JPH0422355B2 - - Google Patents
Info
- Publication number
- JPH0422355B2 JPH0422355B2 JP27037284A JP27037284A JPH0422355B2 JP H0422355 B2 JPH0422355 B2 JP H0422355B2 JP 27037284 A JP27037284 A JP 27037284A JP 27037284 A JP27037284 A JP 27037284A JP H0422355 B2 JPH0422355 B2 JP H0422355B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- emitting element
- emitting diode
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 230000004907 flux Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
- -1 wire bonded Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59270372A JPS61147586A (ja) | 1984-12-21 | 1984-12-21 | 発光ダイオ−ド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59270372A JPS61147586A (ja) | 1984-12-21 | 1984-12-21 | 発光ダイオ−ド |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61147586A JPS61147586A (ja) | 1986-07-05 |
JPH0422355B2 true JPH0422355B2 (de) | 1992-04-16 |
Family
ID=17485341
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59270372A Granted JPS61147586A (ja) | 1984-12-21 | 1984-12-21 | 発光ダイオ−ド |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61147586A (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2608893B2 (ja) * | 1987-07-10 | 1997-05-14 | 松下電器産業株式会社 | 光学的パターン検出装置 |
JP4344978B2 (ja) * | 2001-01-30 | 2009-10-14 | ラボ・スフィア株式会社 | 室内照明装置 |
EP1434277A4 (de) * | 2001-09-11 | 2005-01-26 | Bridgestone Corp | Kondensierungselement und herstellungsverfahren dafür und kondensierungselement-tragende led-lampe und linear-lichtemissionseinrichtung mit led-lampe als lichtquelle |
JP2005109289A (ja) * | 2003-10-01 | 2005-04-21 | Nichia Chem Ind Ltd | 発光装置 |
JP2005223112A (ja) * | 2004-02-05 | 2005-08-18 | Citizen Electronics Co Ltd | 表面実装型発光ダイオード |
-
1984
- 1984-12-21 JP JP59270372A patent/JPS61147586A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61147586A (ja) | 1986-07-05 |
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