JPH04231436A - ダイヤモンド含有材料及びダイヤモンド含有材料製品の製造方法 - Google Patents
ダイヤモンド含有材料及びダイヤモンド含有材料製品の製造方法Info
- Publication number
- JPH04231436A JPH04231436A JP3154131A JP15413191A JPH04231436A JP H04231436 A JPH04231436 A JP H04231436A JP 3154131 A JP3154131 A JP 3154131A JP 15413191 A JP15413191 A JP 15413191A JP H04231436 A JPH04231436 A JP H04231436A
- Authority
- JP
- Japan
- Prior art keywords
- diamond
- composite material
- metal material
- composite
- materials
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 62
- 239000010432 diamond Substances 0.000 title claims abstract description 60
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 55
- 239000002131 composite material Substances 0.000 claims abstract description 41
- 239000007769 metal material Substances 0.000 claims abstract description 18
- 239000000843 powder Substances 0.000 claims abstract description 14
- 239000000203 mixture Substances 0.000 claims description 22
- 239000000047 product Substances 0.000 claims description 19
- 239000002245 particle Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052749 magnesium Inorganic materials 0.000 claims description 7
- 239000011777 magnesium Substances 0.000 claims description 7
- 239000012467 final product Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000003562 lightweight material Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 11
- 229910052790 beryllium Inorganic materials 0.000 description 10
- 150000002739 metals Chemical class 0.000 description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 231100000956 nontoxicity Toxicity 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000008247 solid mixture Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C23/00—Alloys based on magnesium
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Powder Metallurgy (AREA)
- Carbon And Carbon Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US53247890A | 1990-06-01 | 1990-06-01 | |
| US532,478 | 1990-06-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04231436A true JPH04231436A (ja) | 1992-08-20 |
Family
ID=24121990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3154131A Pending JPH04231436A (ja) | 1990-06-01 | 1991-05-29 | ダイヤモンド含有材料及びダイヤモンド含有材料製品の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP0459474A1 (fr) |
| JP (1) | JPH04231436A (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6031285A (en) * | 1997-08-19 | 2000-02-29 | Sumitomo Electric Industries, Ltd. | Heat sink for semiconductors and manufacturing process thereof |
| US6270848B1 (en) | 1997-02-06 | 2001-08-07 | Sumitomo Electric Industries, Ltd. | Heat sink material for use with semiconductor component and method for fabricating the same, and semiconductor package using the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7279023B2 (en) | 2003-10-02 | 2007-10-09 | Materials And Electrochemical Research (Mer) Corporation | High thermal conductivity metal matrix composites |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2197655A (en) * | 1936-07-28 | 1940-04-16 | Carborundum Co | Article made from powdered mixes and its manufacture |
| JPS62274044A (ja) * | 1986-05-20 | 1987-11-28 | Sumitomo Electric Ind Ltd | 工具用ダイヤモンド塊体およびその製造方法 |
| US5008737A (en) * | 1988-10-11 | 1991-04-16 | Amoco Corporation | Diamond composite heat sink for use with semiconductor devices |
-
1991
- 1991-05-29 JP JP3154131A patent/JPH04231436A/ja active Pending
- 1991-05-29 EP EP91108843A patent/EP0459474A1/fr not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6270848B1 (en) | 1997-02-06 | 2001-08-07 | Sumitomo Electric Industries, Ltd. | Heat sink material for use with semiconductor component and method for fabricating the same, and semiconductor package using the same |
| US6031285A (en) * | 1997-08-19 | 2000-02-29 | Sumitomo Electric Industries, Ltd. | Heat sink for semiconductors and manufacturing process thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0459474A1 (fr) | 1991-12-04 |
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