JPH0420245U - - Google Patents

Info

Publication number
JPH0420245U
JPH0420245U JP6253290U JP6253290U JPH0420245U JP H0420245 U JPH0420245 U JP H0420245U JP 6253290 U JP6253290 U JP 6253290U JP 6253290 U JP6253290 U JP 6253290U JP H0420245 U JPH0420245 U JP H0420245U
Authority
JP
Japan
Prior art keywords
mounting plate
semiconductor
legs
flat part
upper flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6253290U
Other languages
English (en)
Other versions
JP2507773Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6253290U priority Critical patent/JP2507773Y2/ja
Publication of JPH0420245U publication Critical patent/JPH0420245U/ja
Application granted granted Critical
Publication of JP2507773Y2 publication Critical patent/JP2507773Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【図面の簡単な説明】
第１図は本考案半導体用取付板の側面図、第２
図は同平面図、第３図は同側面図、第４図は他の
実施例を示す側面図、第５図は従来の半導体用取
付板の側面図である。 １……取付板、６……開口部、５……放熱フイ
ン、２０……半導体、３……脚部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 略〓字形に形成した取付板の両側脚部に開口部
    を形成し、前記取付板の上部平坦部の上面に複数
    の放熱フインを立設し、上部平坦部の下面で前記
    両側脚部に囲まれるように半導体を取付けたこと
    を特徴とする半導体用取付板。
JP6253290U 1990-06-12 1990-06-12 半導体取付装置 Expired - Fee Related JP2507773Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6253290U JP2507773Y2 (ja) 1990-06-12 1990-06-12 半導体取付装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6253290U JP2507773Y2 (ja) 1990-06-12 1990-06-12 半導体取付装置

Publications (2)

Publication Number Publication Date
JPH0420245U true JPH0420245U (ja) 1992-02-20
JP2507773Y2 JP2507773Y2 (ja) 1996-08-21

Family

ID=31591768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6253290U Expired - Fee Related JP2507773Y2 (ja) 1990-06-12 1990-06-12 半導体取付装置

Country Status (1)

Country Link
JP (1) JP2507773Y2 (ja)

Also Published As

Publication number Publication date
JP2507773Y2 (ja) 1996-08-21

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees