JPH04214660A - Lead frame for resin-sealed semiconductor device - Google Patents

Lead frame for resin-sealed semiconductor device

Info

Publication number
JPH04214660A
JPH04214660A JP40147290A JP40147290A JPH04214660A JP H04214660 A JPH04214660 A JP H04214660A JP 40147290 A JP40147290 A JP 40147290A JP 40147290 A JP40147290 A JP 40147290A JP H04214660 A JPH04214660 A JP H04214660A
Authority
JP
Japan
Prior art keywords
island
resin
semiconductor device
height
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP40147290A
Other languages
Japanese (ja)
Inventor
Naoyuki Murai
村井　直幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP40147290A priority Critical patent/JPH04214660A/en
Publication of JPH04214660A publication Critical patent/JPH04214660A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent that an island and a bonding wire are revealed from a sealing resin part by a method wherein at least one out of an upper-side protrusion and a lower-side protrusion which protrude, by a prescribed height, from the surface or the rear surface is formed at a suspension lead. CONSTITUTION:The height of upper-side protrusions 21 is made a little higher than the height of bonding wires 6 when a semiconductor pellet 5 is mounted and fixed onto an island 1 and electrodes of the semiconductor pellet 5 are connected to inner leads 3 by using the bonding wires 6. It is sufficient that the height protruding from the rear surface of the lower-side protrusions 21 protrudes slightly to the lower part from the rear surface of the island 1. When the upper-side protrusions 21 and lower-side protrusions 22 are formed in this manner, the island 1, the semiconductor pellet 5 and the bonding wires 6 with reference to the surface and the rear surface of a sealing resin part 4 can be arranged in nearly optimum positions.

Description

【発明の詳細な説明】[Detailed description of the invention]

【０００１】0001

【産業上の利用分野】本発明は樹脂封止型半導体装置用
リードフレームに関し、特にアイランドを吊りリードで
保持する構造の樹脂封止型半導体装置用リードフレーム
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame for a resin-sealed semiconductor device, and more particularly to a lead frame for a resin-sealed semiconductor device having a structure in which an island is held by a hanging lead.

【０００２】0002

【従来の技術】従来の樹脂封止型半導体装置用リードフ
レームは、第１の例として図３（Ａ），（Ｂ）に示すよ
うに、半導体ペレットを搭載固定するためのアイランド
１と、このアイランド１の４つのコーナーを枠部に保持
する４本の吊りリード２ａと、半導体ペレットの各電極
とそれぞれ対応して接続するための複数のインナーリー
ド３とを有し、これらアイランド１，吊りリード２ａ，
及びインナーリード３は一つの平面上に形成された構造
となっていた。2. Description of the Related Art A conventional lead frame for a resin-sealed semiconductor device includes an island 1 for mounting and fixing a semiconductor pellet, and an island 1 for mounting and fixing a semiconductor pellet, as shown in FIGS. The island 1 has four suspension leads 2a that hold the four corners of the island 1 in the frame, and a plurality of inner leads 3 that correspond to and connect to each electrode of the semiconductor pellet. 2a,
The inner leads 3 were formed on one plane.

【０００３】また、第２の例として図４に示すように、
アイランド１を周辺より低くした構造のものもあった。[0003] As a second example, as shown in FIG.
Some structures had Island 1 lower than the surrounding area.

【０００４】0004

【発明が解決しようとする課題】上述した従来の樹脂封
止型半導体装置用リードフレームは、アイランド１，吊
りリード２ａ，及びインナーリード３が１つの平面上に
形成されるか、アイランド１を周辺より低くした構造と
なっているので、これらリードフレームを使って樹脂封
止型半導体装置を製作する際、封止樹脂部に対しアイラ
ンド１が浮き沈みし、アイランド１が浮いたときには、
アイランド１上に搭載固定した半導体ペレットの電極と
インナーリード３とを接続するボンディングワイヤが封
止樹脂部から露出したり、沈んだときには、アイランド
１が露出して不良が発生しやすいという問題があった。[Problems to be Solved by the Invention] In the conventional lead frame for a resin-sealed semiconductor device as described above, the island 1, the hanging leads 2a, and the inner leads 3 are formed on one plane, or the island 1 is formed on the periphery. Since it has a lower structure, when manufacturing a resin-sealed semiconductor device using these lead frames, the island 1 rises and falls with respect to the encapsulating resin part, and when the island 1 floats,
When the bonding wire connecting the electrode of the semiconductor pellet mounted and fixed on the island 1 and the inner lead 3 is exposed from the sealing resin part or sinks, there is a problem that the island 1 is exposed and defects are likely to occur. Ta.

