JPH01165568U - - Google Patents
Info
- Publication number
- JPH01165568U JPH01165568U JP6351988U JP6351988U JPH01165568U JP H01165568 U JPH01165568 U JP H01165568U JP 6351988 U JP6351988 U JP 6351988U JP 6351988 U JP6351988 U JP 6351988U JP H01165568 U JPH01165568 U JP H01165568U
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- circuit pattern
- internal electrode
- pattern
- microwave circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 1
- 230000005669 field effect Effects 0.000 description 1
Description
第１図は本考案に係るマイクロ波回路の接地構
造の一実施例の要部平面図、第２図は第１図の
―線に沿う断面図、第３図および第４図は夫々
従来のマイクロ波回路の接地構造の要部平面図で
ある。
１１……ＦＥＴ（電界効果トランジスタ）、１
２……基板（１２ａ……一方の主面、１２ｂ……
他方の主面）、１３……ドレイン端子、１４……
コンデンサ、１５……コンデンサ電極、１６……
樹脂シート、１７……内部電極、１８……アース
電極、１９……スルーホール。
FIG. 1 is a plan view of essential parts of an embodiment of the grounding structure for a microwave circuit according to the present invention, FIG. 2 is a sectional view taken along the line - in FIG. 1, and FIGS. FIG. 3 is a plan view of the main parts of the grounding structure of the microwave circuit. 11...FET (field effect transistor), 1
2... Substrate (12a... one main surface, 12b...
other main surface), 13... drain terminal, 14...
Capacitor, 15... Capacitor electrode, 16...
Resin sheet, 17...internal electrode, 18...ground electrode, 19...through hole.
Claims (1)
主面に夫々マイクロ波回路の回路パターンおよび
アースパターンが形成されてなるマイクロ波回路
において、 上記基板は絶縁性の樹脂材料からなる樹脂シー
トが積層されてなる多層基板からなり、上記基板
には回路パターンの一部、この回路パターンの一
部に対応して上記基板内に形成された内部電極お
よび上記回路パターンの一部と上記内部電極との
間に位置する樹脂シートよりなるコンデンサが形
成されており、上記マイクロ波回路の高周波的に
接地すべき部分が上記回路パターンの一部に電気
的に接続される一方、上記内部電極がアース電極
に電気的に接続されていることを特徴とするマイ
クロ波回路の接地構造。[Claims for Utility Model Registration] In a microwave circuit in which a circuit pattern and a ground pattern of a microwave circuit are formed on one main surface of a substrate and the other main surface opposite thereto, the substrate is made of an insulating resin. It consists of a multilayer board made of laminated resin sheets made of materials, and the board has a part of the circuit pattern, an internal electrode formed in the board corresponding to the part of the circuit pattern, and a part of the circuit pattern. A capacitor made of a resin sheet is formed between the part and the internal electrode, and a part of the microwave circuit that should be grounded at a high frequency is electrically connected to a part of the circuit pattern, A grounding structure for a microwave circuit, characterized in that the internal electrode is electrically connected to a ground electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6351988U JPH01165568U (en) | 1988-05-12 | 1988-05-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6351988U JPH01165568U (en) | 1988-05-12 | 1988-05-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01165568U true JPH01165568U (en) | 1989-11-20 |
Family
ID=31289015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6351988U Pending JPH01165568U (en) | 1988-05-12 | 1988-05-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01165568U (en) |
-
1988
- 1988-05-12 JP JP6351988U patent/JPH01165568U/ja active Pending