JPH0220817Y2 - - Google Patents
Info
- Publication number
- JPH0220817Y2 JPH0220817Y2 JP3989783U JP3989783U JPH0220817Y2 JP H0220817 Y2 JPH0220817 Y2 JP H0220817Y2 JP 3989783 U JP3989783 U JP 3989783U JP 3989783 U JP3989783 U JP 3989783U JP H0220817 Y2 JPH0220817 Y2 JP H0220817Y2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- circuit board
- lead terminal
- wiring pattern
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 51
- 229910000679 solder Inorganic materials 0.000 description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】
本考案は、リード端子付コンデンサの回路基板
への取付構造に関する。[Detailed Description of the Invention] The present invention relates to a structure for attaching a capacitor with lead terminals to a circuit board.
従来リード端子付コンデンサを回路基板へ取付
けるには、第１図に示すように、リード端子付コ
ンデンサａのリード端子ｂ，ｂを回路基板ｃに設
けた透孔ｄ，ｄに挿通して、その下端部を回路基
板ｃから突出させ、突出したリード端子ｂの部分
b1，b1を折り曲げる。そして、この折り曲げ部分
b1，b1をそれぞれ回路基板ｃ上に形成された配線
パターンｅ，ｅに半田ｆ，ｆで固定している。こ
のような従来の取付構造では、リード端子付コン
デンサａのリード線ｂ，ｂ自体がインダクタンス
成分をもつことになる。すなわち、高周波域にお
いては、リード線付コンデンサａはそのリード線
ｂによつて一種の共振回路が構成され、第４図の
実線Ａのごとく共振点ｆを有する減衰特性を示す
ようになる。このため、共振点ｆ以上の周波数域
でインダクタンスとなり、リード線付コンデンサ
ａの所望の特性を制限している。このため、同種
のリード線付コンデンサを並列接続して上記不具
合を解消することも試みられている。この場合
は、第４図の破線Ｂに示すように、共振点ｆ以上
の周波数での減衰量は大きくなり従来に比べると
かなり改善されるものの、山谷の多い曲線で平坦
でなく、しかも、回路基板ａ上に占めるリード線
付コンデンサａの割合も大きくなるなどの問題が
ある。 Conventionally, in order to attach a capacitor with lead terminals to a circuit board, as shown in Fig. 1, lead terminals b, b of a capacitor with lead terminals a are inserted into through holes d, d provided in a circuit board c. The lower end protrudes from the circuit board c, and the protruding portion of the lead terminal b
Fold b 1 and b 1 . And this folded part
b 1 and b 1 are fixed to wiring patterns e and e formed on a circuit board c, respectively, with solders f and f. In such a conventional mounting structure, the lead wires b, b of the capacitor a with lead terminals themselves have an inductance component. That is, in a high frequency range, the capacitor a with a lead wire forms a kind of resonant circuit with its lead wire b, and exhibits a damping characteristic having a resonance point f, as shown by the solid line A in FIG. Therefore, it becomes an inductance in the frequency range above the resonance point f, which limits the desired characteristics of the lead wire capacitor a. Therefore, attempts have been made to connect capacitors with lead wires of the same type in parallel to solve the above problem. In this case, as shown by the broken line B in Figure 4, the amount of attenuation at frequencies above the resonance point f increases and is much improved compared to the conventional method, but the curve has many peaks and valleys and is not flat. There are problems such as an increase in the proportion of the lead wired capacitor a on the substrate a.
本考案は上記の問題点に鑑みてなされたもので
あつて、高周波域での減衰量が大きく、かつ、平
坦な減衰特性が得られるリード端子付コンデンサ
の回路基板への取付構造を提供することを目的と
する。 The present invention has been made in view of the above-mentioned problems, and it is an object of the present invention to provide a structure for mounting a capacitor with lead terminals on a circuit board, which has a large amount of attenuation in a high frequency range and can obtain flat attenuation characteristics. With the goal.
