JPH0424845B2 - - Google Patents
Info
- Publication number
- JPH0424845B2 JPH0424845B2 JP58087029A JP8702983A JPH0424845B2 JP H0424845 B2 JPH0424845 B2 JP H0424845B2 JP 58087029 A JP58087029 A JP 58087029A JP 8702983 A JP8702983 A JP 8702983A JP H0424845 B2 JPH0424845 B2 JP H0424845B2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- electronic component
- insulating plate
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 31
- 238000007789 sealing Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 3
- 239000013013 elastic material Substances 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 description 29
- 229910052782 aluminium Inorganic materials 0.000 description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 239000011888 foil Substances 0.000 description 10
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 238000007788 roughening Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000007743 anodising Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8702983A JPS59211213A (ja) | 1983-05-17 | 1983-05-17 | 電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8702983A JPS59211213A (ja) | 1983-05-17 | 1983-05-17 | 電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59211213A JPS59211213A (ja) | 1984-11-30 |
| JPH0424845B2 true JPH0424845B2 (pt) | 1992-04-28 |
Family
ID=13903522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8702983A Granted JPS59211213A (ja) | 1983-05-17 | 1983-05-17 | 電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59211213A (pt) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0310666Y2 (pt) * | 1984-12-26 | 1991-03-15 | ||
| JPS61194706A (ja) * | 1985-02-22 | 1986-08-29 | 松下電器産業株式会社 | チツプアルミ電解コンデンサ |
| JPS62122332U (pt) * | 1986-01-22 | 1987-08-03 | ||
| US5880926A (en) * | 1996-04-19 | 1999-03-09 | Nichicon Corporation | Electronic device with mounting structure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4001656A (en) * | 1974-12-27 | 1977-01-04 | P. R. Mallory & Co., Inc. | Capacitor having a plurality of anode risers for low impedance at high frequency |
| JPS5239155U (pt) * | 1975-09-11 | 1977-03-19 |
-
1983
- 1983-05-17 JP JP8702983A patent/JPS59211213A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4001656A (en) * | 1974-12-27 | 1977-01-04 | P. R. Mallory & Co., Inc. | Capacitor having a plurality of anode risers for low impedance at high frequency |
| JPS5239155U (pt) * | 1975-09-11 | 1977-03-19 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59211213A (ja) | 1984-11-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS60245115A (ja) | アルミ電解コンデンサ | |
| JPS60245116A (ja) | アルミ電解コンデンサ | |
| JPH0424845B2 (pt) | ||
| JPH0419695B2 (pt) | ||
| JPS60148104A (ja) | アルミ電解コンデンサ | |
| JPH0459767B2 (pt) | ||
| JPS6357937B2 (pt) | ||
| JPH0230170B2 (ja) | Denshibuhin | |
| JP3506738B2 (ja) | 面実装型固体電解コンデンサの構造 | |
| JP2965588B2 (ja) | 面実装用電解コンデンサ | |
| JPH0310220B2 (pt) | ||
| JPH0368530B2 (pt) | ||
| JPH0256806B2 (pt) | ||
| JPH0466375B2 (pt) | ||
| JPH0257696B2 (pt) | ||
| JPH0353492Y2 (pt) | ||
| JPH0217624A (ja) | 電子部品 | |
| JPH0251245B2 (pt) | ||
| JPH0251246B2 (pt) | ||
| JPH01150315A (ja) | チップ形固体電解コンデンサ | |
| JPH026213B2 (pt) | ||
| JPH0249530B2 (ja) | Denshibuhin | |
| JPH0230171B2 (ja) | Denshibuhin | |
| JPH0251247B2 (pt) | ||
| JPH0544813B2 (pt) |