JPH0424079U - - Google Patents

Info

Publication number
JPH0424079U
JPH0424079U JP6587890U JP6587890U JPH0424079U JP H0424079 U JPH0424079 U JP H0424079U JP 6587890 U JP6587890 U JP 6587890U JP 6587890 U JP6587890 U JP 6587890U JP H0424079 U JPH0424079 U JP H0424079U
Authority
JP
Japan
Prior art keywords
electrostatic breakdown
semiconductor
breakdown test
measuring
test device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6587890U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6587890U priority Critical patent/JPH0424079U/ja
Publication of JPH0424079U publication Critical patent/JPH0424079U/ja
Pending legal-status Critical Current

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  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の静電破壊試験装置の実施例を
示すブロツク図、第２図は本実施例装置の静電破
壊試験室部を示す斜視図、第３図は本実施例の作
用を説明するフローチヤート、第４図は従来例の
作用を説明するフローチヤートである。 ２……ホストコンピユータ（パソコン）、５…
…静電破壊試験装置、６……試験装置本体、７…
…試験治具、８……電圧計、９……電流計、１０
……抵抗計、１１……静電破壊試験室部、１４…
…ＩＣ。 Fig. 1 is a block diagram showing an embodiment of the electrostatic breakdown test device of the present invention, Fig. 2 is a perspective view showing the electrostatic breakdown test chamber of the device of this embodiment, and Fig. 3 shows the operation of this embodiment. FIG. 4 is a flowchart explaining the operation of the conventional example. 2...Host computer (personal computer), 5...
...Electrostatic breakdown test device, 6...Test device main body, 7...
...Test jig, 8...Voltmeter, 9...Ammeter, 10
...Resistance meter, 11...Electrostatic breakdown test chamber section, 14...
...IC.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体部品の静電破壊試験を行いこの試験前後
の特性を参照して合否判定を行う静電破壊試験装
置において、治具にセツトされた半導体部品に所
定の電源を接続する本体部と、上記半導体部品の
電圧−電流特性を計測する電圧電流計測手段と、
上記半導体部品の絶縁特性を計測する絶縁計測手
段とを備えたことを特徴とする静電破壊試験装置
。 In an electrostatic breakdown test device that performs an electrostatic breakdown test on semiconductor components and makes a pass/fail judgment by referring to the characteristics before and after the test, the main body connects a predetermined power source to the semiconductor component set in a jig, and the semiconductor Voltage and current measuring means for measuring voltage-current characteristics of the component;
An electrostatic breakdown test device comprising: insulation measuring means for measuring insulation characteristics of the semiconductor component.
JP6587890U 1990-06-21 1990-06-21 Pending JPH0424079U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6587890U JPH0424079U (en) 1990-06-21 1990-06-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6587890U JPH0424079U (en) 1990-06-21 1990-06-21

Publications (1)

Publication Number Publication Date
JPH0424079U true JPH0424079U (en) 1992-02-27

Family

ID=31598108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6587890U Pending JPH0424079U (en) 1990-06-21 1990-06-21

Country Status (1)

Country Link
JP (1) JPH0424079U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6414899U (en) * 1987-07-16 1989-01-25
JP2010062344A (en) * 2008-09-04 2010-03-18 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 Method of evaluating wafer for semiconductor, method of manufacturing semiconductor wafer, and method of evaluating stage of manufacturing semiconductor wafer
JP2013195098A (en) * 2012-03-16 2013-09-30 Fujitsu Semiconductor Ltd Testing device, testing tool, and testing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6414899U (en) * 1987-07-16 1989-01-25
JPH0619039Y2 (en) * 1987-07-16 1994-05-18 四国化成工業株式会社 Connected sliding door
JP2010062344A (en) * 2008-09-04 2010-03-18 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 Method of evaluating wafer for semiconductor, method of manufacturing semiconductor wafer, and method of evaluating stage of manufacturing semiconductor wafer
JP2013195098A (en) * 2012-03-16 2013-09-30 Fujitsu Semiconductor Ltd Testing device, testing tool, and testing method

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