JPH0427177Y2 - - Google Patents

Info

Publication number
JPH0427177Y2
JPH0427177Y2 JP1986102017U JP10201786U JPH0427177Y2 JP H0427177 Y2 JPH0427177 Y2 JP H0427177Y2 JP 1986102017 U JP1986102017 U JP 1986102017U JP 10201786 U JP10201786 U JP 10201786U JP H0427177 Y2 JPH0427177 Y2 JP H0427177Y2
Authority
JP
Japan
Prior art keywords
resin
optical semiconductor
lens
pedestal
molded optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986102017U
Other languages
English (en)
Japanese (ja)
Other versions
JPS639165U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986102017U priority Critical patent/JPH0427177Y2/ja
Publication of JPS639165U publication Critical patent/JPS639165U/ja
Application granted granted Critical
Publication of JPH0427177Y2 publication Critical patent/JPH0427177Y2/ja
Priority to US08/305,777 priority patent/USRE35713E/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
    • G11B33/125—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a plurality of recording/reproducing devices, e.g. modular arrangements, arrays of disc drives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP1986102017U 1986-07-04 1986-07-04 Expired JPH0427177Y2 (enExample)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1986102017U JPH0427177Y2 (enExample) 1986-07-04 1986-07-04
US08/305,777 USRE35713E (en) 1986-07-04 1994-09-14 Disc recording and/or reproducing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986102017U JPH0427177Y2 (enExample) 1986-07-04 1986-07-04

Publications (2)

Publication Number Publication Date
JPS639165U JPS639165U (enExample) 1988-01-21
JPH0427177Y2 true JPH0427177Y2 (enExample) 1992-06-30

Family

ID=30973280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986102017U Expired JPH0427177Y2 (enExample) 1986-07-04 1986-07-04

Country Status (2)

Country Link
US (1) USRE35713E (enExample)
JP (1) JPH0427177Y2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5748404A (en) * 1995-09-18 1998-05-05 Alps Electric Co., Ltd. Magnetic recording/reproducing device with chassis support structure
JP3659635B2 (ja) * 2001-04-10 2005-06-15 株式会社東芝 光半導体装置
JP2008258414A (ja) * 2007-04-05 2008-10-23 Rohm Co Ltd 半導体パッケージ
JP7513900B2 (ja) * 2021-02-17 2024-07-10 日亜化学工業株式会社 発光装置及び光源装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4367502A (en) * 1980-04-11 1983-01-04 Shugart Technology Fixed hard disc drive assembly and clean air system
JPS59177760A (ja) * 1983-03-28 1984-10-08 Toshiba Corp 磁気デイスク装置
US4754397A (en) * 1985-02-15 1988-06-28 Tandem Computers Incorporated Fault tolerant modular subsystems for computers

Also Published As

Publication number Publication date
JPS639165U (enExample) 1988-01-21
USRE35713E (en) 1998-01-13

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