JP2501869Y2 - Negative power supply high frequency integrated circuit mounting structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a mounting structure of an integrated circuit chip, and more particularly to a mounting structure of a high frequency integrated circuit in which a reference potential is a negative potential.

[Conventional technology]

Conventionally, the structure for mounting the negative power supply high frequency integrated circuit chip 1 of this type is such that the integrated circuit chip 1 is mounted on the negative power supply pattern of the integrated circuit mounting substrate 3 as shown in FIG. The potential has a mounting structure in which the AC power supply is grounded through the chip capacitor 5 and the through hole 4 on the integrated circuit board from the negative power source pattern. Also,
In the figure, 6 is a microchip capacitor.

[Problems to be solved by the device]

The mounting of the above-described conventional negative power supply high frequency integrated circuit chip 1 is configured such that the reference potential of the high frequency integrated circuit chip is AC grounded via the negative power supply pattern (conductor pattern) of the integrated circuit mounting substrate 3 and the chip capacitor 5. Therefore, especially in a high frequency region exceeding GHz, the negative power supply pattern (conductor pattern) and the chip capacitor 5 have parasitic capacitance and inductance, and therefore the AC grounding of the reference potential is insufficient. The insulation between input / output terminals of the integrated circuit cannot be maintained, which may cause oscillation or crosstalk. Further, since the chip capacitor is used as a bypass capacitor, there is a drawback that the mounting scale becomes large.

An object of the present invention is to provide a negative power supply high frequency integrated circuit mounting structure that solves the above problems.

[Means for solving the problem]

To achieve the above object, a negative power supply high frequency integrated circuit packaging structure according to the present invention comprises a negative power supply high frequency integrated circuit chip,
A negative power supply high frequency integrated circuit mounting structure having a negative power supply high frequency integrated circuit mounting base capacitor and an integrated circuit mounting substrate, wherein the negative power supply high frequency integrated circuit chip is a surface electrode of the negative power supply high frequency integrated circuit mounting base capacitor. Negative power supply The pedestal capacitor for high frequency integrated circuit mounting has the back surface electrode mounted on the conductor pattern of the integrated circuit mounting board, and the integrated circuit mounting board is the negative power supply mounted on the substrate. A backside electrode of a pedestal capacitor for mounting a high frequency integrated circuit is connected to a ground plane on the backside of the substrate through a through hole provided in the substrate.

〔Example〕

 Next, the present invention will be described with reference to the drawings.

1 (a) and 1 (b) are views showing an embodiment of the present invention.

The negative power supply high frequency integrated circuit chip 1 is mounted on the surface electrode of a negative power supply integrated circuit mounting pedestal capacitor 2 having a thin plate parallel plate structure made of a high dielectric constant dielectric material. The electrodes are mounted and are connected to the back surface ground plane by through holes 4 on the integrated circuit mounting substrate 3. 5 is a chip capacitor.

[Effect of device]

As described above, according to the present invention, by mounting the negative power supply high frequency integrated circuit chip on the capacitor, it becomes possible to ground the reference potential surface of the integrated circuit chip in an AC manner in the immediate vicinity, and the input / output terminals of the high frequency integrated circuit. The insulation between them is maintained, high-frequency characteristics are improved, and the mounting scale can be reduced.

[Brief description of drawings]

FIG. 1 (a) is an exploded perspective view showing an embodiment of the present invention,
2B is a plan view of the same, and FIG. 2 is a plan view showing a mounting structure of a conventional negative power supply high frequency integrated circuit. 1 ... Negative power supply high frequency integrated circuit chip 2 ... Negative power supply integrated circuit mounting base capacitor 3 ... Integrated circuit mounting substrate 4 ... Through hole 5 ... Chip capacitor 6 ... Microchip capacitor

Claims (1)

(57) [Scope of utility model registration request] 1. A negative power supply high frequency integrated circuit mounting structure comprising a negative power supply high frequency integrated circuit chip, a negative power supply high frequency integrated circuit mounting base capacitor, and an integrated circuit mounting substrate, wherein the negative power supply high frequency integrated circuit chip comprises: Negative power supply high frequency integrated circuit mounting pedestal capacitor is mounted on the front surface electrode, and negative power supply high frequency integrated circuit mounting pedestal capacitor has the back surface electrode mounted on the conductor pattern of the integrated circuit mounting board. The circuit mounting board is characterized in that a back surface electrode of a pedestal capacitor for mounting a negative power supply high frequency integrated circuit mounted on the board is connected to a ground plane on the back surface of the board by a through hole provided in the board. Power supply high frequency integrated circuit packaging structure.