JPH042108A - Laminated type lc element and manufacture thereof - Google Patents

Abstract

PURPOSE:To obtain a small-sized low-cost laminated type LC element capable of suppressing and eliminating intruding nosies by continuously winding a first conductor extending over sections among other layers from sections among one layers among the layers of a plurality of laminated insulating layers, operating the first conductor as a coil in the specified number of turns while oppositely mounting a second conductor through said first conductor and the insulating layers and forming capacitance between the first and second conductors. CONSTITUTION:An LC element has a laminate 30 formed by laminating a plurality of insulating plates 32-1, 32-2...32-4, a first conductor 40 being formed among sections 36-2, 36-3, 36-4 among the layers of the insulating plates 32 and forming a coil in the specified number of turns, and a second conductor 50 shaped so as to be oppositely faced to the first conductor 40 through the insulating plates 32 among sections 36-1, 36-2, 36-3 among the layers of the insulating plates 32. The first conductor 40 and the second conductor 50 are composed of a plurality of first conductive elements 44-1, 44-2, 44-3 and second conductive elements 54-1, 54-2, 54-3 continuously wound extending over sections among other layers from sections among one layers in the sections 36-1, 36-2...36-4 among the layers of the insulating plates 32. The first and second conductive elements 44, 54 are faced oppositely through the insulating plates 32, and capacitance is formed approximately continuously between both conductive elements. The laminated type LC element is used as an LC noise filter, thus displaying excellent damping characteristics extending over a wide zone.

Description

[Detailed description of the invention]

[0001]

[Industrial application field]

The present invention relates to a laminated LC element, and particularly to a distributed constant LC element in which a distributed constant LC circuit including an inductor conductor and a capacitor conductor is formed in a laminated body in which a plurality of insulating layers are laminated. [0002]

[Conventional technology]

With the recent development of electronic technology, electronic circuits are widely used in various fields, and it is therefore desirable to operate these electronic circuits stably and reliably without being affected by external noise. . [0003] In particular, in recent years, as a large number of various high-performance electronic devices are being used, regulations regarding noise have become increasingly strict. Therefore, it is desired to develop a compact and high-performance noise filter that can reliably remove the generated noise. [0004] However, in the conventional LC noise filter, as shown in FIG. 21, two sets of windings 12.14 are wound around the core 10, and capacitors 16.18 are connected in parallel to both ends of these windings 12.14. It was formed by connecting. [0005] Therefore, the core 10 and the winding 12 constituting the inductor
．． Since the portion 14 is large and the inductor and capacitors 16 and 18 are made of separate members, the entire filter becomes large and the required quality of miniaturization and weight reduction cannot be satisfied. [0006] In order to solve such problems, Japanese Patent Application Laid-Open No. 56-5050
No. 7, JP-A-56-144524, JP-A-56-14
No. 2622 and Japanese Unexamined Patent Publication No. 63-76313 have been proposed. [0007] In the composite electronic component disclosed in this prior art, for example, Japanese Patent Laid-Open No. 56-50507, as shown in FIG. form. And each of the insulator layers 20a, 2
Conductive patterns 22a, 22b, 22c are provided between the layers 0b, . [0008] Also, conductive layers 24a, 24b are arranged between the insulator layers 20a, 20b, 20c, . . . at intervals from the circular conductive patterns 22a, 22c, and
A capacitance C is formed between a, 24b and the conductive patterns 22a, 22c. [0009] As a result, a lumped constant type noise filter consisting of L and C can be obtained as shown in FIG. [0010]Furthermore, in this prior art, since L and C are incorporated into the laminate, it can be used as a small and lightweight LC noise filter. [0011]

[Problem to be solved by the invention]

(2) However, in this LC filter, conductive layers 24a and 24c that form capacitance are simply provided adjacent to each other on a straight line portion of a portion 22a22c of a conductive pattern forming a coil. Therefore, there was a problem in that the capacitance C between the coil and the conductive layer 24 was small, making it impossible to obtain good attenuation characteristics. [0012] In particular, this LC filter is formed as a lumped constant type LC filter as shown in FIG. Therefore, there has been a problem that various noises, particularly common mode noise such as switching surge, and normal mode noise such as ripple cannot be reliably removed. [0013] Furthermore, this LC filter has a problem in that it can only be used as a 3-terminal normal mode filter, and cannot be used as a 4-terminal common mode noise filter. [0014] The present invention has been made in view of such conventional problems, and its purpose is to provide a small-sized stacked LC element that can reliably remove intruding noise. [0015] Another object of the present invention is to provide a multilayer LC element that can be used not only as a normal mode noise filter but also as a common mode noise filter if necessary. [0016]

[Means to solve the problem]

In order to achieve the above object, the stacked LC device of the present invention has the following features:
A laminate in which a plurality of insulating layers are laminated, and a first conductive element that continuously circulates from one layer to another between the insulating layers, and forming a coil with a predetermined number of turns. A second conductive element is provided between the first conductor and the insulating layer, the second conductive element continuously circulating from the first conductor to the other layer and facing the first conductive element through the insulating layer. and a second conductor forming a capacitance between the first conductor and the first conductor. [0017]

[Effect]

Next, the present invention will be explained in detail. [0018] The LC element of the present invention has a laminate formed by laminating a plurality of insulating layers. [0019]The first conductor is provided so that the first conductive element continuously circulates between the layers of the insulating layer from one layer to the other layer. This allows the first
The conductor will function as a coil with a predetermined inductance. [0020] Further, the second conductor is provided so that the second conductive element continuously circulates between the layers of the insulator from one layer to the other layer. [0021] A characteristic feature of the present invention is that the first conductive element is provided to face the second conductive element with an insulating layer interposed therebetween, and a capacitance is formed between the two. It is in. [0022] At this time, it is presumed that the second conductor forms a capacitance with the first conductor in a distributed constant manner. Therefore, the stacked LC device of the present invention has a distributed constant type L
Functions as a C filter, compared to conventional lumped constant type LC
It is possible to obtain good attenuation characteristics over a relatively wide band compared to a filter, and it is possible to remove various noises without causing ringing or the like. In particular, the laminated type L of the present invention
In the C element, the C component and the C component of the distributed constant circuit function effectively, and various noises can be effectively removed. [0023] Furthermore, the multilayer LC element of the present invention can be used as a normal mode LC noise filter by providing a ground terminal on the second conductor and providing input/output terminals at both ends of the first conductor. . [0024]Furthermore, the laminated LC element of the present invention can also be used as a common mode LC noise filter by providing input/output terminals at both ends of the first and second conductors. [0025]

