, and is connected to a connecting terminal section 8 provided on the outside of the package. Third layer ceramic substrate 3
has an opening larger than that of the second layer ceramic substrate 2.

[0005] The ceramic substrates 1, 2, and 3 of the first layer, second layer, and third layer are laminated at a temperature of approximately 1000° C. or higher and heat treated while being pressed together to obtain an airtight bond. It will be done. With such a package structure, the electronic device 5 such as an IC is adhesively fixed to the opening of the second layer ceramic substrate 2. Conductive pattern 7′ on second layer ceramic substrate 2
After connecting the electronic element 5 and the metal ring 4 with a thin gold wire 6, a metal lid 9 is placed over the metal ring 4. The metal material of the lid 9 is usually a nickel-plated Kovar plate, and the periphery of the metal ring is welded to hermetically seal the electronic element 5. By hermetically sealing the electronic element 5 in this manner, high reliability as an electronic component can be obtained, and the electronic element 5 can be incorporated into a printed circuit board or the like.

[0006]

[Problem to be Solved by the Invention] When such a package is assembled into a printed circuit board, etc., the back surface of the electronic element 5 is connected to the ground of the printed circuit board via the conductive pattern 7 in the center of the first layer ceramic substrate 1. connected to the circuit. In this case, the electrical characteristics may deteriorate due to the large electrical resistance and thermal resistance of the conductive pattern 7 of the first layer ceramic substrate 1.

[0007]

[Means for Solving the Problems] In order to solve these drawbacks, the present invention changes the structure of the package from the bottom to the external connection terminal plate, the flat metal plate, the first and second insulating layers having openings, and the metal ring. Layers are sequentially laminated, an electronic element is mounted on a flat metal plate on the bottom surface, a conductive pattern is formed on the first insulating layer for wiring, external connection is made with a through-hole structure, and openings in each of the insulating layers are formed. The periphery is sealed by brazing, and examples will be explained in detail below with reference to the drawings.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an embodiment of the present invention, showing a broken surface of a package.

Reference numeral 11 denotes a metal plate made of Kovar with a thickness of 0.2 mm, and a first alumina insulating substrate 1 with a thickness of about 0.5 mm.
3 is brazed around the opening to seal it. 12 connection terminal plates are also brazed around the opening of the first alumina insulating substrate 13. 12' is a connection terminal plate integrally formed with the metal plate 11.

A conductive pattern 18 is formed on the surface of the first alumina insulating substrate 13 using a high melting point metal such as tungsten.
Connection terminal plate 1 via package external connection pattern 19
It is connected to 2.

The second alumina insulating substrate 14 has a thickness of about 0.5 mm.
The thickness is 1 mm thicker than the opening of the first alumina insulating substrate 13.
It has a ~2mm large opening. The first alumina insulating substrate 13 and the second alumina insulating substrate 14 are pressed together while
An airtight bond can be obtained by heat treatment at a temperature of 00°C. The Kovar ring 15 is made by forming a Kovar metal plate with a thickness of about 0.5 mm into a ring shape with a width of about 0.5 mm, plated with nickel, and brazed around the opening of the second alumina insulating substrate 14. . Electronic device 16 such as IC
is adhesively fixed to the metal plate 11 in the opening of the first alumina insulating substrate 13 and assembled into an electronic component in the same manner as before.
Built into external circuits such as printed circuit boards.

FIG. 2 shows an example of an application using the package of the present invention, in which the metal plate 11 and the connection terminal plate 12' of FIG.
is formed integrally with a metal frame 22', and a plurality of packages 21 are connected to each other. The conductive pattern 23 on the first alumina substrate and the metal frame 22 are connected through the outer end surface of the package. After the electronic element is assembled into a package and hermetically sealed with a metal lid as in the conventional case, the metal frames 22, 22' are separated from the package and used as an electronic component. In this example, package 21
are aligned, so a large amount of electronic devices can be packaged 2
There is an advantage that the number of steps required for assembly into the alumina substrate opening 24 of No. 1 is reduced. In this way, the package of the present invention has a structure in which the electronic element is adhesively fixed to a metal plate with low electrical resistance and thermal resistance. The resistance can be significantly reduced.

[0013]

[Effects of the Invention] As explained above, by using a metal plate on the bottom of the package, it can be used as an electrical component.
When incorporated into a circuit board such as a C board, ground resistance and thermal resistance can be reduced, and electrical characteristics can be improved.

[Brief explanation of the drawing]

FIG. 1 is a cutaway view showing one embodiment of the present invention.

FIG. 2 is an application example using the package of the present invention.

FIG. 3 is a cutaway view of a conventional example.

[Explanation of symbols]

11 Metal plate 12 Connection terminal board 12´　　Connection terminal board 13 First alumina insulating substrate 14 Second alumina insulating substrate 15 Kovar Ring 16 Electronic elements 17 Gold wire 18 Conductive pattern 19 External connection pattern 21 Package 22 Metal frame 22´　　Metal frame 23 Conductive pattern 24 Alumina substrate opening

Claims (2)

[Claims] Claim 1: The first layer is an external connection terminal plate and a flat metal plate, the second layer is a first insulating layer having an opening, and the third layer is a first insulating layer with an opening.
In an electronic component package having a structure in which four layers are stacked, the second insulating layer having an opening larger than the opening in the insulating layer, and the fourth layer being a metal ring layer, the flat metal plate on the bottom surface is The opening of the insulating layer is soldered around the opening to seal it, and the external connection terminal board is also connected to the first
The first insulating layer is brazed around the opening of the insulating layer, and the first insulating layer has a conductive pattern formed on its surface that is conductive to the outside of the package, and is connected to the external connection terminal board with a through-hole structure. An electronic component package characterized in that the insulating layers are bonded around the opening in the first insulating layer, and the metal ring layer is brazed around the opening in the second insulating layer. 2. The electronic component package according to claim 1, wherein the bottom plane metal plate is integrally formed with at least one external connection terminal plate.