JPH0424459Y2 - - Google Patents

Info

Publication number
JPH0424459Y2
JPH0424459Y2 JP1982199619U JP19961982U JPH0424459Y2 JP H0424459 Y2 JPH0424459 Y2 JP H0424459Y2 JP 1982199619 U JP1982199619 U JP 1982199619U JP 19961982 U JP19961982 U JP 19961982U JP H0424459 Y2 JPH0424459 Y2 JP H0424459Y2
Authority
JP
Japan
Prior art keywords
socket
temperature
heater
tester
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982199619U
Other languages
Japanese (ja)
Other versions
JPS59104080U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19961982U priority Critical patent/JPS59104080U/en
Publication of JPS59104080U publication Critical patent/JPS59104080U/en
Application granted granted Critical
Publication of JPH0424459Y2 publication Critical patent/JPH0424459Y2/ja
Granted legal-status Critical Current

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  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【考案の詳細な説明】 (1) 考案の技術分野 本考案はヒータ付集積回路測定用ソケツトに関
する。
[Detailed Description of the Invention] (1) Technical Field of the Invention The present invention relates to a socket for measuring integrated circuits with a heater.

(2) 技術の背景 半導体集積回路のパツケージ(以下ICと略称
する)は出荷前に1個ごとICソケツトを用い温
度特性について電気的な保証試験をなす。従来
は、恒温槽内でICが配置されたICソケツトとの
接続(コンタクト)をとり、テスターまで線を引
いて試験を行つていた。恒温槽内はICの種類に
よつても異なるが通常100℃〜150℃の範囲の温度
に保たれ、保証試験の際には±2℃のずれしか許
されない。そのために前記した如くIC(場合によ
つては数百個にも達する)を恒温槽内においたま
まで試験を行う。
(2) Background of the technology Before shipment, each semiconductor integrated circuit package (hereinafter abbreviated as IC) undergoes an electrical guarantee test for temperature characteristics using an IC socket. Conventionally, tests were performed by making a connection (contact) with the IC socket in which the IC was placed in a thermostatic chamber and then running a wire to the tester. The temperature inside the constant temperature chamber is usually maintained at a temperature in the range of 100°C to 150°C, although it varies depending on the type of IC, and only a deviation of ±2°C is allowed during guarantee tests. For this purpose, as mentioned above, the test is performed while the ICs (in some cases numbering as many as several hundred) are left in a thermostatic chamber.

(3) 従来技術と問題点 上記した保証試験において、ICがバイポーラ
のものであるとかなりの電流が流され、接地線に
改良が加えられてはいるがノイズが入る問題があ
る。この問題を解決するには、ICソケツトから
テスターまでの線を短くしたい。そのためには、
恒温槽の近くにテスターを配置し、恒温槽から取
り出したICを直ちにICソケツトに配置してこの
ICソケツトを短い線を用いてテスターに接続し
て試験をなすことが提案された。
(3) Prior art and problems In the above-mentioned guarantee test, if the IC is bipolar, a considerable amount of current will flow through it, and although improvements have been made to the grounding wire, there is a problem that noise will be introduced. To solve this problem, I would like to shorten the line from the IC socket to the tester. for that purpose,
Place the tester near the thermostatic oven, and immediately place the IC taken out from the thermostatic oven into the IC socket.
It has been proposed to connect the IC socket to the tester using a short wire to perform the test.

しかし、前記した100℃〜150℃の温度の恒温槽
から取り出したICを常温雰囲気中におくと、急
速に冷却が始まる。また、最近のICでは200本程
度のピンを備えるものもあり、これら多数のピン
からICソケツトを通して接続線を引き出すと、
接続線を通して逃げる熱量もかなりの量になり、
前記した±2℃の温度ずれの許容値内で温度特性
を試験することはきわめて難しくなる。恒温槽内
にハンドラーをおき、このハンドラーとテスター
とを接続することも提案されたが、それでは時間
がかかりすぎる問題がある。前記した如く、IC
は必ず1個ずつについて保証試験を行うのである
から、1個のICの試験に要する時間の僅かの増
加も多数の試験を繰り返すうちにはかなりの時間
の損失になる。
However, when an IC taken out of the above-mentioned constant temperature bath at a temperature of 100° C. to 150° C. is placed in a room temperature atmosphere, cooling begins rapidly. Also, some recent ICs have around 200 pins, and if you pull out connection lines from these many pins through the IC socket,
The amount of heat that escapes through the connecting wires is also considerable,
It becomes extremely difficult to test the temperature characteristics within the above-mentioned tolerance of temperature deviation of ±2°C. It has also been proposed to place a handler in a thermostatic chamber and connect this handler to a tester, but there is a problem that this would take too much time. As mentioned above, IC
Since guarantee testing is always performed on each IC, a slight increase in the time required to test one IC results in a significant loss of time as many tests are repeated.