【Example】

Next, preferred embodiments of the invention will be described in detail based on the drawings. [0026] First Embodiment A preferred example of the present invention is shown in FIGS. 1 to 3. [0027] The LC element of the example includes a plurality of insulating plates 32-1, 32-2
... 32-4, and a first conductor provided between the layers 36-2, 36-3, 36-4 of the insulating plate 32 and forming a coil with a predetermined number of turns. 40
and the interlayer 36-1.36-2.36- of the insulating plate 32.
3, a second conductor 50 is provided to face the first conductor 40 with an insulating plate 32 in between. [0028] Each of the insulating plates 32 may be formed using various insulating materials as necessary. Examples of this insulating material include ceramics, plastics, and various synthetic resins, but in this embodiment, ceramics are used. [0029] In the laminate 30 of the embodiment, in order to prevent short circuit between the first conductor 40 and the second conductor 50, each insulating plate 30 is covered with an interlayer insulating sheet 34-1.34-2.34-3. Laminated through. [0030] The terminal 42a of the first conductor 40 is provided on the surface of the uppermost insulating plate 32-1 and the lowermost insulating sheet 34-3.
, 42b and the terminals 52a, 52b of the second conductor 50 are coated. [0031] Further, the first conductor 40 and the second conductor 50 are connected to the interlayers 36-1, 36-2...36-4 of the insulating plate 32.
A plurality of first conductive elements 44-1.44-2.44 continuously circulate from one layer to another layer.
-3 and second conductive element 54-1.54-2
．． 54-3. [0032] What is characteristic here is that the first and second conductive elements 44 and 54 face each other with the insulating plate 32 in between, and a capacitance is almost continuously formed between them. be. [0033] Accordingly, the first and second conductors 40.50 each function as a coil having a predetermined number of turns, and the insulating plate 32 is disposed between the first and second conductors 40.50.
A capacitance C is formed substantially continuously through the first and second conductors 40 .
It is estimated that the distribution constant is formed between 50 and 50. [0034] Here, the first example of the embodiment. second conductive niremen)
44 and 54 are coated on both sides of the insulating plate 32 so as to face each other using a technique such as printing, vapor deposition, or plating. In addition, the conductive patterns 46.56 for connection are also
A coating is formed on the insulating plate 32. [0035] The terminal 52a formed on the surface of the insulating plate 32-1
is connected to the second conductive element 54-1 provided on the insulating plate 32-2 via the through hole 33. Similarly, the terminal 52b coated on the lowermost insulating sheet 34-3 is also connected to the insulating sheet 34-3. It is connected to the second conductive element 54-3 via a through hole 35.33 provided in the insulating plate 34-4. [0036] Similarly, one input terminal 42-b provided on the surface of the insulating plate 32-1 is connected via the through hole 33 and conductive pattern 46 provided in each insulating plate 32-1, 32-2. , is connected to an end of a first conductive element 44-1 provided on the back side of the insulating plate 32-2. Similarly, the other input/output terminal 42a provided on the lowermost interlayer insulation sheet 34-3 is connected to the insulation plate 32 through the through hole 35.
-1st conductive element 44 coated on -4-
Connected to 3. [0037] Furthermore, the first conductive element 44 and the second conductive element 54 coated on each insulating plate 32-2, 32-3, 32-4 are formed on each insulating plate 32. through hole 33. The conductive patterns 46, 56 and the through holes 35 provided on the interlayer insulating sheet 34 are electrically connected so as to circulate from one layer 36 to another layer 36. [0038] Thus, in the laminated LC element of the embodiment, the first conductor 40 has both ends connected to the terminals 42a and 42b, and functions as a coil having a predetermined inductance L1. Similarly, the second conductor 50 is
Its both ends are connected to terminals 52a and 52b, and it functions as a coil having a predetermined inductance L2. [0039] Moreover, as mentioned above, these first. second conductor 40
．． 50, it is estimated that the capacitance C is formed almost continuously and in a distributed constant manner. [00401] Therefore, the multilayer LC device of the present invention can exhibit excellent characteristics not found in conventional lumped constant LC devices, and by using this multilayer LC device as an LC noise filter, it can be [0041] In addition, according to the present invention, the first and second conductors 40.50 face each other with the insulating plate 32 in between. Therefore, it is possible to obtain a sufficiently large capacitance C compared to conventional multilayer LC elements, and from this point of view, it can be used as an LC noise filter with better attenuation characteristics than conventional multilayer LC elements. will be understood. [0042] Furthermore, the conductive nitrides (44, 54) of this example are arranged three-dimensionally as shown in FIG. 4, for example. At this time, taking the first conductive element 44-1 as an example, this conductive element 44-1 faces the second conductive element 54-1 via the insulating plate 32-2. Not only does it form a capacitance, but also a capacitance is formed between it and the second conductive element 54-3 located below it. In this way, each conductive element 44 forms a capacitance with the second conductive element 54 located above and below it, so that a sufficiently large capacitance is formed between the two within a limited space. Further, in order to further increase the capacitance C of this LC element, it is preferable to provide unevenness on the surface of the insulating plate 32 by etching or the like, as shown in FIG. Conductive elements 44 and 52 are placed on the surface of the insulating plate 32 formed in this way.
By coating the double-groove conductive element 44.54
will face each other over a wide area. As a result, an LC element of the same size has a larger capacitance C.
