JPH0419803Y2 - - Google Patents

Info

Publication number

JPH0419803Y2

JPH0419803Y2 JP1482383U JP1482383U JPH0419803Y2 JP H0419803 Y2 JPH0419803 Y2 JP H0419803Y2 JP 1482383 U JP1482383 U JP 1482383U JP 1482383 U JP1482383 U JP 1482383U JP H0419803 Y2 JPH0419803 Y2 JP H0419803Y2

Authority

JP

Japan

Prior art keywords

annular portion

axis

electronic component

insulating seal

lead wire

Prior art date

1983-02-02

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
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• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 18
• 229910000679 solder Inorganic materials 0.000 claims description 17
• 230000001154 acute effect Effects 0.000 claims description 3
• 238000007598 dipping method Methods 0.000 claims description 2
• 238000004804 winding Methods 0.000 claims 2
• 230000002093 peripheral effect Effects 0.000 claims 1
• 229920005989 resin Polymers 0.000 description 10
• 239000011347 resin Substances 0.000 description 10
• 239000004020 conductor Substances 0.000 description 5
• 229910052710 silicon Inorganic materials 0.000 description 5
• 239000010703 silicon Substances 0.000 description 5
• XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
• 239000000853 adhesive Substances 0.000 description 2
• 230000001070 adhesive effect Effects 0.000 description 2
• 238000004519 manufacturing process Methods 0.000 description 2
• 238000004806 packaging method and process Methods 0.000 description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
• 238000013459 approach Methods 0.000 description 1
• 238000005452 bending Methods 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 239000003822 epoxy resin Substances 0.000 description 1
• 238000012986 modification Methods 0.000 description 1
• 230000004048 modification Effects 0.000 description 1
• 229920000647 polyepoxide Polymers 0.000 description 1
• 238000005096 rolling process Methods 0.000 description 1
• 238000007789 sealing Methods 0.000 description 1
• 150000003376 silicon Chemical class 0.000 description 1
• 229910052709 silver Inorganic materials 0.000 description 1
• 239000004332 silver Substances 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1
• 239000000758 substrate Substances 0.000 description 1