JPH0420245U - - Google Patents
Info
- Publication number
- JPH0420245U JPH0420245U JP6253290U JP6253290U JPH0420245U JP H0420245 U JPH0420245 U JP H0420245U JP 6253290 U JP6253290 U JP 6253290U JP 6253290 U JP6253290 U JP 6253290U JP H0420245 U JPH0420245 U JP H0420245U
- Authority
- JP
- Japan
- Prior art keywords
- mounting plate
- semiconductor
- legs
- flat part
- upper flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 2
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第1図は本考案半導体用取付板の側面図、第2
図は同平面図、第3図は同側面図、第4図は他の
実施例を示す側面図、第5図は従来の半導体用取
付板の側面図である。 1……取付板、6……開口部、5……放熱フイ
ン、20……半導体、3……脚部。
図は同平面図、第3図は同側面図、第4図は他の
実施例を示す側面図、第5図は従来の半導体用取
付板の側面図である。 1……取付板、6……開口部、5……放熱フイ
ン、20……半導体、3……脚部。
Claims (1)
- 略〓字形に形成した取付板の両側脚部に開口部
を形成し、前記取付板の上部平坦部の上面に複数
の放熱フインを立設し、上部平坦部の下面で前記
両側脚部に囲まれるように半導体を取付けたこと
を特徴とする半導体用取付板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6253290U JP2507773Y2 (ja) | 1990-06-12 | 1990-06-12 | 半導体取付装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6253290U JP2507773Y2 (ja) | 1990-06-12 | 1990-06-12 | 半導体取付装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0420245U true JPH0420245U (ja) | 1992-02-20 |
JP2507773Y2 JP2507773Y2 (ja) | 1996-08-21 |
Family
ID=31591768
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6253290U Expired - Fee Related JP2507773Y2 (ja) | 1990-06-12 | 1990-06-12 | 半導体取付装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2507773Y2 (ja) |
-
1990
- 1990-06-12 JP JP6253290U patent/JP2507773Y2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2507773Y2 (ja) | 1996-08-21 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |