JPH0317662U - - Google Patents
Info
- Publication number
- JPH0317662U JPH0317662U JP7619689U JP7619689U JPH0317662U JP H0317662 U JPH0317662 U JP H0317662U JP 7619689 U JP7619689 U JP 7619689U JP 7619689 U JP7619689 U JP 7619689U JP H0317662 U JPH0317662 U JP H0317662U
- Authority
- JP
- Japan
- Prior art keywords
- case
- high frequency
- frequency element
- radio wave
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006096 absorbing agent Substances 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の高周波素子用ケースの実装構
造の一実施例の断面図、第２図は電波吸収体の斜
視図、第３図は従来の高周波素子用ケースのプリ
ント板への実装構造の断面図である。
１，１１…回路基板（プリント板）、２，１２
…トランジスタ用ケース、３，１３…リード線、
４，１４…ランド、５，１５…電波吸収体、６…
円孔、７，１７…半田、１６…テフロン板。
Figure 1 is a cross-sectional view of one embodiment of the mounting structure of the high-frequency element case of the present invention, Figure 2 is a perspective view of a radio wave absorber, and Figure 3 is a conventional mounting structure of the high-frequency element case on a printed board. FIG. 1, 11...Circuit board (printed board), 2, 12
...Transistor case, 3,13...Lead wire,
4, 14... land, 5, 15... radio wave absorber, 6...
Circular hole, 7, 17...Solder, 16...Teflon plate.
Claims (1)
子を含むケースを回路基板に実装する高周波素子
用ケースの実装構造において、前記回路基板に電
波吸収体を組み込み、この電波吸収体を前記リー
ド線に電気的に結合したことを特徴とする高周波
素子用ケースの実装構造。 In the mounting structure of a case for a high frequency element, in which a case having at least one lead wire and containing a high frequency element is mounted on a circuit board, a radio wave absorber is built into the circuit board, and the radio wave absorber is electrically connected to the lead wire. A mounting structure of a case for a high frequency element characterized by being coupled to a case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7619689U JPH0317662U (en) | 1989-06-30 | 1989-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7619689U JPH0317662U (en) | 1989-06-30 | 1989-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0317662U true JPH0317662U (en) | 1991-02-21 |
Family
ID=31617442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7619689U Pending JPH0317662U (en) | 1989-06-30 | 1989-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0317662U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015204398A (en) * | 2014-04-15 | 2015-11-16 | 日本オクラロ株式会社 | Optical module |
-
1989
- 1989-06-30 JP JP7619689U patent/JPH0317662U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015204398A (en) * | 2014-04-15 | 2015-11-16 | 日本オクラロ株式会社 | Optical module |