JPH0165198U - - Google Patents
Info
- Publication number
- JPH0165198U JPH0165198U JP1987160455U JP16045587U JPH0165198U JP H0165198 U JPH0165198 U JP H0165198U JP 1987160455 U JP1987160455 U JP 1987160455U JP 16045587 U JP16045587 U JP 16045587U JP H0165198 U JPH0165198 U JP H0165198U
- Authority
- JP
- Japan
- Prior art keywords
- component
- conductive film
- view
- board
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 1
Description
第１図〜第８図は本考案の実施例を示している
。第１図は本考案の第一実施例を示すものであり
高周波機器の断面図、第２図は第１図に装備され
ている基板の拡大断面図、第３図は第１図の機器
における基板を外面側から示す平面図、第４図は
本考案の第二実施例を示すものであり、基板を部
品実装面側から示す平面図、第５図は第４図の基
板を導体膜形成面側から示す平面図、第６図は本
考案の第三実施例を示すものであり、基板を導体
膜形成面側から示す平面図、第７図は本考案の第
四実施例を示すものであり、基板を拡大して示す
側面図、第８図は第７図の基板を導体膜形成面側
から示す平面図、第９図は従来の高周波機器を示
す部分断面図である。
１１……シヤーシ、１２……基板、１２ａ……
アース導体膜、１２ｂ，１２ｃ……部品の電極を
半田付けする導体膜、１２ｄ……接続導体膜、１
２ｅ……短絡導体膜、１５，２５……チツプ部品
、１５ａ，１５ｂ，２５ａ，２５ｂ……部品の電
極、Ａ，Ｂ，Ｄ，Ｅ，Ｆ……導体膜の除去領域、
Ｃ……ストレー容量。
1 to 8 show embodiments of the present invention. Fig. 1 shows the first embodiment of the present invention, and is a sectional view of a high-frequency device, Fig. 2 is an enlarged sectional view of a board equipped in Fig. FIG. 4 is a plan view showing the board from the outside surface side. FIG. 4 is a plan view showing the second embodiment of the present invention. FIG. 5 is a plan view showing the board from the component mounting side. FIG. A plan view showing the substrate from the surface side, FIG. 6, shows a third embodiment of the present invention, and a plan view showing the substrate from the conductor film formation side, FIG. 7 shows a fourth embodiment of the invention. FIG. 8 is a plan view showing the substrate of FIG. 7 from the conductor film forming side, and FIG. 9 is a partial sectional view showing a conventional high-frequency device. 11... Chassis, 12... Board, 12a...
Earth conductor film, 12b, 12c...Conductor film to which electrodes of components are soldered, 12d...Connection conductor film, 1
2e... Short circuit conductor film, 15, 25... Chip parts, 15a, 15b, 25a, 25b... Electrodes of parts, A, B, D, E, F... Removal area of conductor film,
C...Stray capacity.
Claims (1)
に実装されている部品は、その電極が導体膜に対
し面接触にて半田付けされており且つ、この部品
が実装されている面と逆側の面では、少なくとも
前記部品の電極に対向している部分の導体膜が除
去されている高周波機器の部品実装基板。 A component mounted on one side of a board with a conductive film formed on both sides has its electrode soldered to the conductive film in surface contact, and the part is soldered on the opposite side to the side on which the component is mounted. A component mounting board for a high frequency device, in which at least a portion of the conductive film facing the electrode of the component is removed on the side surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987160455U JPH0165198U (en) | 1987-10-19 | 1987-10-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987160455U JPH0165198U (en) | 1987-10-19 | 1987-10-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0165198U true JPH0165198U (en) | 1989-04-26 |
Family
ID=31442537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987160455U Pending JPH0165198U (en) | 1987-10-19 | 1987-10-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0165198U (en) |
-
1987
- 1987-10-19 JP JP1987160455U patent/JPH0165198U/ja active Pending
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