JPH0422355B2 - - Google Patents

Info

Publication number
JPH0422355B2
JPH0422355B2 JP27037284A JP27037284A JPH0422355B2 JP H0422355 B2 JPH0422355 B2 JP H0422355B2 JP 27037284 A JP27037284 A JP 27037284A JP 27037284 A JP27037284 A JP 27037284A JP H0422355 B2 JPH0422355 B2 JP H0422355B2
Authority
JP
Japan
Prior art keywords
light
light emitting
emitting element
emitting diode
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP27037284A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61147586A (ja
Inventor
Hiroo Sakai
Toshihide Kawamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP59270372A priority Critical patent/JPS61147586A/ja
Publication of JPS61147586A publication Critical patent/JPS61147586A/ja
Publication of JPH0422355B2 publication Critical patent/JPH0422355B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0028Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0061Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP59270372A 1984-12-21 1984-12-21 発光ダイオ−ド Granted JPS61147586A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59270372A JPS61147586A (ja) 1984-12-21 1984-12-21 発光ダイオ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59270372A JPS61147586A (ja) 1984-12-21 1984-12-21 発光ダイオ−ド

Publications (2)

Publication Number Publication Date
JPS61147586A JPS61147586A (ja) 1986-07-05
JPH0422355B2 true JPH0422355B2 (el) 1992-04-16

Family

ID=17485341

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59270372A Granted JPS61147586A (ja) 1984-12-21 1984-12-21 発光ダイオ−ド

Country Status (1)

Country Link
JP (1) JPS61147586A (el)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2608893B2 (ja) * 1987-07-10 1997-05-14 松下電器産業株式会社 光学的パターン検出装置
JP4344978B2 (ja) * 2001-01-30 2009-10-14 ラボ・スフィア株式会社 室内照明装置
US20040264188A1 (en) * 2001-09-11 2004-12-30 Hare Tazawa Condensing element and forming method threfor and condensing element-carrying led lamp and linear light emitting device using led lamp as light source
JP2005109289A (ja) * 2003-10-01 2005-04-21 Nichia Chem Ind Ltd 発光装置
JP2005223112A (ja) * 2004-02-05 2005-08-18 Citizen Electronics Co Ltd 表面実装型発光ダイオード

Also Published As

Publication number Publication date
JPS61147586A (ja) 1986-07-05

Similar Documents

Publication Publication Date Title
US4698730A (en) Light-emitting diode
KR100436302B1 (ko) 광소자용 광학 디바이스 및 해당 광소자용 광학디바이스를 이용한 기기
JP2002314137A (ja) 反射型発光ダイオード
GB2282700A (en) Optical element for use with an LED
JPH01130578A (ja) 発光ダイオード
JPH0436588B2 (el)
JPH0436590B2 (el)
JPH0628725Y2 (ja) Ledランプ用レンズ
JPS61214485A (ja) 光源用led
JP4143074B2 (ja) 発光ダイオード
JP2004088007A (ja) 発光ダイオード
JPH0422356B2 (el)
JPH0422355B2 (el)
JP2556821Y2 (ja) 発光装置
JP2002134794A (ja) 光素子用光学デバイス
JPH0611365U (ja) 発光ダイオード
JPH0794785A (ja) 発光ダイオ−ド
JPH01241184A (ja) 反射型フォトセンサ
JP4330716B2 (ja) 投光装置
JPS61187384A (ja) 発光ダイオ−ド
JPS61198692A (ja) 発光ダイオ−ド
JPS5815287A (ja) 光半導体装置
JPH03288479A (ja) 発光素子
JP2000261038A (ja) 発光ダイオード
JPH0436589B2 (el)