JPH0424312B2 - - Google Patents

Info

Publication number
JPH0424312B2
JPH0424312B2 JP57112402A JP11240282A JPH0424312B2 JP H0424312 B2 JPH0424312 B2 JP H0424312B2 JP 57112402 A JP57112402 A JP 57112402A JP 11240282 A JP11240282 A JP 11240282A JP H0424312 B2 JPH0424312 B2 JP H0424312B2
Authority
JP
Japan
Prior art keywords
metal
oxide
ceramic member
oxygen
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57112402A
Other languages
English (en)
Japanese (ja)
Other versions
JPS593077A (ja
Inventor
Nobuyuki Mizunoya
Hajime Kohama
Yasuyuki Sugiura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP11240282A priority Critical patent/JPS593077A/ja
Priority to EP83106245A priority patent/EP0097944B1/en
Priority to DE8383106245T priority patent/DE3376829D1/de
Publication of JPS593077A publication Critical patent/JPS593077A/ja
Priority to US06/697,874 priority patent/US4693409A/en
Priority to US07/041,335 priority patent/US4849292A/en
Publication of JPH0424312B2 publication Critical patent/JPH0424312B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Ceramic Products (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP11240282A 1982-06-29 1982-06-29 セラミツク部材と金属との接合方法 Granted JPS593077A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP11240282A JPS593077A (ja) 1982-06-29 1982-06-29 セラミツク部材と金属との接合方法
EP83106245A EP0097944B1 (en) 1982-06-29 1983-06-27 Method for directly bonding ceramic and metal members and laminated body of the same
DE8383106245T DE3376829D1 (en) 1982-06-29 1983-06-27 Method for directly bonding ceramic and metal members and laminated body of the same
US06/697,874 US4693409A (en) 1982-06-29 1985-02-04 Method for directly bonding ceramic and metal members and laminated body of the same
US07/041,335 US4849292A (en) 1982-06-29 1987-04-22 Method for directly bonding ceramic and metal members and laminated body of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11240282A JPS593077A (ja) 1982-06-29 1982-06-29 セラミツク部材と金属との接合方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP32571489A Division JPH02199075A (ja) 1989-12-15 1989-12-15 セラミックス―金属接合体

Publications (2)

Publication Number Publication Date
JPS593077A JPS593077A (ja) 1984-01-09
JPH0424312B2 true JPH0424312B2 (enrdf_load_stackoverflow) 1992-04-24

Family

ID=14585753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11240282A Granted JPS593077A (ja) 1982-06-29 1982-06-29 セラミツク部材と金属との接合方法

Country Status (1)

Country Link
JP (1) JPS593077A (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59190279A (ja) * 1983-04-13 1984-10-29 株式会社東芝 セラミツクス構造体及びその製造方法
JPS60171277A (ja) * 1984-02-17 1985-09-04 株式会社東芝 金属−セラミツクス接合体
JPS6132752A (ja) * 1984-07-25 1986-02-15 松下電工株式会社 セラミツクス回路板の製法
JPS61291463A (ja) * 1985-06-17 1986-12-22 日本特殊陶業株式会社 高靭性セラミツク工具用材料
JP3011433B2 (ja) * 1990-05-25 2000-02-21 株式会社東芝 セラミックス回路基板の製造方法
US5863113A (en) * 1993-06-22 1999-01-26 Mitsubishi Rayon Co., Ltd. Plane light source unit
JP2764711B2 (ja) * 1996-07-10 1998-06-11 株式会社オーデン 空気清浄機
JP2001168250A (ja) * 1999-12-10 2001-06-22 Sumitomo Electric Ind Ltd 半導体用絶縁基板およびそれを用いた半導体装置並びに該基板の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5075208A (enrdf_load_stackoverflow) * 1973-11-07 1975-06-20
US4129243A (en) * 1975-07-30 1978-12-12 General Electric Company Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof
JPS58145669A (ja) * 1982-02-18 1983-08-30 株式会社明電舎 セラミツクスと銅の接合方法

Also Published As

Publication number Publication date
JPS593077A (ja) 1984-01-09

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