本考案はこのような目的を達成するため、回路
基板に取付けられるリード端子付コンデンサの少
なくともホツト側のリード端子に貫通形コンデン
サを挿通し、この貫通形コンデンサにより上記リ
ード端子に生じるインダクタンス成分を除去する
ようにしている。 In order to achieve this purpose, the present invention inserts a feed-through capacitor into at least the hot side lead terminal of a capacitor with lead terminals attached to a circuit board, and removes the inductance component generated in the lead terminal by this feed-through capacitor. I try to do that.
以下、本考案を実施例について、第２図ないし
第４図に基づいて説明する。 Hereinafter, embodiments of the present invention will be explained based on FIGS. 2 to 4.
第２図において１はリード端子付コンデンサ
で、このリード端子付コンデンサ１には一対のリ
ード端子２，３が引き出されている。このード端
子２，３のうち、図上左側の端子２は回路基板４
に設けた透孔５に挿通され、その端部２ａが回路
基板４から突出している。そして、この突出した
りード端子２の端部２ａは折り曲げられて回路基
板４上のリード端子付コンデンサ１とは反対側の
下面に形成されたアース電極用配線パターン６に
半田７で固定されている。また、上記回路基板４
にはリード端子付コンデンサ１に近接して貫通形
コンデンサ１０が取付けられている。この貫通形
コンデンサ１０は回路基板４に半田７で固定され
てこの回路基板４の下方に突出している。そし
て、貫通形コンデンサ１０の外部電極１２が前記
アース電極用配線パターン６に導電的に接続され
ている。また、リード端子付コンデンサ１の図上
右側のリード端子３は貫通コンデンサ１０の中央
に挿通されている。リード端子３の先端部３ａは
貫通形コンデンサ１０からさらに引き出されて回
路基板４のアース電極用配線パターン６と同じ下
面に形成されたホツト電極用配線パターン１４に
半田７で固定されている。さらに、リード端子３
の貫通形コンデンサ１０内の部分３ｂと貫通形コ
ンデンサ１０との間には半田等の導電体１５が充
填され、これにより、リード端子３は貫通形コン
デンサ１０の内部電極１３と導電的に接続され
る。このことから貫通形コンデンサ１０の外部電
極１２と回路基板４のアース電極用配線パターン
６との接続、内部電極１３とリード端子３、リー
ド端子３とホツト電極用配線パターン１４との接
続、およびリード端子２とアース電極用配線パタ
ーン６との接続を同時に行なつてもよいことが理
解できよう。つまり、このリード端子３はリード
端子付コンデンサ１と貫通形コンデンサ１０との
共通のリード端子となる。従つて、リード端子付
コンデンサ１のリード端子３により生じる残留イ
ンダクタンス成分が、上記貫通形コンデンサ１０
により除去される。すなわち、第４図の一点鎖線
Ｃに示すように共振点ｆより高周波域においても
平坦で、かつ、大きな減衰度を示すことになる。 In FIG. 2, 1 is a capacitor with lead terminals, and a pair of lead terminals 2 and 3 are drawn out from this capacitor 1 with lead terminals. Of these code terminals 2 and 3, the terminal 2 on the left side in the figure is connected to the circuit board 4.
