JPH0424427B2 - - Google Patents
Info
- Publication number
- JPH0424427B2 JPH0424427B2 JP60023780A JP2378085A JPH0424427B2 JP H0424427 B2 JPH0424427 B2 JP H0424427B2 JP 60023780 A JP60023780 A JP 60023780A JP 2378085 A JP2378085 A JP 2378085A JP H0424427 B2 JPH0424427 B2 JP H0424427B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- plastic film
- film
- ion plating
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 26
- 239000010949 copper Substances 0.000 claims description 25
- 239000002985 plastic film Substances 0.000 claims description 24
- 229920006255 plastic film Polymers 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 23
- 238000000151 deposition Methods 0.000 claims description 11
- 238000007733 ion plating Methods 0.000 claims description 10
- 238000010891 electric arc Methods 0.000 claims description 8
- 230000008021 deposition Effects 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 description 8
- 230000008020 evaporation Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- -1 argon ions Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Non-Insulated Conductors (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60023780A JPS61183460A (ja) | 1985-02-08 | 1985-02-08 | 銅被着プラスチツクフイルムの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60023780A JPS61183460A (ja) | 1985-02-08 | 1985-02-08 | 銅被着プラスチツクフイルムの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61183460A JPS61183460A (ja) | 1986-08-16 |
| JPH0424427B2 true JPH0424427B2 (enExample) | 1992-04-27 |
Family
ID=12119838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60023780A Granted JPS61183460A (ja) | 1985-02-08 | 1985-02-08 | 銅被着プラスチツクフイルムの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61183460A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2545369B2 (ja) * | 1986-08-19 | 1996-10-16 | 株式会社 ト−ビ | シ−トプラズマ・イオンプレ−テイング方法とその装置 |
| GB9121789D0 (en) * | 1991-10-14 | 1991-11-27 | Minnesota Mining & Mfg | Positive-acting photothermographic materials |
-
1985
- 1985-02-08 JP JP60023780A patent/JPS61183460A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61183460A (ja) | 1986-08-16 |
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