JPH042483Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to an improvement of a high frequency circuit board used in a microwave FET amplifier or the like.

[Technical background of the invention]

According to the conventional circuit board of this type, as shown in FIG. . . are provided and conductively connected to the microstrip line 2 through an appropriate number of metal foils 5 of the island-like patterns 4 . Further, as shown in FIGS. 2 to 4, microstrip lines 12a and island-shaped conductive patterns 12 provided on the substrate body 11
b. A metal cylindrical body 15 is provided to conductively connect the conductive path made of the FET 13 and the ground pattern section 14 provided on the back surface of the substrate main body 11 to a part of the island-shaped conductive pattern 12b, or a fourth As shown in the figure, there is a device in which a metal rivet 16 is provided on the board body 11 to conductively connect the microstrip line 12a and the ground pattern section 14 provided on the back surface of the board body 11. .

[Problems with background technology]

However, according to the former structure using the metal foil 5, the microstrip line 2 and the island pattern 4 are formed by solder.
The metal foil 5 is instantaneously melted by a trowel heated from the upper surface of the metal foil 5 and adhered to the back surface of the metal foil 5. Attachment condition is metal foil 5
It was difficult to check from above, and it was easy to cause soldering defects. Furthermore, since the metal foil 5 is small and lightweight, it is extremely troublesome to hold it in place and solder it. Furthermore, in the case of the latter structure using the metal cylinder 15 or the metal rivet 16, a through hole is formed in the substrate body 11 in advance, and the metal cylinder 15 or the metal rivet 16 is formed in advance.
Because the base material was caulked using a specified tool, there were drawbacks such as the fact that these operations required considerable effort.

[Purpose of invention]

This invention was devised in view of the above points,
The above-mentioned drawbacks of the prior art are eliminated by electrically connecting conductive parts such as the microstrip line and the adjustment island pattern with a conductive member in the form of a blind.

[Example of idea]

An embodiment of the present invention shown in FIGS. 5 to 8 will be described below. Reference numeral 21 denotes a high frequency circuit board, which includes a board main body 22 on which microstrip lines are formed, and a board for fixing this board main body 22. The carrier plate 23 contains an envelope approximately in the center.
A hole 23a is provided in which the FET 24 is placed with the lid (not shown) facing down. Board body 22
On the top surface, adjustment island patterns (hereinafter referred to as island patterns) 50, 50 provided at the edges of the holes are connected to the grounding pattern section 22a on the back surface by through holes or metal foils 25, 25 as shown in the figure. ing. Therefore, the first source lead 24a and the second source lead 24b of the enveloped FET 24 are connected to the metal foils 25, 25, respectively, and the gate lead 26 and drain lead 27 are connected to the input side microstrip line 28, respectively. It is connected to the output side microstrip line 29. Note that the input side microstrip line 28 and the output side microstrip line 29 have pattern portions 3 at their ends.
0, 31, upper surface ground pattern portion 3 to be described later
4 are connected to high impedance lines 32 and 33. Further, the upper surface ground pattern portion 34 and the lower surface ground pattern portion 35 are the metal foils 25, 2.
5. 42... and 43... are a group of island-like patterns provided in large numbers in the vicinity of the microstrip lines 28 and 29, in which a glazed conductive member 14 (described later) is connected to the microstrip line 28 and an island (described later). It is implanted between the shaped pattern 42a and electrically connects the two. Furthermore, the input side microstrip line 28 and the output side microstrip line 29 include a high impedance line 32 and a pattern section 30.
The FET 24 is operated by applying a gate bias voltage (VG) to the lead 37 from the connection part of the high impedance line 33 and a drain bias voltage (VDD) to the lead 38 from the connection part of the high impedance line 33 and the pattern part 31.

That is, as shown in Fig. 7, FET2
The source 39 of 4 is grounded as it is, and the gate 40
The pattern section 30 is connected to the pattern section 30 via a coil 47, and a battery 45 is connected in parallel thereto. Further, a pattern portion 28a having one end grounded is fixedly connected to the coil 48 in parallel with these circuits. On the other hand, the pattern portion 3 is connected to the drain 41 via the coil 49.
1 and a battery 46 is connected in parallel thereto. Further, the pattern portion 29a is fixedly connected in parallel with these circuits via the coil 50. Note that 42a... and 43a... are island-shaped patterns each having one end grounded and arranged so as to be connected to the gate 40 side and the drain 41 side of the FET 24. Here, the island pattern groups 42 and 43 are each island pattern 42a... and 43a.
Each of them has a predetermined capacitor capacity equivalently, and these island patterns 4
2a..., 43a... are connected to the input-side microstrip line 28, the output-side microstrip line 29, or both via the conductive member 44 and fixedly connected. A desired capacitor capacity is selected in cooperation with the connected pattern member 30 or 31. When the microwave FET amplifier configured in this manner is used as a preamplifier on the microwave receiving side, for example, the island patterns 42a... 43a... is selected.

Next, the conductive member 44 will be explained.
In the island pattern 42a or 43a of the island pattern group 42, as shown in FIG. Connected. The conductive member 44 is connected by extending its legs 44a, 44a across the input side microstrip line 28 and the island-like pattern 42a, and then driving the head 44b into the conductive member 44 by hitting it or the like. be.

Therefore, a desired capacitor capacity can be obtained as a high frequency circuit, and a high frequency output signal having a desired gain and frequency can be obtained.

[Effect of idea]

According to the present invention, in order to conductively contact the microstrip line and the adjustment island pattern having capacitor capacitance as described above, a conductive member in the form of a blind is used and this is simply implanted. Therefore, the work is extremely easy, and the contact state can be firmly connected to the microstrip line and the island pattern by the legs of the conductive member. Therefore, very good results can be obtained without causing poor contact.

[Brief explanation of the drawing]

1 to 4 are diagrams showing conventional examples; FIG. 1 is a plan view showing main parts of a high frequency circuit board; FIG. 2 is a plan view showing main parts of a high frequency circuit board showing another example;
Figure 3 is an enlarged sectional view taken along the - line in Figure 2.
FIG. 4 is a diagram corresponding to FIG. 3 showing another example. Figures 5 to 8 are diagrams showing the present invention, and Figure 5 is a plan view of the circuit board of the microwave FET amplifier;
6 is a sectional view taken along the - line in FIG. 5, FIG. 7 is an electric circuit diagram of the microwave FET amplifier in FIG. 5, and FIG. 8 is an enlarged sectional view taken along the - line in FIG. FIG. 9 is an enlarged sectional view taken along the - line in FIG. 5. 21... High frequency circuit board, 22... Board body,
23...Carrier plate, 24...FET, 2
8... Input side microstrip line, 29...
Output side microstrip line, 42, 43...
Adjustment island pattern group, 42a, 43a...adjustment island pattern, 44, 51...conductive member.

Claims (1)

[Scope of utility model registration request] In a high frequency circuit board having a microstrip line and an island pattern for adjustment on its surface, the board body is inserted from the side of the island pattern for adjustment so as to conductively connect the microstrip line and the island pattern for adjustment. On the other hand, a high-frequency circuit board is characterized by being formed by implanting a glazing-like conductive member.