JPH0426546U - - Google Patents
Info
- Publication number
- JPH0426546U JPH0426546U JP6754190U JP6754190U JPH0426546U JP H0426546 U JPH0426546 U JP H0426546U JP 6754190 U JP6754190 U JP 6754190U JP 6754190 U JP6754190 U JP 6754190U JP H0426546 U JPH0426546 U JP H0426546U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- semiconductor element
- accommodating
- wiring layer
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990067541U JP2514094Y2 (ja) | 1990-06-26 | 1990-06-26 | 半導体素子収納用パッケ―ジ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990067541U JP2514094Y2 (ja) | 1990-06-26 | 1990-06-26 | 半導体素子収納用パッケ―ジ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0426546U true JPH0426546U (ru) | 1992-03-03 |
JP2514094Y2 JP2514094Y2 (ja) | 1996-10-16 |
Family
ID=31601200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990067541U Expired - Lifetime JP2514094Y2 (ja) | 1990-06-26 | 1990-06-26 | 半導体素子収納用パッケ―ジ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2514094Y2 (ru) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11251488A (ja) * | 1998-03-05 | 1999-09-17 | Sumitomo Metal Electronics Devices Inc | セラミックパッケージ |
JP2001110941A (ja) * | 1999-10-06 | 2001-04-20 | Meito Chin | 半導体デバイス |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63261862A (ja) * | 1987-04-20 | 1988-10-28 | Sumitomo Electric Ind Ltd | 半導体装置 |
-
1990
- 1990-06-26 JP JP1990067541U patent/JP2514094Y2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63261862A (ja) * | 1987-04-20 | 1988-10-28 | Sumitomo Electric Ind Ltd | 半導体装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11251488A (ja) * | 1998-03-05 | 1999-09-17 | Sumitomo Metal Electronics Devices Inc | セラミックパッケージ |
JP2001110941A (ja) * | 1999-10-06 | 2001-04-20 | Meito Chin | 半導体デバイス |
Also Published As
Publication number | Publication date |
---|---|
JP2514094Y2 (ja) | 1996-10-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |