JPH0394805U - - Google Patents
Info
- Publication number
- JPH0394805U JPH0394805U JP236190U JP236190U JPH0394805U JP H0394805 U JPH0394805 U JP H0394805U JP 236190 U JP236190 U JP 236190U JP 236190 U JP236190 U JP 236190U JP H0394805 U JPH0394805 U JP H0394805U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- circuit
- dielectric substrate
- dielectric layer
- dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 description 1
Landscapes
- Waveguides (AREA)
Description
第１図は、この考案によるマイクロ波集積回路
基板の一実施例を示す要部断面図、第２図は、こ
の考案の一実施例を示す回路部品を搭載したマイ
クロ波集積回路基板の斜視図、第３図は第２図の
実施例の反対面を示す斜視図である。
１……誘電体基板、２……回路導体、３１，３
２，３３……回路部品、４……接地導体、５……
誘電体層、６……導電体層（コンデンサ電極）、
７……スルーホール。
FIG. 1 is a cross-sectional view of a main part showing an embodiment of a microwave integrated circuit board according to this invention, and FIG. 2 is a perspective view of a microwave integrated circuit board on which circuit components are mounted, showing an embodiment of this invention. , FIG. 3 is a perspective view showing the opposite side of the embodiment of FIG. 2. 1... Dielectric substrate, 2... Circuit conductor, 31, 3
2, 33...Circuit components, 4...Grounding conductor, 5...
Dielectric layer, 6... conductor layer (capacitor electrode),
7...Through hole.
Claims (1)
、 前記回路導体と接続された回路部品と、 前記誘電体基板の他面上に形成された接地導体
と、 前記接地導体上に形成された誘電体層と、前記
誘電体層上に形成されるとともに前記誘電体基板
に設けられたスルーホールを介して前記回路導体
と接続された電極導体と、 を備えて成ることを特徴とするマイクロ波集積回
路基板。[Claims for Utility Model Registration] A circuit conductor formed on one surface of a dielectric substrate, a circuit component connected to the circuit conductor, a ground conductor formed on the other surface of the dielectric substrate, a dielectric layer formed on the ground conductor; and an electrode conductor formed on the dielectric layer and connected to the circuit conductor via a through hole provided in the dielectric substrate. A microwave integrated circuit board characterized by comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP236190U JPH0394805U (en) | 1990-01-17 | 1990-01-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP236190U JPH0394805U (en) | 1990-01-17 | 1990-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0394805U true JPH0394805U (en) | 1991-09-27 |
Family
ID=31506238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP236190U Pending JPH0394805U (en) | 1990-01-17 | 1990-01-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0394805U (en) |
-
1990
- 1990-01-17 JP JP236190U patent/JPH0394805U/ja active Pending