(4) 考案の目的 本考案は上記従来の問題に鑑み、ICの温度特
性について電気的な保証試験を行うについて、恒
温槽内で試験を行うことに代えて恒温槽外で、温
度ずれ±2℃の許容値内において、またICソケ
ツトとテスターとの間の接続線の長さを長くする
ことなしに、ICの温度特性を正確に電気的に試
験することが可能なIC測定用ソケツトを提供す
ることを目的とする。
(4) Purpose of the invention In view of the above-mentioned conventional problems, the present invention has been developed to perform electrical guarantee tests on the temperature characteristics of ICs by performing temperature deviations of ±2 outside the thermostatic oven instead of conducting the tests inside the thermostatic oven. Provides an IC measurement socket that allows accurate electrical testing of IC temperature characteristics within the temperature tolerance and without increasing the length of the connection line between the IC socket and the tester. The purpose is to

(5) 発明の構成 そしてこの目的は本考案によれば、集積回路測
定用のソケツトとそれと一体的に組み合されるソ
ケツトヒータとから成り、前記ソケツトの凹部に
は試験が行われる半導体集積回路パツケージが収
納され、ソケツトヒータは前記ソケツトを受ける
枠として形成され、前記枠には少なくとも1個の
ソケツト加熱用のヒータとソケツトの温度を検知
する温度センサーが設けられ、これらヒータと温
度センサーは温度コントローラに接続されたこと
を特徴とするヒータ付集積回路測定用ソケツトを
提供することによつて達成される。
(5) Structure of the Invention According to the present invention, the present invention comprises a socket for measuring integrated circuits and a socket heater integrally combined with the socket, and a semiconductor integrated circuit package to be tested is housed in the recess of the socket. The socket heater is formed as a frame for receiving the socket, and the frame is provided with at least one heater for heating the socket and a temperature sensor for detecting the temperature of the socket, and these heaters and temperature sensors are connected to a temperature controller. This is achieved by providing a socket for measuring integrated circuits with a heater, which is characterized by the following characteristics.

(6) 発明の実施例 以下本考案実施例を図面によんて詳述する。(6) Examples of the invention Embodiments of the present invention will be described in detail below with reference to the drawings.

添付図面は本考案にかかるヒータ付IC測定用
ソケツトの分解斜視図で、同図において、1は
ICソケツト、11はソケツトヒータを示す。
The attached drawing is an exploded perspective view of the IC measurement socket with heater according to the present invention, in which 1 is
IC socket, 11 indicates a socket heater.

ICソケツトのほぼ中央にはICを載置する凹部
2が形成され、そこに配置されたIC(図示せず)
の各要素はコンタクトピン3と接続がとられ、コ
ンタクトピン3は図に模式的に示すパーフォーマ
ンスボード5を介して図示しないテスターに接続
される。図示のICソケツト1はソケツトヒータ
11と組み合されるもので、その目的のためにソ
ケツト止めのねじ穴4が設けられている。反対側
にもねじ穴4が同様に設けてあるが、それはソケ
ツト本体の影になつている。この点を除くと、
ICソケツト1は従来のICソケツトと同じ構造の
もので同じ機能を果たす。
A recess 2 for placing an IC is formed approximately in the center of the IC socket, and an IC (not shown) is placed there.
Each element is connected to a contact pin 3, and the contact pin 3 is connected to a tester (not shown) via a performance board 5 schematically shown in the figure. The illustrated IC socket 1 is assembled with a socket heater 11, and for this purpose, a screw hole 4 for fixing the socket is provided. A screw hole 4 is similarly provided on the opposite side, but it is in the shadow of the socket body. Except for this point,
The IC socket 1 has the same structure as a conventional IC socket and performs the same function.

ソケツトヒータ11はICソケツトを受けるこ
とのできるほぼ方形の枠として形成され、枠の相
対する一対の側辺には前記したICソケツト1の
ソケツト止めのためのねじ穴4に対応してソケツ
ト止めのねじ穴12が穿孔されている。ねじ穴1
2の設けられていない相対する一対の側辺のそれ
ぞれのほぼ中央部分にはヒータ13が設けられ、
ヒータ13は温度コントローラー14に接続さ
れ、他方、温度コントローラーには枠の側辺の1
つに設けられた温度センサー15が接続されてい
る。ヒータはICソケツトを前記した100℃〜150
℃の温度範囲内に保ちうる容量のものとし、温度
センサー15は市販のものを使用しうる。温度セ
ンサー14には温度表示器14aとヒータ13の
温度調整用のつまみ14bとが設けられ、常時
ICソケツト1内の温度をモニターし、その温度
を前記した±2℃の温度ずれ許容値内に保つ。ヒ
ータ13は2個、温度センサーは1個図示した
が、本考案はその場合に限定されるものではな
く、それらの数はICの種類、保証試験の内容に
対応して適宜選定しうる。
The socket heater 11 is formed as a substantially rectangular frame capable of receiving an IC socket, and a pair of opposing sides of the frame are provided with socket fixing screws corresponding to the socket fixing screw holes 4 of the IC socket 1 described above. Holes 12 are drilled. screw hole 1
A heater 13 is provided approximately in the center of each of a pair of opposing sides where 2 is not provided,
The heater 13 is connected to a temperature controller 14, while the temperature controller is connected to one side of the frame.
A temperature sensor 15 provided at the terminal is connected. The heater is 100℃ to 150℃ above the IC socket.
The temperature sensor 15 should have a capacity that can maintain the temperature within the temperature range of .degree. C., and a commercially available one can be used as the temperature sensor 15. The temperature sensor 14 is provided with a temperature indicator 14a and a knob 14b for adjusting the temperature of the heater 13.
The temperature inside the IC socket 1 is monitored and maintained within the above-mentioned temperature deviation tolerance of ±2°C. Although two heaters 13 and one temperature sensor are illustrated, the present invention is not limited to that case, and the number thereof can be appropriately selected depending on the type of IC and the content of the guarantee test.

使用に際してはねじ穴4と12にねじを差し込
んでICソケツト1とソケツトヒータ11を一体
化し、パーフォーマンスボード5を図示しないテ
スターに接続する。恒温槽(図示せず)から取り
出されたICは凹部2内に配置され、温度指示器
14aで温度を点検した上でテスターによる保証
試験を開示する。パーフォーマンスボード5は図
示しないテスターに直結されているので、コンタ
クトピン3とテスターとの間の線の長さは最短に
保たれ、かつ、ICは前記した如く所定の測定温
度に保たれているので、ICの温度特性がノイズ
等なしに電気的に正確に試験される。
In use, screws are inserted into the screw holes 4 and 12 to integrate the IC socket 1 and the socket heater 11, and the performance board 5 is connected to a tester (not shown). The IC taken out from the constant temperature bath (not shown) is placed in the recess 2, and after checking the temperature with the temperature indicator 14a, a guarantee test using a tester is performed. Since the performance board 5 is directly connected to a tester (not shown), the length of the line between the contact pin 3 and the tester is kept to a minimum, and the IC is kept at a predetermined measurement temperature as described above. Therefore, the temperature characteristics of the IC can be electrically tested accurately without noise.

(7) 考案の効果 以上詳細に説明したように、本考案によれば、
ICの温度特性の電気的な保証試験が、正確に短
時間内になされうるので、ICの製造歩留りの向
上に効果大である。
(7) Effects of the invention As explained in detail above, according to the invention,
Since the electrical guarantee test of the temperature characteristics of the IC can be accurately performed within a short period of time, it is highly effective in improving the manufacturing yield of the IC.

【図面の簡単な説明】[Brief explanation of drawings]

添付図面は本考案の実施例の分解斜視図であ
る。 1……ICソケツト、2……凹部、3……コン
タクトピン、4……ソケツト止めのねじ穴、13
……ヒータ、14……温度コントローラー、14
a……温度表示器、14b……つまみ、15……
温度センサー。
The accompanying drawing is an exploded perspective view of an embodiment of the present invention. 1...IC socket, 2...recess, 3...contact pin, 4...socket fixing screw hole, 13
... Heater, 14 ... Temperature controller, 14
a...Temperature display, 14b...Knob, 15...
Temperature sensor.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 集積回路測定用のソケツトとそれと一体的に組
み合されるソケツトヒータとから成り、前記ソケ
ツトの凹部には試験が行われる半導体集積回路パ
ツケージが収納され、ソケツトヒータは前記ソケ
ツトを受ける枠として形成され、前記枠には少な
くとも1個のソケツト加熱用のヒータとソケツト
の温度を検知する温度センサーが設けられ、これ
らヒータと温度センサーは温度コントローラに接
続されたことを特徴とするヒータ付集積回路測定
用ソケツト。
It consists of a socket for measuring integrated circuits and a socket heater integrally combined with the socket, a semiconductor integrated circuit package to be tested is housed in a recess of the socket, and the socket heater is formed as a frame for receiving the socket, and is attached to the frame. A socket for measuring an integrated circuit with a heater, characterized in that at least one heater for heating the socket and a temperature sensor for detecting the temperature of the socket are provided, and these heaters and temperature sensors are connected to a temperature controller.
JP19961982U 1982-12-28 1982-12-28 Integrated circuit measurement socket with heater Granted JPS59104080U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19961982U JPS59104080U (en) 1982-12-28 1982-12-28 Integrated circuit measurement socket with heater

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19961982U JPS59104080U (en) 1982-12-28 1982-12-28 Integrated circuit measurement socket with heater

Publications (2)

Publication Number Publication Date
JPS59104080U JPS59104080U (en) 1984-07-13
JPH0424459Y2 true JPH0424459Y2 (en) 1992-06-09

Family

ID=30425145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19961982U Granted JPS59104080U (en) 1982-12-28 1982-12-28 Integrated circuit measurement socket with heater

Country Status (1)

Country Link
JP (1) JPS59104080U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5326577A (en) * 1976-08-25 1978-03-11 Hitachi Ltd Semiconductor device pre-heating unit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5326577A (en) * 1976-08-25 1978-03-11 Hitachi Ltd Semiconductor device pre-heating unit

Also Published As

Publication number Publication date
JPS59104080U (en) 1984-07-13

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