JPH0428446U - - Google Patents
Info
- Publication number
- JPH0428446U JPH0428446U JP1990069734U JP6973490U JPH0428446U JP H0428446 U JPH0428446 U JP H0428446U JP 1990069734 U JP1990069734 U JP 1990069734U JP 6973490 U JP6973490 U JP 6973490U JP H0428446 U JPH0428446 U JP H0428446U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- sealed semiconductor
- mesh
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W74/00—
-
- H10W90/756—
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990069734U JPH0428446U (enExample) | 1990-06-29 | 1990-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990069734U JPH0428446U (enExample) | 1990-06-29 | 1990-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0428446U true JPH0428446U (enExample) | 1992-03-06 |
Family
ID=31605293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990069734U Pending JPH0428446U (enExample) | 1990-06-29 | 1990-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0428446U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006126441A1 (ja) * | 2005-05-26 | 2006-11-30 | Murata Manufacturing Co., Ltd. | 電子部品用パッケージ、このパッケージを使用した電子部品、および電子部品用パッケージの製造方法 |
| JP2008124510A (ja) * | 2008-02-12 | 2008-05-29 | Matsushita Electric Ind Co Ltd | 樹脂封止型半導体装置 |
| CN102110670A (zh) * | 2009-12-28 | 2011-06-29 | 株式会社村田制作所 | 电子部件装置及引线框 |
-
1990
- 1990-06-29 JP JP1990069734U patent/JPH0428446U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006126441A1 (ja) * | 2005-05-26 | 2006-11-30 | Murata Manufacturing Co., Ltd. | 電子部品用パッケージ、このパッケージを使用した電子部品、および電子部品用パッケージの製造方法 |
| EP1885171A4 (en) * | 2005-05-26 | 2010-11-03 | Murata Manufacturing Co | HOUSING FOR AN ELECTRONIC COMPONENT, ELECTRONIC COMPONENT COMPRISING SUCH A HOUSING AND METHOD FOR MANUFACTURING A HOUSING FOR AN ELECTRONIC COMPONENT |
| JP2008124510A (ja) * | 2008-02-12 | 2008-05-29 | Matsushita Electric Ind Co Ltd | 樹脂封止型半導体装置 |
| CN102110670A (zh) * | 2009-12-28 | 2011-06-29 | 株式会社村田制作所 | 电子部件装置及引线框 |