It becomes possible to obtain. [0044] As explained above, according to the present invention, it is possible to obtain an LC element in which the capacitance C is formed in a distributed constant manner, and the capacitance C can be adjusted as necessary without increasing the size of the element itself. can be set to a large value, making it possible to exhibit excellent characteristics not found in conventional stacked LC elements. [0045] In particular, when the present invention is applied to a noise filter, excellent attenuation characteristics can be exhibited over a wide band, and a superior noise removal effect can be obtained compared to conventional lumped constant type LC elements. [0046] Furthermore, the laminated LC element of this example can be used as a normal mode type LC noise filter or a common mode type LC noise filter. [0047] That is, the stacked LC element of this example has a terminal 52a as shown in FIG. 3(a). By grounding either of 52b, it can be used as a normal mode type LC noise filter in which L and C are formed in a distributed constant manner. [0048] Furthermore, as shown in FIG. 3(b), the multilayer 5LC element of the example can be obtained by using the terminals 52a and 52b connected to both ends of the second conductor 50 as input/output terminals without grounding them. It can also be used as a four-terminal common mode type LC noise filter in which capacitance is formed between both groove electric bodies in a distributed constant manner. [0049] FIG. 2 shows an example in which the stacked LC element of this example is formed as a three-terminal normal mode noise filter. [0050] In this case, the insulating plate 32 and interlayer insulating sheet 34 shown in FIG. 1 are laminated and fixed to form the laminate 30. Thereafter, the input terminals 42a, 42a formed on the front and back sides of the laminate 30 are connected and coated with a conductive material so that they function as one terminal. Similarly, input/output terminal 42b
, 42b are also coated with a conductive material so as to function as one terminal. Furthermore, the terminals 52a and 52b are similarly covered with a conductive material (in this embodiment, the end of the second conductor 50 and one terminal 52b are connected so that only one end of the second conductor 50 is grounded). For this purpose, the through holes 33.
35). [00513 As a result, two input/output terminals 4 are formed on the outer peripheral surface of the laminate 30.
2a, 42b, and one ground terminal 52 are formed as a three-terminal type noise filter. Moreover, since this noise filter is formed as an SMD type (surface mount device) element, its handling becomes extremely easy. [0052] Furthermore, in the first embodiment, the case where through holes 33 and 35 were used to connect each part of the circuit was explained as an example. However, the present invention is not limited to this. For example, as shown in FIG. 6, a conductive cap 33a, instead of the through hole 33.
35a may be used, or a conductive pattern formed by conductive plating, printing or painting of a conductive pattern, etc. may be used. Furthermore, any combination of through holes 33, 35, conductive caps 33a35a, conductive patterns such as plating, etc. may be used. [0053] When using the conductive caps 33a and 35a, conductive patterns 46 and 56 are formed to cover the portions of the insulating plate 32 and the interlayer insulating sheet 34 into which the conductive caps 33a and 35a are fitted. It is preferable to reduce the contact resistance. [0054] In addition, in the above embodiment, the terminals 42a, 42b, and 52 are coated over the entire outer peripheral surface of the laminate 30 as shown in FIG. 2, but the terminal pattern can be changed as needed. can be formed into For example, as shown in FIG.
b, 52 may be coated. Further, as shown in FIG. 8, one end of the laminate may be covered with input/output terminals 42a and 42b, and the other end may be covered with a grounding terminal 52. [0055] Furthermore, in the above embodiment, the stacked LC element of the present invention was
The present invention is not limited to the case where the force ξ is formed as a D type element. For example, as shown in FIG. 9, the terminals 42a, 42b, and 52 may be formed as a discrete type element with a pin structure. You can also do that. In addition, in the same figure (a) to (d), pin structure terminals 42a, 4
An example of the procedure for attaching 2b and 52 is shown. [0056] Furthermore, in the embodiment shown in FIG. 1, since both surfaces of the insulating plate 32 are coated with the first and second conductive Nilemene) 44.54, the interlayers 36-2, 36- of each insulating plate 32 are formed. 3.
It was necessary to interpose an interlayer insulating sheet 34 between... However, by providing these first and second conductive elements 44,54 only on one side of each insulating plate 32,
Laminated body 30 without using the interlayer insulation sheet 34
can also be formed. [0057] For example, as shown in FIG.
．． Conductive element 44-1.44 on 32-6
-2.44-3 is coated and insulating plate 32-332-5
A second conductive element 54-1.54-2 is coated on the surface of each conductive element 44.
54 are completely insulated from each other via the insulating plate 32, so there is no need to interpose an insulating sheet or the like between the two.
A laminate 30 can be formed. [0059] In particular, in this case, the pattern of the first conductive element 44 is made the same shape, and the pattern of the second conductive element 5 is
4-1.54-2 can have the same shape. For this purpose, a large number of insulating plates 32 having the same shape and coated with conductive nilemens) 44 and 54 are prepared, and each insulating plate 3
An LC element can be formed by stacking the two layers in different directions. This makes it possible to increase the standardization of parts and reduce costs. [0060] Furthermore, in the embodiment shown in FIG. 10, the case where the surface of one insulating plate 32 is coated with one of the first conductive element 44 and the second conductive element 54 was explained as an example. However, as shown in FIG. 11, for example, both the first and second conductive elements 44, 54 may be formed on the same insulating plate 32. [0061] In this case, these insulating plates 32-1, 32-2...
32-5 may be laminated and fixed to form a laminate 30 shown in FIG. 12. As a result, for example, the second conductive metal plate 54-1 is connected to the insulating plate 32-2. It faces the first conductive element 44-1, 44-3 via the insulating plate 32-3, and a capacitance is formed between the two. [0062] By forming in this way, the interlayer insulating sheet 34 becomes unnecessary, as in the case of the embodiment shown in FIG. 10 above. Moreover, since it is possible to use the laminate 32 covered with conductive elements 44 and 54 having the same pattern, it is possible to increase the commonality of parts and reduce the cost thereof. [0063] Furthermore, the conductive pattern of the present invention is not limited to that shown in FIGS. When increasing the number of laminates 32-1.32-2.32-3.32- as shown in FIG.
A first conductive element 44 is coated on one side of the insulating plate 32, and each of the first conductive elements 44 connects one layer to the other through a through hole (not shown) made in the insulating plate 32. The layers are electrically connected so that they circulate continuously. [0064] At the same time, each insulating plate 32-1.32-2.32-3
．． The first conductive element 44 is placed on the back side of 32-4.
A second conductive element (not shown) facing oppositely is coated, and this second conductive element 54 is similarly connected from one layer to another through a through hole (not shown). Connect electrically so that it rotates. [0065] This increases the number of turns of the first and second conductors 40.50 coated within the laminate 30, resulting in a laminate type LC with large inductance and capacitance C.
