JPH0427572U - - Google Patents
Info
- Publication number
- JPH0427572U JPH0427572U JP6928990U JP6928990U JPH0427572U JP H0427572 U JPH0427572 U JP H0427572U JP 6928990 U JP6928990 U JP 6928990U JP 6928990 U JP6928990 U JP 6928990U JP H0427572 U JPH0427572 U JP H0427572U
- Authority
- JP
- Japan
- Prior art keywords
- connector
- surface mount
- circuit board
- wiring layer
- multilayer circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案による一実施例の側断面図、第
２図は第１図の表面実装コネクタの側断面図、第
３図は他の実装状態を示す側断面図である。
図において、１は表面実装コネクタ、１ａはコ
ネクタ本体、１ａ−１は取付孔、１ａ−２はリー
ドピン、１ａ−３は凹状切欠き、２は多層回路基
板、２ａは第１配線層、２ｂは第２配線層、２ｇ
は盲孔をそれぞれ示す。
FIG. 1 is a side sectional view of one embodiment of the present invention, FIG. 2 is a side sectional view of the surface mount connector of FIG. 1, and FIG. 3 is a side sectional view showing another mounting state. In the figure, 1 is a surface mount connector, 1a is a connector body, 1a-1 is a mounting hole, 1a-2 is a lead pin, 1a-3 is a concave notch, 2 is a multilayer circuit board, 2a is a first wiring layer, and 2b is a 2nd wiring layer, 2g
indicate blind holes, respectively.
Claims (1)
り垂直に僅かに突出するリードピン１ａ−２と該
リードピン１ａ−２の根元に空間を形成する凹状
切欠き１ａ−３とを備えるコネクタ本体１ａでな
る表面実装コネクタ１と、該表面実装コネクタ１
のリードピン１ａ−２を第１配線層２ａから第２
配線層２ｂ間の盲孔２ｇに挿入しリフロー半田付
け接続する多層回路基板２とで構成することを特
徴とするコネクタの表面実装構造。 A connector main body 1a comprising a mounting hole 1a-1 to a multilayer circuit board 2, a lead pin 1a-2 slightly protruding perpendicularly from the mounting surface, and a concave notch 1a-3 forming a space at the base of the lead pin 1a-2. a surface mount connector 1 consisting of the surface mount connector 1;
The lead pins 1a-2 are connected from the first wiring layer 2a to the second wiring layer 2a.
A surface mount structure of a connector comprising a multilayer circuit board 2 inserted into a blind hole 2g between wiring layers 2b and connected by reflow soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6928990U JPH0427572U (en) | 1990-06-28 | 1990-06-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6928990U JPH0427572U (en) | 1990-06-28 | 1990-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0427572U true JPH0427572U (en) | 1992-03-04 |
Family
ID=31604457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6928990U Pending JPH0427572U (en) | 1990-06-28 | 1990-06-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0427572U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01173581A (en) * | 1987-12-28 | 1989-07-10 | Elco Internatl:Kk | Connector |
| JPH01243492A (en) * | 1988-03-24 | 1989-09-28 | Nec Corp | Surface mounting multilayer printed wiring sheet |
-
1990
- 1990-06-28 JP JP6928990U patent/JPH0427572U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01173581A (en) * | 1987-12-28 | 1989-07-10 | Elco Internatl:Kk | Connector |
| JPH01243492A (en) * | 1988-03-24 | 1989-09-28 | Nec Corp | Surface mounting multilayer printed wiring sheet |