It is inserted into a through hole 5 provided in the circuit board 4, and its end portion 2a protrudes from the circuit board 4. The end portion 2a of the protruding lead terminal 2 is bent and fixed with solder 7 to the ground electrode wiring pattern 6 formed on the lower surface of the circuit board 4 on the opposite side from the lead terminal capacitor 1. There is. In addition, the circuit board 4
A feedthrough capacitor 10 is attached adjacent to the capacitor 1 with lead terminals. This feedthrough capacitor 10 is fixed to the circuit board 4 with solder 7 and protrudes below the circuit board 4. The external electrode 12 of the feedthrough capacitor 10 is electrically conductively connected to the ground electrode wiring pattern 6. Further, the lead terminal 3 on the right side in the drawing of the capacitor 1 with a lead terminal is inserted through the center of the feedthrough capacitor 10. The tip end 3a of the lead terminal 3 is further drawn out from the feedthrough capacitor 10 and fixed with solder 7 to a hot electrode wiring pattern 14 formed on the same lower surface as the ground electrode wiring pattern 6 of the circuit board 4. Furthermore, lead terminal 3
A conductor 15 such as solder is filled between the portion 3b inside the feedthrough capacitor 10 and the feedthrough capacitor 10, so that the lead terminal 3 is electrically conductively connected to the internal electrode 13 of the feedthrough capacitor 10. Ru. From this, the connection between the external electrode 12 of the feedthrough capacitor 10 and the wiring pattern 6 for the earth electrode of the circuit board 4, the connection between the internal electrode 13 and the lead terminal 3, the connection between the lead terminal 3 and the wiring pattern 14 for the hot electrode, and the It will be understood that the terminal 2 and the ground electrode wiring pattern 6 may be connected at the same time. In other words, this lead terminal 3 becomes a common lead terminal for the capacitor 1 with a lead terminal and the feedthrough capacitor 10. Therefore, the residual inductance component generated by the lead terminal 3 of the lead terminal capacitor 1 is transferred to the feedthrough capacitor 10.
removed by That is, as shown by the dashed line C in FIG. 4, it is flat and exhibits a large degree of attenuation even in a frequency range higher than the resonance point f.
第３図は、第２図の変形例を示すもので第２図
と同じ構成部分には同一の符号を付す。 FIG. 3 shows a modification of FIG. 2, and the same components as in FIG. 2 are given the same reference numerals.
この実施例で注目すべきは回路基板４のリード
端子付コンデンサ１側と同じ上面にもアース電極
用配線パターン２２が形成され、貫通形コンデン
サ２０の外部電極２３が回路基板４の上方のアー
ス電極用配線パターン２２に接続されていること
である。上記貫通形コンデンサ２０が半田７で固
定されることにより、その外部電極２３が上側の
アース電極用配線パターン２２と導電的に接続さ
れる。さらに、貫通形コンデンサ２０の内部電極
２４は、貫通形コンデンサ２０に挿通されたリー
ド端子３と半田付けされ、リード端子３の下端部
３ａは半田でホツト電極用配線パターン１４に導
電的に接続されている。つまり、リード端子３は
貫通形コンデンサ２０の内部電極２４を介してホ
ツト電極用配線パターン１４に導電的に接続され
る。 What should be noted in this embodiment is that the wiring pattern 22 for a ground electrode is formed on the same upper surface of the circuit board 4 as the capacitor 1 with lead terminal, and the external electrode 23 of the feedthrough capacitor 20 is connected to the ground electrode above the circuit board 4. It is connected to the wiring pattern 22. By fixing the feedthrough capacitor 20 with the solder 7, its external electrode 23 is electrically conductively connected to the upper earth electrode wiring pattern 22. Further, the internal electrode 24 of the feedthrough capacitor 20 is soldered to the lead terminal 3 inserted through the feedthrough capacitor 20, and the lower end 3a of the lead terminal 3 is electrically conductively connected to the hot electrode wiring pattern 14 by solder. ing. That is, the lead terminal 3 is electrically conductively connected to the hot electrode wiring pattern 14 via the internal electrode 24 of the feedthrough capacitor 20.
他の構成は第２図に示した実施例と同様であ
る。第３図に示す実施例においては、貫通形コン
デンサ２０が回路基板４の上方に突出しているの
で回路基板４の下方に余分なスペースを設ける必
要が少なくなり回路基板全体の高さを低くでき
る。 Other configurations are similar to the embodiment shown in FIG. In the embodiment shown in FIG. 3, since the feedthrough capacitor 20 projects above the circuit board 4, there is less need to provide extra space below the circuit board 4, and the height of the entire circuit board can be reduced.
