JPS6017896Y2 - Through-type electronic component array - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a feedthrough electronic component array in which a plurality of feedthrough capacitors are formed on the same substrate.

2. Description of the Related Art Feedthrough capacitor arrays in which a plurality of feedthrough capacitors are formed on a Ti-Ba-based or Ti-based ceramic capacitor substrate are conventionally known.

Figure 1 shows one such conventional feedthrough capacitor array.
Give an example.

In this figure, reference numeral 1 denotes a Ti-mountain type or Ti-based high dielectric constant ceramic capacitor substrate, on one side of this substrate 1, a plurality of first electrodes 2 are formed, and on the other side, a first electrode 2 is formed.
A second electrode 3 facing electrode 2 is formed.

Further, a plurality of through terminals 4 are provided so as to penetrate through the substrate 1, and the through terminals 4 are connected to the first electrode 2.

The second electrodes 3 are connected in common as necessary.

A feedthrough capacitor array as shown in Figure 1 is used for purposes such as being incorporated into a connector to form a connector with a filter or mounted on the board of an electronic device, but it has the following drawbacks. ing.

(1) Strength is low because a Ti-Ba or Ti-based ceramic capacitor substrate 1 with a high dielectric constant is used.

Therefore, the board 1 itself cannot be used as a board for a connector.

(2) The first electrode 2, the second electrode 3, and the through terminal 4 on both sides of the substrate 1 form respective feedthrough capacitors, but this is not possible in terms of the thickness, area, and dielectric constant of the substrate 1. There is a limit to the capacitance value.

(3) Since the dielectric constant of the substrate 1 is set high, unnecessary electrostatic coupling between the feedthrough capacitors tends to increase, which may be inconvenient depending on the application.

The present invention eliminates the above drawbacks and has a large transverse rupture strength and T.
By using a substrate with a sufficiently lower dielectric constant than i-Ba or Ti ceramic capacitor substrates and adding a chip capacitor, it is possible to improve mechanical strength and increase the degree of freedom in setting capacitance. The present invention aims to provide a possible through-type electronic component array.

Embodiments of the through-type electronic component array according to the present invention will be described below with reference to the drawings.

2 and 3 show the structure of a first embodiment of the through-type electronic component array according to the present invention, and FIG. 4 shows its equivalent circuit.

In these figures, 10 is an insulator with strong strength (transverse rupture strength) such as phenol, glass, alumina, steatite, etc., and has a dielectric constant sufficiently lower than that of Ti-Ba-based or Ti-based ceramic capacitor substrates, for example, 5 to 5. The substrate exhibits a value of 10 or less.

A plurality of circular first electrodes 11 are formed on one side of the substrate 10, and through terminals 12 are respectively attached and fixed so as to pass through the center of the first electrodes 11 and the substrate 10.

The first electrode 11 and the through terminal 12 are electrically connected by soldering or the like.

On the other side of the board 10, except for the area around the through terminal 12,
A second electrode 13 is formed on the entire surface, and further extends to the side surface of the substrate 10.

Chip capacitors 14 are connected and fixed between each of the first electrodes 11 and the second electrodes 13 by soldering or the like.

With the configuration as described above, as shown in the equivalent circuit of FIG. A through-type electronic component array is obtained in which a plurality of 21 are arranged on the same substrate.

FIG. 5 shows the frequency characteristics of the reactance of each through-type electronic component 21.

In this figure, the reactance of the feedthrough capacitor 20 is shown by a curve X, and the reactance by the chip capacitor 14 is shown by a curve Y.

From this figure, it can be seen that at relatively low frequencies, the chip capacitor 1
4 shows a low reactance, the feedthrough capacitor 20 shows a low reactance at a certain high frequency, and it can be seen that a sufficiently low reactance can be achieved as a whole from a low frequency to a high frequency.

According to the first embodiment described above, the following effects can be achieved.

(1) As the substrate 10, phenol, glass, alumina,
A material with high strength, ie, transverse rupture strength, such as steatite, can be used.

Therefore, not only when built into the connector, but also when the board 10
The through terminal 12 can be used as a connector terminal by using the connector itself as a substrate of the connector.

(2) By appropriately selecting the capacitance of the chip capacitor 14, a desired capacitance value can be achieved regardless of the thickness, area, and dielectric constant of the substrate 10.

(3) Since the substrate 10 is made of a material such as phenol, glass, alumina, steatite, etc., which has high strength but has a low dielectric constant of 5 to 10 or less, it is possible to reduce the coupling between the through-type electronic components.

FIG. 6 shows a second embodiment of the invention.

In this figure, a ferrite piece 30 is fitted into each through terminal 12, and the other structure is the same as that of the first embodiment described above.

According to this second embodiment, it is equivalent to inserting an inductor in series in the through-hole terminal portion, and is convenient when using each through-type electronic component as a noise filter.

As described above, according to the present invention, there is obtained a through-type electronic component array that can improve mechanical strength and increase the degree of freedom in setting capacitance.

[Brief explanation of drawings]

FIG. 1 is a front view showing a conventionally known feedthrough capacitor array, FIG. 2 is a front view showing a first embodiment of the feedthrough electronic component array according to the present invention, and FIG. 3 is a sectional view of the same side. Fourth
The figure is an equivalent circuit diagram, and FIG. 5 is a graph showing the frequency characteristics of the glue actance of each through-type electronic component in the first embodiment.
FIG. 6 is a side sectional view showing a second embodiment of the present invention. 1.10...Substrate, 2.3. 11. 13.
... Electrode, 4, 12 ... Penetration terminal, 14
...chip capacitor, 20 ... feedthrough capacitor, 21 ... feedthrough electronic component, 30
...Ferrite piece.

Claims (2)

[Scope of utility model registration request] (1) forming first electrodes at a plurality of locations on one side of the substrate, providing through terminals to penetrate the substrate and connecting to each of the first electrodes, and forming a second electrode on the other side of the substrate; A through-type electronic component array, characterized in that chip capacitors are connected between the first electrode and the second electrode, respectively. (2) The through-type electronic component array according to claim 1, wherein each of the through-hole terminals is provided with a ferrite bead.