element can be obtained. [0066] At this time, the patterns of the first and second conductors 40, 50 can be set arbitrarily, and for example, instead of the pattern shown in FIG. 13, a pattern as shown in FIGS. . [0067] In FIGS. 13 to 15, the conductive elements are electrically connected in the order of the numbers attached to their ends. [0068] Furthermore, when ceramics are used as the insulating plate 32 as in this embodiment, the insulating plate 32 can be formed by firing a green sheet. That is, an unfired highly flexible thin plate (referred to as a green sheet) containing a dielectric raw material, a sintering aid, a binder, etc. is created. This green sheet is used for the insulation board 32,
Two types are prepared: one for the insulation sheet 34 and one for the insulation sheet 34. and,
On this green sheet, conductive patterns as shown in FIG. 1, for example, are printed, and through holes and the like are formed in necessary locations. Then, these are stacked one after another according to the stacking order shown in FIG. 1, and a plurality of sheets without printed internal electrodes are stacked on both sides for insulation and reinforcement. This laminated sheet is integrally molded under constant temperature, humidity, and pressure.
The monolithic material is cut into raw chips. Furthermore, this raw chip is fired at a predetermined temperature, and a conductive pattern is applied to the outer surface of the fired chip where the terminals are exposed, as shown in FIG. 2, and baked at a high temperature. In this way, the multilayer LC element of this example can be formed using the manufacturing method of multilayer ceramic chip capacitors. [0069] Embodiment of Plan A Next, a second preferred embodiment of the stacked LC element of the present invention will be described. [0070] The laminated LC device of the above embodiment used an insulating plate as an insulating layer, but this embodiment is characterized by using an insulating thin film or an insulating thick film as an insulating layer. [0071] This makes it possible to form a laminated LC element using the film forming technique. [0072] FIG. 16 shows a preferred manufacturing process for this laminated LC element using the thin film forming technique. An example is shown. [0073] In the LC element of the example, first, as shown in FIG.
At the same time, the surface of the substrate 100 is coated with a first conductive double layer 44-1 continuous from the auxiliary terminal portion 42a' in a substantially L-shape. [0074] Next, as shown in FIG. 16(b), an insulating thin film 200-1 is formed on the surface of the insulating substrate 100 so that the end portions of the first conductive elements 44 are exposed. [0075] Next, as shown in FIG. 16(c), a first conductive double layer 44-2 electrically connected to the first conductive double layer 44-1 is formed to cover the first conductive double layer 44-2. At the same time, the auxiliary terminal portion 52a extends from the back side to the side surface of the insulating substrate 100.
At the same time, on the insulating thin film 200-1,
A second conductive double layer 54-1 that is continuous from the auxiliary terminal portion 52a and faces the first conductive double layer 44-1 through an insulating thin film 200-1 is formed to cover the second conductive double layer 54-1 in a substantially U-shape. . [0076] Next, as shown in FIG. 16(d), each conductive element) 4
4-2. Insulating thin film 200 so that the end of 54-1 is exposed.
-2 is coated. Next, as shown in FIG. 16(e), on this insulating thin film 200-2,
-1. A first conductive element 44-3 and a second conductive element 54-2 are formed so as to face each other through an insulating thin film 200-2. [0077] Such a thin film forming step and an element forming step,
The process is repeated as shown in FIGS. 1.6(f) to 1.6(1) to form a laminate 30. [0078] At this time, in the step of FIG.
An auxiliary terminal portion 42b' continuing from -5 is coated. [0079] Then, in the final step shown in FIG. 16(m), the auxiliary terminal portions 42a, 42 are formed at one end of the laminate 3o.
b', a terminal 42a electrically connected to 52a,
42b and 52 are coated. [0080] Thus, according to this embodiment, it is possible to obtain a three-terminal LC element having a distributed constant type equator circuit consisting of L and C as shown in FIG. Therefore, by using the LC element of this example as a noise filter, for example, it is possible to exhibit good attenuation characteristics over a wide band. [008]Also, in this embodiment, the case where the terminal 52a is provided only on one end side of the second conductor 50 and is used as a ground terminal has been described as an example, but the present invention is not limited to this. Terminals may be provided at both ends of 50 to form a four-terminal type LC element. In this case, each terminal of the first and second conductors 40 and 50 is used as an input/output terminal, and is used as a common mode LC noise filter with a capacitance formed in a distributed manner between each conductor. be able to. [0082] Furthermore, the patterns of the first and second conductors 40, 50 and the pattern of the insulating thin film 200 are not limited to these, and may be formed as a pattern as shown in FIG. 17, for example. Note that (a) to (m) of the same figure sequentially show the manufacturing process of the LC element in this case. [0083] Note that the stacked LC element of this example can be easily formed using various thin film forming techniques, such as vapor deposition, sputtering, ion blasting, and vapor growth. [0084] For example, when forming the stacked LC element of this example using a sputtering method, a plurality of vacuum chambers partitioned by gates are prepared, and argon gas is sealed in each vacuum chamber. . Then, a target formed using a base material corresponding to the material of the insulating thin film 200 and the conductive elements 44 and 54 is provided in each vacuum chamber. Each target is positioned to face the substrate 100 in each chamber. A mask for specifying a pattern is provided between the target and the substrate 100. [0085] A negative DC voltage is applied to the target via a negative electrode, and a ground electrode is connected to the substrate 100. Then, by applying a high frequency voltage between the negative electrode and the ground electrode, the target is bombarded with positively ionized gas and releases its atoms or molecules, which are sputtered toward the substrate 100 to form a thin film. It adheres to the shape. The sputter pattern at this time is determined by the mask pattern. [0086] Therefore, a vacuum chamber corresponding to the thin film forming process for coating the insulating thin film 200 on the substrate 100 and a chamber for the element forming process for coating the conductive thin film 200 are provided. By repeating the forming process and the element forming process alternately, the laminated LC element of the example can be easily formed. [0087] Note that the laminated LC element of the present invention formed using such a thin film molding technique can be made smaller and lighter than that of the first embodiment. [0088] A third preferred embodiment of the present invention is shown in Figures 18 and 19. [0089] The feature of this embodiment is that the first and second conductors 40 and 50 are coated between the layers of the insulating thin film 200, as in each of the above embodiments, and the second conductor 50 and the insulating thin film 200 are coated. The third conductor 60 is coated with the third conductor 60 facing each other through the conductor. [0090] Thereby, as shown in FIG. 19, the first and third conductors 40.50 function as coils having predetermined inductances L1 and L3. Furthermore, the first and second
