JPH04221774A - Wiring jig for inspecting wiring of high density board - Google Patents

Abstract

PURPOSE:To perform reliable inspection of the wiring of a board brought into a high density state without adjoining probes making contact with each other. CONSTITUTION:A number of holes are formed at intervals of a given distance in a non-conductive plate supported to the board by means of a pin. A probe body is vertically movably held in each of a number of the holes, a probe cylinder part the upper outer periphery of which is caulked is pressed in and locked, and a lead wire is connected to the lower end of the probe cylinder part.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring jig used to inspect wiring for quality assurance of high-density printed circuit boards.

0002

2. Description of the Related Art A conventional wiring jig uses a non-conductive board 1 made of baking material, acrylic material, glass epoxy material, etc., supported by pins P on a base board B as shown in FIG. A socket 3 is press-fitted into the hole 2 drilled in the same manner as shown in FIG.
is inserted, and a lead wire 5 is connected to the cylindrical body 4b of the probe 4 from below the socket 3.

[0003] In order to inspect the board with this wiring jig 6,
By placing the substrate on the wiring jig 6 and pressing it, the tip of the main body 4a of the probe 4 comes into contact with the pad portion of the substrate, and inspection is performed.

0004

By the way, in the above-mentioned wiring jig 6, the diameter of the hole 2 is large because the socket 3 is press-fitted into the hole 2 drilled in the board 1 made of baking material or acrylic material. In addition, there are tolerances in the outer dimensions of the flange 3a of the socket 3, and since the flange 3a is pressed when the socket 3 is press-fitted, the outer diameter becomes larger than before press-fitting, so the gap between the probes 4 is reduced. is almost eliminated, so by increasing the density, the pad pitch is 0.5 mm and the pad length is 1.0 mm.
In wiring inspection of the board, adjacent probes 4 touch,
There may be a short circuit. That is, the outer diameter of the socket 3 corresponding to the above board is 0.74 mm, and the outer diameter of the probe 4 is 0.74 mm.
．． In the wiring jig 6 of 5 mm, the gap between the probes 4 is 0.
Since the gap between the sockets 3 is 78 mm and the maximum gap is 40 microns, a short circuit may occur and wiring inspection may not be possible.

[0005] Incidentally, the gap to prevent short circuit is 0.15.
About mm is required.

SUMMARY OF THE INVENTION An object of the present invention is to provide a wiring jig that can reliably inspect wiring on a high-density board without causing adjacent probes to come into contact with each other.

[0007]

[Means for Solving the Problems] In order to solve the above problems, the wiring jig for high-density board wiring inspection of the present invention has many holes in a non-conductive plate supported by pins on the base. The probe tubes, which hold the probe bodies movably up and down and are caulked on the upper outer periphery, are press-fitted into the numerous holes, which are drilled at required intervals, and the lead wires are attached to the lower ends of the probe tubes. It is made by connecting wires.

[0008]

[Function] As described above, the wiring jig for high-density board wiring inspection of the present invention press-fits and locks the probe tube into a hole drilled in a baking material or acrylic material plate without using a socket. Since the probe body is erected, even if the pitch between the probes becomes narrower, there is still enough space to compensate for the lack of a socket. Therefore, the probe will not be short-circuited during wiring inspection of a high-density board.

[0009]

[Example] An embodiment of the wiring jig for high-density board wiring inspection of the present invention will be explained with reference to the drawings.The baking material shown in FIG. A plate 1 with a thickness of 6.4 mm, a length of 250 mm, and a width of 200 mm has a diameter of 0.5 m at a staggered pitch of 0.78 mm as a dense part.
Eight m-sized holes 2 are drilled, and the other rough parts have a diameter of 0.
．． 198 holes 2 of 5 mm are drilled, and the main body 4a of the probe 4 is held inside the holes 2 so as to be movable up and down, as shown in FIG. 4 is press-fitted and locked, and a lead wire 5 is connected to the lower end of the probe cylinder section 4b.

In order to inspect the wiring of a high-density board using the wiring jig 6' constructed as described above, the high-density board is placed on the wiring jig 6' and pressed, thereby making it possible to inspect the wiring of the probe body 4a. The tip comes into contact with the pad portion of the high-density board, and wiring inspection is performed. During this wiring inspection, the probe tube portion 4b does not fall out of the hole 2 even if the probe body 4a descends. Further, as described above, in the wiring jig of the embodiment, the probe tube portion 4b is press-fitted into the hole 2 drilled in the baking material or acrylic material plate without using a socket, and the probe body 4a is erected. Therefore, the pitch F between the probe bodies 4a is 0.
．． A gap can be secured even if the width is as narrow as 65 mm. Therefore, the probe 4 will not be short-circuited during the wiring inspection.

Incidentally, the wiring jig of the present invention can be manufactured with probes 4 having a pitch of up to 0.4 mm.

0012

Effects of the Invention As described above, the wiring jig for high-density board wiring inspection of the present invention can secure a gap corresponding to the lack of a socket even if the pitch between the probes becomes narrower, and therefore the wiring jig for high-density board wiring can be secured. During inspection, the probe does not short-circuit, and inspection can be performed reliably, improving reliability.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional view of a main part of a wiring jig for high-density board wiring inspection according to the present invention.

2 is a diagram showing a means for caulking the upper outer periphery of the cylindrical portion of the probe of the wiring jig shown in FIG. 1; FIG.

FIG. 3 is a perspective view of a conventional wiring jig for inspecting board wiring.

4 is a vertical sectional view of a main part of the wiring jig shown in FIG. 3; FIG.

[Explanation of symbols]

B. Foundation P pin 1 board 2 Hole 4 Probe 4a Main body 4b Cylinder part 5 Lead wire

Claims (1)

[Claims] Claim 1: A non-conductive plate supported by pins on a base plate has a large number of holes drilled at required intervals, each of which holds a probe body vertically movably, A wiring jig for high-density board wiring inspection, in which a caulked probe tube is press-fitted and a lead wire is connected to the lower end of the probe tube.