JPH0423329Y2 - - Google Patents
Info
- Publication number
- JPH0423329Y2 JPH0423329Y2 JP1984128347U JP12834784U JPH0423329Y2 JP H0423329 Y2 JPH0423329 Y2 JP H0423329Y2 JP 1984128347 U JP1984128347 U JP 1984128347U JP 12834784 U JP12834784 U JP 12834784U JP H0423329 Y2 JPH0423329 Y2 JP H0423329Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- resin
- semiconductor device
- screw
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 9
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984128347U JPS6144847U (ja) | 1984-08-24 | 1984-08-24 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984128347U JPS6144847U (ja) | 1984-08-24 | 1984-08-24 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6144847U JPS6144847U (ja) | 1986-03-25 |
| JPH0423329Y2 true JPH0423329Y2 (US20030157376A1-20030821-M00001.png) | 1992-05-29 |
Family
ID=30686978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984128347U Granted JPS6144847U (ja) | 1984-08-24 | 1984-08-24 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6144847U (US20030157376A1-20030821-M00001.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021080954A (ja) | 2019-11-15 | 2021-05-27 | 株式会社キッツ | 偏心型バタフライ弁 |
-
1984
- 1984-08-24 JP JP1984128347U patent/JPS6144847U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6144847U (ja) | 1986-03-25 |
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