JPH0426798B2 - - Google Patents
Info
- Publication number
- JPH0426798B2 JPH0426798B2 JP61183733A JP18373386A JPH0426798B2 JP H0426798 B2 JPH0426798 B2 JP H0426798B2 JP 61183733 A JP61183733 A JP 61183733A JP 18373386 A JP18373386 A JP 18373386A JP H0426798 B2 JPH0426798 B2 JP H0426798B2
- Authority
- JP
- Japan
- Prior art keywords
- alumina
- dielectric constant
- glass
- borosilicate glass
- green sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 21
- 239000005388 borosilicate glass Substances 0.000 claims description 13
- 239000002241 glass-ceramic Substances 0.000 claims description 12
- 238000010304 firing Methods 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 4
- 239000011230 binding agent Substances 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 239000004615 ingredient Substances 0.000 claims description 2
- 239000002075 main ingredient Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 230000010365 information processing Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18373386A JPS6340397A (ja) | 1986-08-05 | 1986-08-05 | ガラスセラミツク多層回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18373386A JPS6340397A (ja) | 1986-08-05 | 1986-08-05 | ガラスセラミツク多層回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6340397A JPS6340397A (ja) | 1988-02-20 |
| JPH0426798B2 true JPH0426798B2 (de) | 1992-05-08 |
Family
ID=16141019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18373386A Granted JPS6340397A (ja) | 1986-08-05 | 1986-08-05 | ガラスセラミツク多層回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6340397A (de) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59178752A (ja) * | 1983-03-30 | 1984-10-11 | Hitachi Ltd | 多層配線基板 |
| JPS59207851A (ja) * | 1983-05-06 | 1984-11-26 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | 多層回路内の誘電ガラス及びそれを含む厚膜回路 |
| JPS6030196A (ja) * | 1983-07-28 | 1985-02-15 | 富士通株式会社 | 多層回路基板の製造方法 |
-
1986
- 1986-08-05 JP JP18373386A patent/JPS6340397A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59178752A (ja) * | 1983-03-30 | 1984-10-11 | Hitachi Ltd | 多層配線基板 |
| JPS59207851A (ja) * | 1983-05-06 | 1984-11-26 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | 多層回路内の誘電ガラス及びそれを含む厚膜回路 |
| JPS6030196A (ja) * | 1983-07-28 | 1985-02-15 | 富士通株式会社 | 多層回路基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6340397A (ja) | 1988-02-20 |
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