JPH0422351B2 - - Google Patents
Info
- Publication number
- JPH0422351B2 JPH0422351B2 JP59216938A JP21693884A JPH0422351B2 JP H0422351 B2 JPH0422351 B2 JP H0422351B2 JP 59216938 A JP59216938 A JP 59216938A JP 21693884 A JP21693884 A JP 21693884A JP H0422351 B2 JPH0422351 B2 JP H0422351B2
- Authority
- JP
- Japan
- Prior art keywords
- die bonding
- tie bar
- lead frame
- bonding part
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920003002 synthetic resin Polymers 0.000 claims description 9
- 239000000057 synthetic resin Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59216938A JPS6195583A (ja) | 1984-10-16 | 1984-10-16 | Ledを用いた面光源体の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59216938A JPS6195583A (ja) | 1984-10-16 | 1984-10-16 | Ledを用いた面光源体の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6195583A JPS6195583A (ja) | 1986-05-14 |
JPH0422351B2 true JPH0422351B2 (sv) | 1992-04-16 |
Family
ID=16696278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59216938A Granted JPS6195583A (ja) | 1984-10-16 | 1984-10-16 | Ledを用いた面光源体の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6195583A (sv) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0268459U (sv) * | 1988-11-15 | 1990-05-24 | ||
JPH07104183B2 (ja) * | 1990-11-30 | 1995-11-13 | 日本電装株式会社 | 自発光指針 |
TWI228304B (en) * | 2003-10-29 | 2005-02-21 | Advanced Semiconductor Eng | Method for manufacturing ball grid package |
WO2007034537A1 (ja) * | 2005-09-20 | 2007-03-29 | Renesas Technology Corp. | Led光源およびその製造方法 |
JP2014212139A (ja) * | 2011-12-06 | 2014-11-13 | 加藤 宣和 | Ledパッケージ及びledパッケージの製造方法 |
WO2014171492A1 (ja) * | 2013-04-19 | 2014-10-23 | シャープ株式会社 | 発光装置の製造方法及び照明装置の製造方法 |
CN104183582A (zh) * | 2014-07-24 | 2014-12-03 | 厦门市瀚锋光电科技有限公司 | Led灯芯组合光源 |
-
1984
- 1984-10-16 JP JP59216938A patent/JPS6195583A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6195583A (ja) | 1986-05-14 |
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