【０００５】本発明の目的は、封止樹脂部からアイラン
ドやボンディングワイヤ等が露出すのを防止することが
できる樹脂封止型半導体装置用リードフレームを提供す
ることにある。An object of the present invention is to provide a lead frame for a resin-sealed semiconductor device that can prevent islands, bonding wires, etc. from being exposed from the sealing resin portion.

【０００６】[0006]

【課題を解決するための手段】本発明の樹脂封止型半導
体装置用リードフレームは、半導体ペレットを搭載固定
するためのアイランドと、このアイランドの所定の位置
を枠部に保持する複数の吊りリードと、前記半導体ペレ
ットの各電極とそれぞれ対応して接続するための複数の
インナーリードとを有する樹脂封止型半導体装置用リー
ドフレームにおいて、前記各吊りリードの所定の位置に
これら吊りリードの上面から上側に予め設定された高さ
だけ突出した上側突部及び下面から下側に予め設定され
た高さだけ突出した下側突部のうちの少なくとも一方を
設けて構成される。[Means for Solving the Problems] A lead frame for a resin-sealed semiconductor device of the present invention includes an island for mounting and fixing a semiconductor pellet, and a plurality of hanging leads that hold the island at a predetermined position in the frame. and a plurality of inner leads for connection to each electrode of the semiconductor pellet, respectively. It is configured to include at least one of an upper protrusion that protrudes upward by a preset height and a lower protrusion that protrudes downward from the lower surface by a preset height.

【０００７】[0007]

【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments Next, embodiments of the present invention will be described with reference to the drawings.

【０００８】図１（Ａ），（Ｂ）はそれぞれ本発明の一
実施例を示す平面図及びこの実施例のアイランド，吊り
リードの側面図である。FIGS. 1A and 1B are a plan view showing an embodiment of the present invention, and a side view of an island and a suspension lead of this embodiment, respectively.

【０００９】この実施例が図３（Ａ），（Ｂ）に示され
た従来の樹脂封止型半導体装置用リードフレームと相違
する点は、各吊りリード２のアイランド１に近い位置に
、これら吊りリード２の上面から上側に予め設定された
高だけ突出した上側突部２１、及び吊りリード２の下面
から下側に予め設定された高さだけ突出した下側突部２
２を設けた点にある。This embodiment is different from the conventional resin-sealed semiconductor device lead frame shown in FIGS. An upper protrusion 21 protrudes upward from the upper surface of the suspension lead 2 by a preset height, and a lower protrusion 2 protrudes downward from the lower surface of the suspension lead 2 by a predetermined height.
2 was established.

【００１０】図２はこの実施例を適用した樹脂封止型半
導体装置の断面側面図である。FIG. 2 is a cross-sectional side view of a resin-sealed semiconductor device to which this embodiment is applied.

【００１１】上側突部２１の高さは、図２に示すように
、アイランド１上に半導体ペレット６を搭載固定し、こ
の半導体ペレット６の電極とインナーリード３とをボン
ディングワイヤ７で接続したときのボンディングワイヤ
７の高さよりやや高くする。また、下側突部２１の下面
から突出した高さは、アイランド１の下面から下方にわ
ずかに突出する程度でよい。As shown in FIG. 2, the height of the upper protrusion 21 is determined when the semiconductor pellet 6 is mounted and fixed on the island 1 and the electrode of the semiconductor pellet 6 and the inner lead 3 are connected with the bonding wire 7. The height of the bonding wire 7 is slightly higher than that of the bonding wire 7. Further, the height of the lower protrusion 21 protruding from the lower surface may be such that it protrudes slightly downward from the lower surface of the island 1.

【００１２】このように、上側突部２１及び下側突部２
２を設けることにより、封止樹脂部４の上面及び下面に
対するアイランド１，半導体ペレット６，及びボンディ
ングワイヤ７の位置をほぼ最適な位置に配置することが
でき、従ってアイランド１やボンディングワイヤ７等が
封止樹脂部４から露出するのを防止することができる。In this way, the upper protrusion 21 and the lower protrusion 2
2, the island 1, the semiconductor pellet 6, and the bonding wire 7 can be arranged at almost optimal positions with respect to the upper and lower surfaces of the sealing resin part 4, so that the island 1, the bonding wire 7, etc. Exposure from the sealing resin portion 4 can be prevented.

【００１３】なお、上側突部２１及び下側突部２２のう
ちの一方だけを設けた構造であっても、この設けられた
上側突部２１又は下側突部２２の先端と封止樹脂部４と
の表面との間隔を予め設定された値に保持することによ
り同様の効果が得られる。Note that even in a structure in which only one of the upper protrusion 21 and the lower protrusion 22 is provided, the tip of the provided upper protrusion 21 or the lower protrusion 22 and the sealing resin part A similar effect can be obtained by keeping the distance between the surface and the surface at a predetermined value.

