JPH04235362A - Lsi test socket - Google Patents

Abstract

PURPOSE:To provide an LSI test socket including necessary parts such as a heater in order to heat the LSI to the high temperature required for a temperature test. CONSTITUTION:A heater 4b and a temperature sensor 4c are arranged on the surface of a socket 4 in which an LSI 1 is inserted. The parts are molded with a resin, and a molded layer 4d is formed. The supplied current to the heater 4b is controlled with the temperature sensor 4c and a control circuit 5, and the specified high temperature is maintained. The LSI 1 in contact with the molded layer 4d is heated to the specified high temperature.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket for testing LSI.

0002

2. Description of the Related Art The performance of LSI semiconductor products is inspected during the manufacturing process. Inspection items include a temperature test to examine changes in characteristics due to environmental temperature, and in the final process, I
A large number of LSIs are installed in a C handler, and a final inspection is performed at low temperature, room temperature, or high temperature. However, before the final inspection, there is a selection process in which each LSI is debugged and judged to be good or bad, and the completed LSI is mounted in a socket as a single unit and inspected. Those involved call this inspection the finished product inspection, and a temperature test is also required in the finished product inspection.

A conventional method of heating an LSI to a high temperature in inspecting a finished product will be explained with reference to FIGS. 3(a) to 3(c). Figure (a) shows one that was used in the early days, in which a dryer 2 blows hot air onto the LSI 1, heating it until it reaches a predetermined high temperature, and then mounting it in a socket. Although this method is simple, it is not satisfactory because it is unclear whether the temperature has reached a predetermined high temperature. On the other hand, in Figure (b), a metal heating plate 3 is heated by a heater 3a, and the temperature of the heating plate is measured by a temperature sensor 3b and an indicating thermometer 3c to reach a predetermined high temperature state. Place the LSI and heat it. The heated LSI is manually inserted and mounted into the socket 4 as shown in Figure (c), and the LSI's contact pin 1a
The test is performed by touching the contact electrode 4a of the socket.

0004

The method using the heating plate 3 described above has the drawback that the temperature of the LSI drops below a predetermined high temperature before it is mounted in the socket, making it impossible to perform a correct temperature test. Furthermore, in order to maintain the heating plate at a predetermined high temperature, it is of course necessary to control the heater current, but no consideration was given to this, and the adjustment was only done manually by checking the indicator thermometer 3c, which is a very basic step. This is a clumsy and inefficient method.

[0005] In order to eliminate the above-mentioned drawbacks and improve inefficiency, a method has been proposed in which a heater and a temperature sensor are provided in the LSI socket to automate temperature adjustment and heat the installed LSI to a predetermined high temperature. It is an object of the present invention to provide such a test socket, which is believed to be accurate and efficient.

[0006]

[Means for Solving the Problems] The present invention is an inspection socket for mounting and inspecting an LSI, and a heater and a temperature sensor are provided on the surface of the socket. The heater and temperature sensor are molded with a resin that has good electrical insulation and heat resistance, and a mold layer is formed that has a surface with dimensions equal to the dimensions of the bottom of the LSI and a height that makes contact with the bottom of the LSI. be.

A control circuit is provided which controls the current supplied to the heater based on the output voltage of the temperature sensor to maintain the temperature of the molded resin at a predetermined value.

[0008]

[Operation] In the above inspection socket, the heated mold layer is maintained at a predetermined high temperature by a heater controlled by a temperature sensor and a control circuit, and the LS
Since heat is efficiently conducted to I from the mold layer in contact with the bottom surface and heated to a predetermined temperature, there is no risk of temperature drop unlike in conventional separate heating methods.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a block diagram of an embodiment of the present invention. A normal LSI socket 4 has the structure shown in FIG. 3(c), and has a heater 4b wired on its upper surface and a temperature sensor 4c disposed at an appropriate position. The heater and the temperature sensor are molded with a resin having good electrical insulation and heat resistance to form a mold layer 4d.

Further, a control circuit (CONT) 5 is provided, and desired temperature data is instructed and set from an instruction terminal 5a. The output voltage of the temperature sensor 4c is input to the input terminal 5b to control the AC voltage from the AC terminal 5c, and the supply current is supplied from the output terminal 5d to the heater 4b to maintain the mold layer 4d at a specified high temperature. be done.

FIG. 2 shows a cross section of the test socket. The dimensions of the surface of the mold layer 4d are made equal to the dimensions of the bottom surface of the LSI 1 to increase the heat transfer area, and there is no problem in contact between the contact pins 1a of the LSI and the contact electrodes 4a of the socket 4, and the LSI can be inserted into the socket as before. so that it can be attached to Further, the mold layer is formed at a height such that its surface can come into contact with the bottom surface of the LSI. Due to this contact and the above-mentioned large heat transfer area, the amount of heat in the mold layer is efficiently transferred to the LSI.

0012

Effects of the Invention As explained above, the test socket of the present invention adds a heater and a temperature sensor to the socket itself into which the LSI to be tested is mounted, forms a mold layer thereon, and controls the test socket to a predetermined height using a control circuit. It maintains the temperature accurately, and the heated LSI is installed in the test socket.
Unlike the conventional separate heating method, there is no risk of temperature drop, and there is a great effect that correct temperature testing can be performed at a predetermined high temperature.

[Brief explanation of the drawing]

FIG. 1 is a configuration diagram of an embodiment of the present invention.

FIG. 2 shows a cross-sectional view relative to FIG. 1;

FIG. 3 is an explanatory diagram of a conventional heating method and inspection method for inspecting a finished product of LSI.

[Explanation of symbols]

1 LSI 1a Contact pin 2 Dryer 3 Heating plate 3a Heater 3b Temperature sensor 3c Indicating thermometer 4 LSI socket 4a Contact electrode 4b Heater 4c Temperature sensor 4d mold layer 5 Control circuit (CONT) 5a Indication terminal 5b Input terminal 5c AC terminal 5d Output terminal

Claims (2)

[Claims] [Claim 1] In a socket for mounting an LSI,
A heater and a temperature sensor are provided on the surface of the socket, the heater and the temperature sensor are molded with a resin having good electrical insulation and heat resistance, and a surface with dimensions equal to the dimensions of the bottom of the LSI and a bottom surface are formed. An LSI characterized in that a mold layer having a contact height is formed.
inspection socket. 2. A control circuit that controls the current supplied to the heater based on the output voltage of the temperature sensor according to claim 1, and maintains the temperature of the mold layer at a predetermined value. , The LSI test socket according to claim 1.