以上のように、本考案によれば、リード端子付
コンデンサを回路基板に取付けた場合には高周波
域での減衰量がたとえば20MHz以上でも−40dB
と大きく、かつ、平坦な減衰特性を示すようにな
るので、リード端子付コンデンサ自体としての特
性が充分に発揮されるという優れた効果が得られ
る。 As described above, according to the present invention, when a capacitor with lead terminals is attached to a circuit board, the amount of attenuation in the high frequency range is -40 dB even at 20 MHz or higher.
Since the capacitor exhibits large and flat attenuation characteristics, an excellent effect can be obtained in which the characteristics of the capacitor with lead terminals themselves are fully exhibited.
第１図は従来例を、第２図ないし第４図は本考
案の実施例をそれぞれ示すもので、第１図は正面
断面図、第２図は正面断面図、第３図は第２図の
変形例を示す正面断面図、第４図はリード端子付
コンデンサの周波数対減衰度の特性図である。
１……リード端子付コンデンサ、２，３……リ
ード端子、４……回路基板、１０，２０……貫通
形コンデンサ。
FIG. 1 shows a conventional example, and FIGS. 2 to 4 show embodiments of the present invention. FIG. 1 is a front sectional view, FIG. 2 is a front sectional view, and FIG. FIG. 4 is a front cross-sectional view showing a modified example of the present invention, and FIG. 4 is a characteristic diagram of frequency versus attenuation of a capacitor with lead terminals. 1... Capacitor with lead terminal, 2, 3... Lead terminal, 4... Circuit board, 10, 20... Feedthrough capacitor.
Claims (1)
ード端子付コンデンサ１を有したものであつて、 回路基板４は透孔を有しており、かつ、下面に
アース電極用配線パターン６と、ホツト電極用配
線パターン１４とが形成されており、 貫通形コンデンサ１０は回路基板４の透孔に取
り付けられており、かつ外部電極１２がアース電
極用配線パターン６に接続されており、 リード端子付コンデンサ１は、ホツト側リード
端子３が貫通形コンデンサ１０の内部電極１３に
接続された状態で該貫通形コンデンサ１０内に挿
通されており、 ホツト側リード端子３は、先端部３ａがホツト
電極用配線パターン１４に接続されていることを
特徴とするリード端子付コンデンサの回路基板へ
の取付構造。[Claims for Utility Model Registration] A circuit board 4, a feedthrough capacitor 10, and a capacitor with lead terminals 1, the circuit board 4 having a through hole and a ground electrode on the bottom surface. A wiring pattern 6 and a hot electrode wiring pattern 14 are formed, the feedthrough capacitor 10 is attached to the through hole of the circuit board 4, and the external electrode 12 is connected to the earth electrode wiring pattern 6. The capacitor 1 with lead terminals is inserted into the feed-through capacitor 10 with the hot-side lead terminal 3 connected to the internal electrode 13 of the feed-through capacitor 10, and the hot-side lead terminal 3 is connected to the internal electrode 13 of the feed-through capacitor 10. 3a is connected to a hot electrode wiring pattern 14. A structure for mounting a capacitor with a lead terminal on a circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3989783U JPS59146980U (en) | 1983-03-19 | 1983-03-19 | Mounting structure of capacitor with lead terminal on circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3989783U JPS59146980U (en) | 1983-03-19 | 1983-03-19 | Mounting structure of capacitor with lead terminal on circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59146980U JPS59146980U (en) | 1984-10-01 |
| JPH0220817Y2 true JPH0220817Y2 (en) | 1990-06-06 |
Family
ID=30170534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3989783U Granted JPS59146980U (en) | 1983-03-19 | 1983-03-19 | Mounting structure of capacitor with lead terminal on circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59146980U (en) |
-
1983
- 1983-03-19 JP JP3989783U patent/JPS59146980U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59146980U (en) | 1984-10-01 |
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