JPH0423343Y2 - - Google Patents
Info
- Publication number
- JPH0423343Y2 JPH0423343Y2 JP19388286U JP19388286U JPH0423343Y2 JP H0423343 Y2 JPH0423343 Y2 JP H0423343Y2 JP 19388286 U JP19388286 U JP 19388286U JP 19388286 U JP19388286 U JP 19388286U JP H0423343 Y2 JPH0423343 Y2 JP H0423343Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- circuit board
- printed circuit
- paste
- circuit element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011248 coating agent Substances 0.000 claims description 29
- 238000000576 coating method Methods 0.000 claims description 29
- 229920005992 thermoplastic resin Polymers 0.000 claims description 12
- 238000010586 diagram Methods 0.000 claims description 5
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000088 plastic resin Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19388286U JPH0423343Y2 (US20020051482A1-20020502-M00020.png) | 1986-12-16 | 1986-12-16 | |
| US07/116,662 US4833570A (en) | 1986-12-16 | 1987-11-03 | Electronic circuit assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19388286U JPH0423343Y2 (US20020051482A1-20020502-M00020.png) | 1986-12-16 | 1986-12-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6398678U JPS6398678U (US20020051482A1-20020502-M00020.png) | 1988-06-25 |
| JPH0423343Y2 true JPH0423343Y2 (US20020051482A1-20020502-M00020.png) | 1992-05-29 |
Family
ID=31150326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19388286U Expired JPH0423343Y2 (US20020051482A1-20020502-M00020.png) | 1986-12-16 | 1986-12-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0423343Y2 (US20020051482A1-20020502-M00020.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011134945A (ja) * | 2009-12-25 | 2011-07-07 | Toshiba Corp | 電子機器 |
| JP2020047770A (ja) * | 2018-09-19 | 2020-03-26 | 日立オートモティブシステムズ株式会社 | 電子装置および電子装置における回路基板の絶縁材層形成方法 |
-
1986
- 1986-12-16 JP JP19388286U patent/JPH0423343Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6398678U (US20020051482A1-20020502-M00020.png) | 1988-06-25 |
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