A capacitance C1 is formed in a distributed manner between the conductors 40.50, and a capacitance C3 is formed in a distributed manner between the second and third conductors 50.60. [0091] Therefore, the terminal 52a of the second conductor 50 is grounded, and the terminals 42a, 42b, 62 of the first and third conductors 40°60 are grounded.
By using a and 62b as input/output terminals, it can be used as a common mode LC noise filter. [0092] FIG. 18 shows an example of the manufacturing process of such a common mode LC noise filter in order. [0093] First, as shown in FIG. 18(a), the auxiliary terminal portions 42a and 62a are formed to cover the substrate 100 from the back side to the side surface, and the first conductive element 44-1 and the first conductive element 44-1 are formed on the surface of the substrate 100. 3 conductive element 64-1
Form a coating. [0094] Next, as shown in FIG. 18(b), an insulating thin film 200-1 is formed on the surface of the substrate 100 so that the ends of the first and second conductive thin films 44-164-1 are exposed. 1 to form a coating. [0095] Next, as shown in FIG. 18(c), the auxiliary terminal portion 52a is formed to cover the substrate 100 from the back side to the side surface, and the substrate 10 is further formed so as to be continuous with the auxiliary terminal 52a.
The second conductive Niremen) 54-1 is formed on the surface of the conductive film 54-1. This second conductive element 44-1 is connected to the first conductive element 44-1 via an insulating thin film 200-1.
Place it opposite to 1. [0096] Next, as shown in FIG. 18(d), each conductive element 4
4-1.54-1.64-1, the surface of the substrate 100 is coated with an insulating thin film 200-2, and as shown in FIG. 18(e), the first. 2nd and 3rd conductive membranes) 44-2.54-2.64-2 are coated. At this time, the second conductive element) 54
-2 is coated so as to face the first conductive element 44-1 through insulating thin films 200-2, 200-2, and the third conductive element 64-2 is coated with the insulating thin film 200-2.
-2, and is coated so as to face the second conductive element 54-1. [0097] Next, as shown in FIG. 18(f), each conductive element 4
4-2.54-2.64-2 is coated with an insulating thin film 200-3 so that the ends thereof are exposed, and the insulating thin film 200-3 shown in FIG.
) as shown in each conductive element 44-3.54-3.
64-3 is coated. At this time, the first conductive element 44-3 is formed to face the third conductive element 64-2 via the insulating thin film 200-3, and the second conductive element 54-3 is , insulating thin film 200-3
The third conductive element 64-3 is coated so as to face the first conductive element 44-2 through the conductive element 44-2.
54 through the insulating thin film 200-3
-2 is coated so as to face it. [0098] Then, as shown in FIG. 18(f), the ends of each conductive element 44-3, 54-3°64-3 are exposed.
An insulating thin film 200-4 is formed on the substrate 100 to cover it. [0099] Such a thin film forming step and an element forming step,
The process is repeated as shown in FIGS. 18(i) to 18(0), and finally, as shown in FIG. 18(p), an insulating thin film 200-8 is formed to cover the entire upper surface of the conductive element 64. [0100] Note that in each step of (k) and (0) in the same figure, the substrate 10
44-7.
Terminal auxiliary part 42b'62b connected to the end of 64-7
' is coated. [0101] Then, in the step shown in FIG. 18(p), the substrate 100
Terminal auxiliary parts 42a42b', 52a, 52b'
, 62a' and 62b' are covered with a conductive cap. As a result, Figure 18 (q
), the first conductor 40 (7) terminals 42a, 42
b, a terminal 52a of the second conductor 50, and terminals 62a and 62b of the third conductor 60 are formed. Further, instead of the conductive cap, a predetermined conductive pattern may be formed by, for example, plating, printing, baking, etc., or a combination of these conductive caps may be used. [0102] Therefore, as shown in FIG. 19, the terminal 52a of the second conductor 50 is grounded, and the third conductor 40.60 (7
) By using the terminals 42a, 42b, 62a, and 62b as input/output terminals, it can be used as a common mode LC filter in which a capacitance C is formed between each conductor 40, 50, and 60 in a distributed constant manner. [0103] Note that the patterns of the insulating thin film 200 and the conductive layers 44 and 54 formed on the substrate 100 can be arbitrarily set as necessary. [0104] Further, in this embodiment, an LC filter of the type shown in FIG. 19 was formed using thin film molding technology, but the present invention is not limited to this, and the LC filter of the type shown in FIG. It is also possible to use an insulating plate 30 instead of the insulating thin film 200 as shown in FIG. [0105] In this example, the five-terminal type LC element shown in FIG. It can be connected and used. Also, for example, by connecting the first and third conductors 40.60 in series, it is possible to reduce the capacitance by connecting the first and third conductors 40.
It can also be used as a C element. [0106] Rai± Implementation Story In each of the above embodiments, the first. Each second and third conductor 40
, 50.60 are configured to circulate in a coil shape with the same diameter,
The present invention is not limited to this, but it is also possible to form an LC element by changing the coil diameter as necessary. [0107] FIG. 20 shows an example of the LC element formed in this manner, and the LC element of the example includes the first and second conductors 40 .
50, insulating thin film 200-1, 200-2, 200-3
... 200-6 are coated so as to face each other with an insulating thin film 200 in between, forming a three-terminal normal mode type LC filter. [0108] In this example, the first and second conductors 40.50 are connected continuously from one insulating layer to the next while gradually decreasing the coil diameter of the conductive elements 44 and 54. It's circling. [0109] Thereby, the LC element of the example can have a resonance characteristic different from that of each of the examples described above. Moreover,
The attenuation characteristics are excellent over a wide band, although the attenuation pattern is slightly different from those of the above embodiments. [01101 Also, contrary to the embodiment, by forming the first and second conductors 40, 50 so that the coil diameters gradually increase, the inductance L of each conductor gradually increases. Thereby, it can be used as a noise filter that can remove noise while effectively suppressing ringing.

