JPH0420264U - - Google Patents
Info
- Publication number
- JPH0420264U JPH0420264U JP6246390U JP6246390U JPH0420264U JP H0420264 U JPH0420264 U JP H0420264U JP 6246390 U JP6246390 U JP 6246390U JP 6246390 U JP6246390 U JP 6246390U JP H0420264 U JPH0420264 U JP H0420264U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- circuit board
- printed circuit
- soldering
- foil circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims 2
Description
第１図は本考案のプリント基板装置の概要を説
明するための一部省略平面図、第２図は同要部一
部断面側面図、第３図は同装置に補修を加えた状
態を示す要部平面図、第４図は従来例を示す一省
略平面図である。
１……プリント基板、２……第１の銅箔回路、
３……第２の銅箔回路、５……他の銅箔回路、６
……チツプ部品、７……第３のハンダ付ランド、
２１，３１，５１……第１のハンダ付ランド、２
２，３２，５２……第２のハンダ付ランド。
Fig. 1 is a partially omitted plan view for explaining the outline of the printed circuit board device of the present invention, Fig. 2 is a partially sectional side view of the same main part, and Fig. 3 shows the same device in a repaired state. FIG. 4 is a partially omitted plan view showing a conventional example. 1... Printed circuit board, 2... First copper foil circuit,
3... Second copper foil circuit, 5... Other copper foil circuit, 6
...Chip parts, 7...Third soldering land,
21, 31, 51...first soldering land, 2
2, 32, 52...Second soldering land.
Claims (1)
数の銅箔回路を備えたプリント基板であつて、前
記複数の銅箔回路の全ての中間部に前記ハンダ付
ランドとは別に他のハンダ付ランドを少なくとも
一箇所形成して成ることを特徴とするプリント基
板装置。 (2) 前記複数の銅箔回路のなかの一つの銅箔回
路の一端部と、前記複数の銅箔回路のなかの他の
一つの銅箔回路の一端部とを近接対向せしめ、同
それぞれの端部とチツプ部品とをハンダを付接続
して成る請求項(1)記載のプリント基板装置。[Claims for Utility Model Registration] (1) A printed circuit board having solder lands at both ends and a plurality of independent copper foil circuits, wherein the solder A printed circuit board device characterized in that at least one other soldering land is formed in addition to the soldering land. (2) one end of one copper foil circuit among the plurality of copper foil circuits and one end of another one of the plurality of copper foil circuits are brought close to face each other; 2. The printed circuit board device according to claim 1, wherein the end portion and the chip component are connected by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6246390U JPH0420264U (en) | 1990-06-13 | 1990-06-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6246390U JPH0420264U (en) | 1990-06-13 | 1990-06-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0420264U true JPH0420264U (en) | 1992-02-20 |
Family
ID=31591634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6246390U Pending JPH0420264U (en) | 1990-06-13 | 1990-06-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0420264U (en) |
-
1990
- 1990-06-13 JP JP6246390U patent/JPH0420264U/ja active Pending
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