【００１４】[0014]

【発明の効果】以上説明したように本発明は、アイラン
ドを保持する吊りリードに、上面又は下面から所定の高
さだけを突出した上側突部，下側突部のうちの少なくと
も一方を設けた構造とすることにより、これら上側突部
，下側突部により、アイランド，半導体ペレット，及び
ボンディングワイヤを封止樹脂部内の最適位置に配置す
ることができるので、アイランドやボンディングワイヤ
が封止樹脂部から露出するのを防止することができる効
果がある。[Effects of the Invention] As explained above, the present invention provides a hanging lead that holds an island with at least one of an upper protrusion and a lower protrusion that protrude by a predetermined height from the upper or lower surface. With this structure, the islands, semiconductor pellets, and bonding wires can be placed at optimal positions within the encapsulating resin part using these upper and lower protruding parts, so that the islands and bonding wires can be placed in the encapsulating resin part. It has the effect of preventing exposure from

【図面の簡単な説明】[Brief explanation of the drawing]

【図１】本発明の一実施例を示す平面図及びこの実施例
のアイランド，吊りリードの側面図である。FIG. 1 is a plan view showing an embodiment of the present invention, and a side view of an island and a suspension lead of this embodiment.

【図２】図１に示された実施例を適用した樹脂封止型半
導体装置の断面側面図である。FIG. 2 is a cross-sectional side view of a resin-sealed semiconductor device to which the embodiment shown in FIG. 1 is applied.

【図３】従来の樹脂封止型半導体装置用リードフレーム
の第１の例の平面図及びそのアイランド，吊りリードの
側面図である。FIG. 3 is a plan view of a first example of a conventional lead frame for a resin-sealed semiconductor device, and a side view of its island and hanging leads.

【図４】従来の樹脂封止型半導体装置用リードフレーム
の第２の例のアイランド，吊りリードの側面図である。FIG. 4 is a side view of an island and hanging leads of a second example of a conventional lead frame for a resin-sealed semiconductor device.

【符号の説明】[Explanation of symbols]

１　　　　アイランド ２，２ａ，２ｂ　　　　吊りリード ３　　　　インナーリード ４　　　　封止樹脂部 ５　　　　半導体ペレット ６　　　　ボンディングワイヤ ２１　　　　上側突部 ２２　　　　下側突部 1 Island 2, 2a, 2b Hanging lead 3 Inner lead 4 Sealing resin part 5 Semiconductor pellets 6 Bonding wire 21 Upper protrusion 22 Lower protrusion

Claims (1)

【特許請求の範囲】[Claims] 半導体ペレットを搭載固定するためのアイランドと、こ
のアイランドの所定の位置を枠部に保持する複数の吊り
リードと、前記半導体ペレットの各電極とそれぞれ対応
して接続するための複数のインナーリードとを有する樹
脂封止型半導体装置用リードフレームにおいて、前記各
吊りリードの所定の位置にこれら吊りリードの上面から
上側に予め設定された高さだけ突出した上側突部及び下
面から下側に予め設定された高さだけ突出した下側突部
のうちの少なくとも一方を設けたことを特徴とする樹脂
封止型半導体装置用リードフレーム。An island for mounting and fixing a semiconductor pellet, a plurality of hanging leads for holding the island in a predetermined position on a frame, and a plurality of inner leads for connecting to each electrode of the semiconductor pellet in a corresponding manner. In the lead frame for a resin-sealed semiconductor device, an upper protrusion protrudes from the upper surface of each of the suspension leads by a predetermined height at a predetermined position of each of the suspension leads, and an upper protrusion that is preset downward from the lower surface of each of the suspension leads. 1. A lead frame for a resin-sealed semiconductor device, characterized in that at least one of the lower protrusions protrudes by a height.
JP40147290A 1990-12-12 1990-12-12 Lead frame for resin-sealed semiconductor device Pending JPH04214660A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP40147290A JPH04214660A (en) 1990-12-12 1990-12-12 Lead frame for resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP40147290A JPH04214660A (en) 1990-12-12 1990-12-12 Lead frame for resin-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPH04214660A true JPH04214660A (en) 1992-08-05

Family

ID=18511297

Family Applications (1)

Application Number Title Priority Date Filing Date
JP40147290A Pending JPH04214660A (en) 1990-12-12 1990-12-12 Lead frame for resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPH04214660A (en)

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