Note that in this example, the 1st. Although the second conductor 40, 50 and the insulating thin film 200 have been described using a thin film forming technique as an example, the present invention is not limited thereto. The present invention can also be applied to a case where the insulating plate 32 is used. [0112] Also, in this embodiment, the first. Although the LC element was constructed using the second conductor 40.50, the first conductor 40.50 was used as needed. It goes without saying that the invention is also applicable to LC elements constructed using the second and third conductors 40, 50, and 60. [0113] Furthermore, in this embodiment, the first. The present invention is not limited to this, and the present invention is not limited to this, and the force ξ described by taking as an example the case where the coil diameter of the second conductor 40.50 is changed to shift the resonance point of the LC element. Niremen) 44.54
The resonance point can also be shifted by changing the opposing width (area) of the two. [0114] Embodiment FIG. 24 shows a fifth preferred embodiment of the present invention. Note that the same reference numerals are given to the members corresponding to those in each of the above embodiments, and the explanation thereof will be omitted. [0115] The LC element of this example is formed as a normal mode type LC noise filter as shown in FIG. 24(a). [0116] The feature of this embodiment is that the second
The conductor 50 is divided into a plurality of parts and each divided section is grounded to form divided ground conductors 50-1.50-2.50-3. Each of these divided ground conductors 50-1.50-2.50
-3 is connected at its negative end to the ground terminal 52a. [0117] The LC noise filter formed in this manner has a small self-inductance L of each of the divided ground conductors 501.50-2.50-3, so that the self-inductance L of each of the divided ground conductors 501.50-2. The formed capacitance can be used as it is as the capacitance of the LC filter. [0118] Upon further investigation, the inventor found that the position of the ground conductor 50-1.50-2゜50-3 on the first conductor 50 functioning as an inductor should be opposed to the noise filter. found that it has a large effect on the attenuation characteristics of As in the embodiment, by arranging the divided ground conductors 50-1 and 50-3 located at both ends close to the input/output terminals of the first conductor 40 in terms of the electrical circuit, excellent attenuation characteristics can be achieved. I confirmed that I can get it. [0119] In addition, consideration was given to how to set the grounding position of each divided grounding conductor 50-1.50-2.50-3. As a result, it is preferable that the divided ground conductor 50-1 located near one input/output terminal 42a in terms of electric circuit be grounded at a position close to this input/output terminal 42a in terms of electric circuit, and It has been confirmed that the grounding conductors 50-2 and 50-3 are preferably grounded at positions close to the other input/output terminal 46b in terms of the electrical circuit. [0120] By doing so, the LC noise filter of this example functions as a normal mode type filter with good attenuation characteristics. [0121] Furthermore, as shown in FIG. 24(b), in an LC element in which the first and third conductors 40.60 function as inductor conductors and the second conductor 50 functions as a capacitor conductor, this By similarly dividing and grounding the second conductor 50, it functions as a filter with good attenuation characteristics. [0122] Examples other than soil Note that the present invention is not limited to the above examples,
Various modifications are possible within the scope of the invention. [0123] For example, in each of the above embodiments, the first. Second. third conductor 4
0.50.60, for example, an insulating plate 30. Although the description has been made by taking as an example a case where a coating is formed on the substrate 100 or a coating is formed on the insulating thin film 200, the present invention is not limited to this. Second. third conductive emene)
An insulating plate 30, a substrate 100, which has been punched into a shape of 44, 54, 64 and sintered. The attachment may be fixed on the insulating thin film 200. [0124] Next, as the insulating plate 30, barium titanate (BaTi
A process of attaching and laminating copper plates stamped to constitute conductive elements on the insulating plate 30 using the following will be briefly described. [0125] In this case, first, barium titanate in the shape of a rectangular thin plate is
The insulating plate 30 is formed by firing in an air atmosphere at a temperature of 1250° C. to 1350° C. for about 2 hours. [0126] Next, this insulating plate 30 and a copper plate punched into a predetermined conductive pattern are laminated, for example, as shown in FIG. 10, and this laminate is sandwiched between both sides with a predetermined pressure. Then, this laminate is fired in a predetermined neutral atmosphere (reducing atmosphere) at a temperature below the melting point of copper and at a temperature below 1100°C. [0127] In this, the neutral atmosphere includes nitrogen containing 2 to 1
It is preferable to set an atmosphere doped with 100 pp of oxygen. The reason why the temperature is set at 1100° C. or lower is that if barium titanate is fired at a temperature of 1100° C. or higher, the barium titanate will become a semiconductor due to reaction. In the example, 950 to 10
The laminate is fired at a temperature of 00°C for a predetermined period of time. [0128] At this time, the insulating plate 3 formed of barium titanate
0 and the copper plate, a low melting point compound such as pyrochlore is formed, and as a result, the copper plate and the insulating plate 30 are bonded well. [0129] The reaction at this time improves as the amount of oxygen doped into the neutral atmosphere increases, but if the amount of oxygen doped is increased, the surface of the copper plate that functions as a terminal will also be oxidized, resulting in poor solder adhesion. . For this reason, it is preferable that an LC element fired in a neutral atmosphere with a large amount of oxygen doping is then fired once again in a predetermined reducing atmosphere. [01301 By doing this, barium titanate is used as the insulating plate 30, and conductive elements 44, 54 .
Even when a punched copper plate is used as the material 64, a laminated LC element can be formed satisfactorily. [0131] Note that a thermoplastic plastic can be used instead of barium titanate, but in this case, it is estimated that it will change more with age than barium titanate and will be inferior in durability. [0132] Furthermore, in each of the above embodiments, the insulating thin film 200 is formed using a thin film forming technique, but the present invention is not limited to this, and other methods may be used as necessary, such as an insulating sheet, etc. It can also be formed using [0133] Furthermore, in each of the above embodiments, the first. second and third conductor 4
0.0, 50.60, for example, by increasing the number of laminated insulating layers (insulating plate 30 and insulating thin film 200), each of these conductors 40, 50, .
You can set a large number of turns for 60, or
The explanation has been given by taking as an example a case where a pattern as shown in No. 5 is adopted. However, the present invention is not limited to this, and may also include, for example, forming the conductive elements 44, 54, 64 using an electromagnetic material such as Fe, A magnetic material may be glued or powder coated on the 54 and 64. Further, the insulating plate 32. The ink dance L can also be increased by using a method such as mixing a magnetic material into the insulating thin film 200. [0134] In addition to this, for example, as shown in FIGS. 79 and 8, a magnetic core insertion hole 70 is provided in the center of the laminate 30,
An open magnetic path or a closed magnetic path passing around the laminate 30 through the insertion hole 70 may be formed by powder-coating the surface of the magnetic material 0 with a magnetic material or by storing it in a magnetic container. [0135] Also, if necessary, the above-mentioned No. 1. second and third conductor 4
Set the lengths of 0, 50.60 to different values, e.g.
It is also possible to form the conductor 40 longer than the second conductor 50 and set its inductance L to be larger. [0136] Furthermore, in each of the above embodiments, the first. In order to increase the value of the capacitance formed in a distributed manner between the second and third conductors 40, 50.60, the width of each conductive element 44, 54.64 is made thicker. All you have to do is expand the facing area. [0137] In addition to this, the insulating plate 3 used as an insulating layer
2. The capacitance can be increased by using a material with a high dielectric constant as the insulating thin film 200 or by increasing the number of laminated insulating layers. [0138] In addition to this, the capacitance can be increased by, for example, reducing the thickness of each of the insulating layers, or by adopting an electrolytic capacitor system and making the conductor have a porous structure. [0139] In the LC element of the present invention, for example, when the second conductor 50 is grounded and used as a normal mode filter, the second conductor 40. By forming the width of the conductive element 54 of the second conductor 50 to be larger than the width of each conductive element 44.
The conductive element 54 of the first. It functions as a shield for the third conductive layer (44.64), and can effectively prevent leakage of magnetic flux between each layer and the occurrence of short circuit phenomena. [01401 In addition, in each of the above embodiments, the insulating plate 32 and the insulating thin film 200 used as the insulating layer are formed using an insulating material such as ceramics or plastic. By using an electromagnetic wave absorbing heating element as a material, the performance as a noise filter in a high frequency band can be improved. [0141] Furthermore, in each of the above embodiments, the case where the multilayer LC element of the present invention is used as a filter, sometimes as a noise filter, has been described as an example, but the present invention is not limited to this, and may be used for other purposes, such as It can be used as various filters, varistors, etc. [0142] Furthermore, in each of the above embodiments, the case where the conductors face each other with an insulating layer in between is explained as an example, but even if these conductors do not completely face each other, there is a distribution of capacitance between them. As long as they are formed in a constant manner, there may be a shift in their opposing positions. [0143] Further, in each of the above embodiments, the case where a thin film formation technique is used is explained as an example, but the LC element of the present invention may be formed using a thick film formation technique if necessary. [0144]

