JPH0423160U - - Google Patents
Info
- Publication number
- JPH0423160U JPH0423160U JP6502490U JP6502490U JPH0423160U JP H0423160 U JPH0423160 U JP H0423160U JP 6502490 U JP6502490 U JP 6502490U JP 6502490 U JP6502490 U JP 6502490U JP H0423160 U JPH0423160 U JP H0423160U
- Authority
- JP
- Japan
- Prior art keywords
- connection pad
- sop
- pad
- lead
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6502490U JPH0423160U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-06-20 | 1990-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6502490U JPH0423160U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-06-20 | 1990-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0423160U true JPH0423160U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-02-26 |
Family
ID=31596485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6502490U Pending JPH0423160U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-06-20 | 1990-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0423160U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05335731A (ja) * | 1992-05-29 | 1993-12-17 | Nippon Seiki Co Ltd | プリント基板 |
| US8309862B2 (en) | 2009-01-30 | 2012-11-13 | Mitsubishi Electric Corporation | Dual inline lead-type electronic-part-mounted printed circuit board, method of soldering dual inline lead-type electronic part, printed circuit board and air-conditioner |
| CN105555024A (zh) * | 2014-10-24 | 2016-05-04 | 富士施乐株式会社 | 基板、基板装置以及基板装置的制造方法 |
-
1990
- 1990-06-20 JP JP6502490U patent/JPH0423160U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05335731A (ja) * | 1992-05-29 | 1993-12-17 | Nippon Seiki Co Ltd | プリント基板 |
| US8309862B2 (en) | 2009-01-30 | 2012-11-13 | Mitsubishi Electric Corporation | Dual inline lead-type electronic-part-mounted printed circuit board, method of soldering dual inline lead-type electronic part, printed circuit board and air-conditioner |
| CN105555024A (zh) * | 2014-10-24 | 2016-05-04 | 富士施乐株式会社 | 基板、基板装置以及基板装置的制造方法 |
| JP2016086070A (ja) * | 2014-10-24 | 2016-05-19 | 富士ゼロックス株式会社 | 基板及び基板装置並びに基板装置の製造方法 |