JPH04206559A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To improve the effective utilization efficiency of a lead frame material and to make possible the cost reduction of a semiconductor device by a method wherein part pieces coupled with a section bar are respectively left between outer leads and these part pieces are used to use as a heat sink to the semiconductor device. CONSTITUTION:Part pieces 5 coupled with a section bar 4 are respectively left at regions between the bar 4 and inner leads 2, while heat sink part pieces 6 coupled with the bar 4 are respectively left between outer leads 3. A part 7 shown by broken lines is resin-sealed, the part pieces 5 are buried in and when the parts of the leads 3 are cut to separate into devices, each device main body 7 and the heat sink part pieces 6 of the device adjacent to the main body 7 are formed into an integral structure. The part pieces 6 may be directly used as a heat sink or another heat dissipation piece 8 is mounted to these part pieces 6 and a heat sink may by constituted. There is no need to provide a part for exclusive use for the heat sink and the effective utilization of a lead frame material can be improved.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for manufacturing a semiconductor device in which outer leads are assembled using a lead frame in which the outer leads are not interdigitated, and in particular, a method for manufacturing a semiconductor device in which the outer leads are assembled using a lead frame in which the outer leads are not cut and removed during conventional manufacturing. The present invention relates to a method for effectively utilizing members between outer leads.

[Prior Art] FIG. 4 is a plan view showing an example of a conventional lead frame for a single in-line package.

In the figure, l is a tab, 2 is an inner lead, 3 is an outer lead, and 4 is a section bar.

FIG. 5 is a plan view showing a state in which the lead frame shown in FIG. 4 is sealed with resin, and 7 is a resin main body.

Conventionally, in order to make effective use of lead frame materials, lead frames have generally been designed to have a small space between adjacent devices, and have been designed to be as small as possible within the limits of assembly.

Furthermore, lead frames for dual-in packages have been designed to be interdigitated, where adjacent devices share the space between outer leads.

However, depending on the type or structure of the package, it may be difficult to implement the above-mentioned interdigitization, and the single in-line package shown in FIG. 4 is a typical example.

In such lead frames, the outer lead connections are not effectively utilized, resulting in loss of lead frame material.

[Problems to be Solved by the Invention] Conventionally, in lead frames in which it is difficult to interdigitate outer leads, the area between the outer leads is not effectively utilized, resulting in loss of lead frame material.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for effectively utilizing the members between the outer leads.

[Means to solve the problem]

The present invention uses a lead frame in which it is difficult to interdigitate the outer leads by leaving a part connected to the section par between the outer leads, whereas previously all members in this area were cut and removed during production. This method is characterized by providing a heat sink to the semiconductor device.

[For production]

Conventionally, when installing a heat sink, the lead frame had a dedicated section for the heat sink.
According to the above method, there is no need to provide a dedicated section for the heat sink, and the pitch between lead frame products can be reduced, increasing the effective utilization of lead frame materials.

[Example] FIGS. 1(a) and (b), FIGS. 2(a) and (b), and FIG. 3 are plan views showing the method of the present invention.

In the figure, 2. 3. 4. 7 indicates the same or equivalent to the same reference numerals in FIG. 4 and FIG.
The embedded piece 6 left between the outer leads 3 is a heat sink piece 8 left between the outer leads 3 to provide a heat sink.
is a heat dissipation piece added to the outside.

As shown in FIGS. 1(a) and 1(b), a piece 5 connected to the section par 4 to be embedded in the resin body 7 is left in the area between the section par 4 and the inner lead 2.

FIG. 1(a) shows an example in which the piece 5 and the tab 1 are in a conductive state.
Figure (b) shows an example in which the piece 5 and the tab 1 are electrically insulated.

On the other hand, as shown in FIGS. 2(a) and 2(b), the heat sink piece 6 connected to the section par 4 is left between the outer leads 3.

Figure 2(a) shows an example in which the heat sink piece 6 is left in the area between all the outer leads 3, and Figure 2 (0:1) shows an example in which the heat sink piece 6 is left only in the area between the outer leads 3 at both ends. Here is an example.

Then, the parts shown by broken lines in FIGS. 1(a) and (g)), that is, the parts shown by 7 in FIGS. is embedded in the resin main body 7 and the outer lead 3 portion is cut to separate each device, so that the resin main body 7 of each device and the heat sink part 6 of the adjacent device become integrated.

This heat sink piece 6 may directly constitute a heat sink, or as shown in FIG. 3, another heat sink piece 8 may be attached to the heat sink piece 6 to constitute a heat sink.

Note that the size, shape, etc. of the heat sink piece 6 depend on the type of lead frame, depending on the effective use of the material, heat dissipation effect,
Determine by considering workability, etc.

〔Effect of the invention〕

As explained above, according to the present invention, there is an effect that the lead frame material can be more effectively utilized and the cost can be reduced.

[Brief explanation of the drawing]

Figures 1 (a), (b), 2 (a), (b), and 3 are plan views showing the method of the present invention, and Figure 4 is an example of a conventional lead frame for a single in-line package. FIG. 5 is a plan view showing the lead frame shown in FIG. 4 sealed with resin. DESCRIPTION OF SYMBOLS 1... Tab, 2... Inner lead, 3... Outer lead, 4... Section par, 5... Embedded piece, 6... Heat sink piece, 7... Resin body, 8... Heat dissipation piece. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Claims] In a method of manufacturing a semiconductor device in which the outer leads are assembled using a lead frame in which the outer leads are not interdigitated, the lead frame has a section between the outer leads, in which all members in the region are conventionally cut and removed during manufacturing. 1. A method of manufacturing a semiconductor device, comprising leaving a piece connected to a bar and using the piece to provide a heat sink for the semiconductor device.