JPH0426551B2 - - Google Patents

Info

Publication number
JPH0426551B2
JPH0426551B2 JP60178890A JP17889085A JPH0426551B2 JP H0426551 B2 JPH0426551 B2 JP H0426551B2 JP 60178890 A JP60178890 A JP 60178890A JP 17889085 A JP17889085 A JP 17889085A JP H0426551 B2 JPH0426551 B2 JP H0426551B2
Authority
JP
Japan
Prior art keywords
electronic component
substrate
heat sink
sealing
metallized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60178890A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6239042A (ja
Inventor
Michinori Shiina
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP60178890A priority Critical patent/JPS6239042A/ja
Publication of JPS6239042A publication Critical patent/JPS6239042A/ja
Publication of JPH0426551B2 publication Critical patent/JPH0426551B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60178890A 1985-08-14 1985-08-14 電子部品の実装方法 Granted JPS6239042A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60178890A JPS6239042A (ja) 1985-08-14 1985-08-14 電子部品の実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60178890A JPS6239042A (ja) 1985-08-14 1985-08-14 電子部品の実装方法

Publications (2)

Publication Number Publication Date
JPS6239042A JPS6239042A (ja) 1987-02-20
JPH0426551B2 true JPH0426551B2 (enExample) 1992-05-07

Family

ID=16056486

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60178890A Granted JPS6239042A (ja) 1985-08-14 1985-08-14 電子部品の実装方法

Country Status (1)

Country Link
JP (1) JPS6239042A (enExample)

Also Published As

Publication number Publication date
JPS6239042A (ja) 1987-02-20

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