【Effect of the invention】

As explained above, according to the present invention, a laminate is formed by laminating a plurality of insulating layers, and the first conductor is continuously provided between the insulating layers from one layer to another. The second conductor is rotated around the insulating layer so that it functions as a coil with a predetermined number of turns, and the second conductor faces the first conductor with the insulating layer interposed therebetween. By adopting a novel configuration in which the conductor continuously circulates through the insulating layer, a sufficiently large capacitance can be formed between the first and second conductors facing each other with an insulating layer interposed between them, resulting in a small size and good performance. However, an inexpensive stacked LC element can be obtained. [0145] In particular, according to the present invention, it is estimated that capacitance is formed in a distributed constant manner between the first and second conductors via the insulating layer, and as a result, the conventional lumped constant noise filter It can be used as an LC noise filter with excellent attenuation characteristics that can reliably attenuate and remove various types of noise that enters the filter. [0146] Further, according to the present invention, by using both the first and second conductors as current-carrying conductors, it can be used as a common mode noise filter, and by grounding the second conductor, Another advantage is that it can be used as a normal mode noise filter. [0147] Furthermore, as described in claim 2, by using a third conductor, the second conductor is grounded, and by using the first and third conductors as current-carrying conductors, another type It can be used as a common mode noise filter. [0148] Further, according to the invention set forth in claim 16, the insulating layer and the conductor can be formed on the substrate by film forming technology. Therefore, for example, by combining the present invention with semiconductor manufacturing technology, when forming an IC on a wafer, it is also possible to form a stacked LC element at the same time. Another advantage is that it can be incorporated, for example, as an LC filter, to form an IC with a built-in LC filter.

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view of a preferred embodiment of a stacked LC device of the present invention.

FIG. 2 is an explanatory perspective view of the stacked LC element shown in FIG. 1 in an assembled state.

FIGS. 3(a) and 3(b) are equivalent circuit diagrams of the LC element of the example.

[Figure 4] FIG. 3 is an explanatory diagram of the three-dimensional arrangement of each conductive element.

FIG. 5 is an explanatory diagram of a case where the effective coverage area of the conductive element is increased by providing irregularities on the substrate surface and forming a conductive element coating thereon.

6 is an exploded perspective view of a modification of the embodiment shown in FIG. 1. FIG. [FIG. 71] This is an explanatory diagram showing a modification of the terminal positions provided in the stacked LC element of the SMD type.

FIG. 8 is an explanatory diagram showing a modification of the terminal positions provided in an SMD type stacked LC element. FIGS. 9A to 9D are explanatory diagrams showing an example of a laminated LC element formed as a discrete type.

FIG. 10 is an exploded perspective view showing an example of a laminated type 1, C element formed by coating one type of conductive element on one insulating plate.

FIG. 111 is an exploded perspective explanatory view showing an example of a laminated LC element formed by covering two types of conductive elements on the same surface of one insulating plate. 12 is a perspective explanatory view showing an example of an assembled state of the stacked LC element shown in FIG. 11. FIG.

FIG. 13 is an explanatory diagram of a laminated LC element formed by laminating a plurality of insulating plates coated with a plurality of patterns of conductive elements.

FIG. 14 is an explanatory diagram of a laminated LC element formed by laminating a plurality of insulating plates coated with a plurality of patterns of conductive elements.

FIG. 15 is an explanatory diagram of a laminated LC element formed by laminating a plurality of insulating plates coated with a plurality of patterns of conductive elements.

