JPH01146544U - - Google Patents
Info
- Publication number
- JPH01146544U JPH01146544U JP1988043105U JP4310588U JPH01146544U JP H01146544 U JPH01146544 U JP H01146544U JP 1988043105 U JP1988043105 U JP 1988043105U JP 4310588 U JP4310588 U JP 4310588U JP H01146544 U JPH01146544 U JP H01146544U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- semiconductor device
- semiconductor
- die
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Die Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988043105U JPH01146544U (enExample) | 1988-03-31 | 1988-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988043105U JPH01146544U (enExample) | 1988-03-31 | 1988-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01146544U true JPH01146544U (enExample) | 1989-10-09 |
Family
ID=31269506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988043105U Pending JPH01146544U (enExample) | 1988-03-31 | 1988-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01146544U (enExample) |
-
1988
- 1988-03-31 JP JP1988043105U patent/JPH01146544U/ja active Pending