FIGS. 16(a) to 16(m) are explanatory diagrams showing the manufacturing process of a stacked LC element formed by coating a conductive element and an insulating thin film on a substrate using a thin film forming technique.

[Figure 17
] (a) to (m) are explanatory diagrams of modified examples of the stacked LC element shown in FIG. 16.

FIG. 18 (a) to (q) are the first. FIG. 7 is an explanatory diagram showing an example of a manufacturing process of a stacked LC element formed using second and third conductors.

[Figure 19] 19 is an equivalent circuit diagram of the LC element shown in FIG. 18. FIG.

FIG. 20 is an explanatory diagram showing an example of the manufacturing process of a stacked LC element formed so that the coil diameters of first and second conductors change.

FIG. 21 is an explanatory diagram showing an example of a conventional general LC noise filter.

FIGS. 22(a) to 22(f) are explanatory diagrams showing an example of the manufacturing process of a conventional stacked LC element.

[Figure 23] 23 is an equivalent circuit diagram of the LC element shown in FIG. 22. FIG.

FIGS. 24(a) and 24(b) are equivalent circuit diagrams of a fourth preferred embodiment of the present invention.

[Explanation of symbols]

30 Laminated body 32 Insulating board 34 Interlayer insulation sheet 36 Interlayer 40 First conductor 42 Input/output terminal 44 First conductive element 50 Second conductor 52 Ground terminal 54 Second conductive element 60 Third conductor 62 Input/output terminal 64 Third conductive element 70 Magnetic core insertion hole 100 board 200 Insulating thin film

【Document name】

[Figure 1] drawing

[Figure 2]

[Figure 3] (b)

[Figure 4]

[Figure 5]

[Figure 6]

[Figure 101 [Figure 11]

[Figure 12]

[Figure 13] μ)

[Figure 17]

[Figure 18]

[Figure 20]

[Figure 21]

[Figure 22]

[Figure 23] 2c

[Figure 24] (b)

Claims (16)

[Claims] Claims: 1. A laminate in which a plurality of insulating layers are laminated, and a first conductive element that continuously circulates from one layer to another between the insulating layers, and has a predetermined number of turns. A second conductor that continuously circulates between the first conductor forming the coil and the insulating layer from one layer to the other layer and faces the first conductive element with the insulating layer interposed therebetween. a second conductor forming a capacitance between the conductive element and the first conductor. 2. In claim 1, the second conductor is formed as a capacitor conductor provided with a ground terminal, and the first conductor is formed as an inductor conductor provided with input/output terminals at both ends thereof. A multilayer LC element characterized in that it is used as a normal mode LC noise filter. 3. According to claim 1, the first and second conductors are formed as inductor conductors having input/output terminals provided at both ends thereof, and are used as a common mode LC noise filter. Stacked LC element. 4. In claim 1, a third electrically conductive element is provided between the insulating layers, the third electrically conductive element continuously circulating from one layer to the other, and facing the second electrically conductive element with an insulating layer interposed therebetween. conductive elements,
a third conductor forming a capacitance between the second conductor and the second conductor;
the second conductor is formed as a capacitor conductor provided with a ground terminal, and the first and third conductors are formed as inductor conductors provided with input/output terminals at both ends thereof. A stacked LC characterized by
element. 5. A laminated LC element according to claim 1, wherein the laminated body is made by laminating a plurality of insulating plates as insulating layers. 6. In claim 5, the insulating plate is provided with a first conductive element and a second conductive element facing each other on both sides thereof, each insulating plate having an interlayer insulating layer interposed therebetween. A laminated LC element characterized by being laminated. 7. In any one of claims 1 to 4, the laminate includes a first insulating plate provided with a first conductive element on its surface, and a second conductive element provided on its surface. second
an insulating plate, and the first and second insulators are alternately stacked so that the first conductive element and the second conductive element face each other. element. 8. In any one of claims 1 to 7, the first and second conductive elements provided between the insulating layers are the first and second conductive elements provided between the other layers. A laminated LC element characterized in that it is electrically connected to an element via a through hole formed in a conductive cap, a conductive plating layer, or an insulating layer. 9. In any one of claims 1 to 7, the first, second and third conductive elements provided between the insulating layers are the same as the first, second and third conductive elements provided between the other layers. and a third conductive element through a through hole formed in a conductive cap, a conductive plating layer, or an insulating layer. 10. In any one of claims 1 to 4, in the laminate, insulating films provided with exposed portions of interlayer elements are laminated as insulating layers, and the first and second conductive elements are A stacked LC device, characterized in that it is connected to first and second conductive elements between the next layers through exposed parts. 11. In claim 1, the second
A third conductive element is provided opposite to the conductive element through an insulating layer, and includes a third conductor forming a capacitance between the conductive element and the second conductor, and the laminate includes an exposed interlayer element. an insulating film provided with a portion is laminated as an insulating layer, and the first, second, and third conductive elements connect the first, second, and third conductive elements between the next layer through the exposed portion. connected to the element, the second conductor is formed as a capacitor conductor provided with a ground terminal, and the first and third conductors are formed as inductor conductors provided with input/output terminals at both ends thereof, A multilayer LC element characterized by being used as a common mode LC noise filter. 12. In any one of claims 1 to 11, fine irregularities are formed on the surface of the insulating layer, and the first and second conductors are coated on the surface of the insulating layer provided with the irregularities. A laminated LC element characterized by being formed. 13. The laminated LC element according to claim 1, wherein the second conductor is divided and grounded. 14. The laminated LC according to claim 1, wherein the first conductor is formed so as to circulate while changing a coil diameter from one layer to another layer. element. (15) The stacked LC according to any one of claims 1 to 14.
An electronic device characterized by using an element. 16. A film lamination step of sequentially laminating a plurality of insulating film layers on a substrate, each time each of the insulating film layers is laminated,
At least one of the first conductive element and the second conductive element to be connected between the layers is coated so as to continuously circulate from one layer to the other layer, and a predetermined number of turns of the first conductor and An element forming step of forming a second conductor having a predetermined number of turns is repeated alternately, and in the element forming step, the first conductive element and the second conductive element are opposed to each other through an insulating film layer. 1. A method for manufacturing a laminated LC device, characterized in that the device is coated so as to face the device.